Optical Transceiver Simulation Patents: Leaders & Trends 2026
- Filing has gone flat, not up. The peak year was 2018 at three filings, and the 2022 midpoint sits at just one — this is a maturing, not a growing, claim space.
- Optical elements dominate the claim language. 19 of the 21 families sit in G02B, versus five in H04B transmission and one each in G02F, G06F, H01S and H05K — simulation claims are being written as optics, not as system-level modeling.
- No assignee is currently active. Every tracked assignee, including the most-cited holders, shows zero filings in the latest year — the field has gone quiet rather than consolidated.
Top-5 share is the combined record count of the five largest assignees divided by all 21 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This dataset tracks patent families at the intersection of optical transceiver and module hardware with simulation-specific claim language — optical link simulation, photonic device modeling, signal integrity simulation and FDTD methods — filtered against IPC classes covering digital data processing, fiber optics and radio transmission. It captures how simulation and modeling claims attach to physical transceiver and co-packaged optics designs, rather than general-purpose EDA or circuit-simulation filings.
Coverage runs from 2015-01-01 through the 2026-07-31 cut-off, with 21 published records forming 21 distinct patent families. Because publication typically lags filing by around 18 months, the most recent one to two years in any trend line will look thinner than the true filing activity eventually turns out to be.
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Filing trend and technology composition
Two views of the same 21 families: when the claims were filed, and which IPC subclasses carry them.
Filing trend: flat after an early peak
Filings rose from zero in 2017 to a peak of three in 2018, then eased back toward one per year by the 2022 midpoint. The 2026 figure of one is partial and will understate final-year activity once late publications land, but the multi-year pattern before that already points to a plateau rather than expansion.
IPC composition: concentrated in optics, not systems
G02B (optical elements & systems) accounts for 19 of 21 records, dwarfing H04B transmission claims (5) and leaving G02F modulation, G06F digital processing, H01S lasers and H05K assembly with a single record each. Simulation and modeling language in this space is overwhelmingly being claimed as part of physical optical-element design rather than as standalone digital-processing or transmission-system methods.
Shares are the percentage of the 21 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Optical Transceiver Simulation and Modeling with Eureka
This page is one run against one query. Ask Eureka your own question about optical transceiver simulation and modeling and every answer comes back with the patent numbers behind it.
Try EurekaThe most-cited records, and one to read in full
US9039301B2 — Optical transceiver having enhanced EMI tolerance
An optical transceiver that attenuates the EMI radiation leaked therefrom is disclosed. The optical transceiver includes a top cover and the bottom base to form a cavity into which a TOSA, a ROSA, and a circuit are set. At least one of the top cover and the bottom base provides a combed structure in a rear portion of the optical transceiver, where the combed structure has a plurality of T-shaped fins to attenuate the EMI radiation.Filed by Sumitomo Electric Industries, Ltd. and published 2015-05-26, this record sits inside the same G02B-heavy cluster that dominates the whole landscape.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20100092128A1 | Optical Transceiver module | 66 |
| 2 | US20150286008A1 | Connecting structure of optical module and optical connector | 38 |
| 3 | US20130136458A1 | Optical transceiver having enhanced EMI tolerance | 11 |
| 4 | WO2014034458A1 | Structure for connecting optical module and optical connector | 8 |
| 5 | US9778420B2 | Connecting structure of optical module and optical connector | 6 |
| 6 | US20100074575A1 | Optical module and method for manufacturing the same | 6 |
| 7 | WO2019235183A1 | Optical module | 5 |
| 8 | JP2020052269A | Optical chip, optical integrated circuit and optical module | 5 |
| 9 | CN115508948A | 一种基于时域层剥离算法的多模波导布拉格光栅滤波器的设计方法 | 4 |
| 10 | JP2021124578A | Optical circuit element, optical transceiver using optical circuit element, and manufacturing method for opti… | 3 |
Citation counts inside a searched corpus favour older filings that have had more time to accumulate citations — read them as a signal of influence on the field, not of current commercial importance.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the numbers mean for a filing decision
Three read-throughs from the trend, the IPC split and the citation table.
The growth phase already happened
The dataset's peak year, 2018 at three filings, is now several years behind the midpoint value of one in 2022. A new entrant should not expect to be racing a growing field — the filing pace here has already cooled.
Claims sit on the optics, not the algorithm
With G02B carrying 19 of 21 records against a single record each in G06F and G02F, the enforceable claim language in this space is almost entirely written around physical optical elements and module structure, not around simulation software or modulation methods as such.
Influence sits with two connector patents
The two most-cited records both concern the physical connecting structure between an optical module and an optical connector, one cited 66 times and a related family cited 38 times. That concentration marks where prior art is deepest, and where a new filing is most likely to be narrowed by examiners.
No current filer to benchmark against
Every assignee tracked for recent-year momentum, from Sumitomo Electric to NEC to Panasonic, shows zero filings in the latest year. That makes this a field to search carefully before filing, not one with an obvious active competitor to watch.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to optical transceiver simulation and modeling, with the prior art for and against each one.
Assignees and where the claim gaps sit
A small set of Japanese electronics and telecom groups, plus a handful of Chinese entrants, account for the tracked families — but none of them is currently filing.
Japanese electronics and telecom groups anchor the citation table
Sumitomo Electric, NEC, NTT, Panasonic and Oki Electric all appear among tracked assignees, and Sumitomo's EMI-tolerance transceiver family is among the most-cited records in the set, yet none of these groups shows any filing in the most recent year.
Collaboration is rare and Japan-centric
The single strongest co-assignee pairing links Oki Electric Industry with a Japanese photonics research consortium, underscoring that most families in this set are filed by a single organisation rather than through joint development.
Chinese entrants sit alongside the incumbents
Qingdao Hisense Broadband Multimedia Technology, Suzhou Lianxun Instrument and Zhejiang University appear in the assignee set even as receiving-office activity remains led by the United States, Japan and China, suggesting the incumbent base is broader in geography than in recent activity.
| Assignee | Recent year | YoY |
|---|---|---|
| Marvell Asia Pte Ltd | 0 | — |
| NEC Corporation | 0 | — |
| Nippon Telegraph and Telephone Corporation (NTT) | 0 | — |
| Panasonic Corporation (Japan) | 0 | — |
| Oki Electric Industry Co., Ltd. | 0 | — |
| Sumitomo Electric Industries, Ltd. | 0 | — |
| Qingdao Hisense Broadband Multimedia Technology Co., Ltd. | 0 | — |
| Suzhou Lianxun Instrument Co., Ltd. | 0 | — |
Where to take this analysis
The dataset points to a quiet but not empty field — the next steps are about confirming freedom to operate and finding the thin branches.
Run a freedom-to-operate check on connector structures
The two highest-cited records both cover optical module-to-connector connecting structures. Any new transceiver mechanical design should be checked against this cluster before filing.
Explore in EurekaMap the G02F and G06F branches in detail
Modulation-domain and digital-processing simulation claims each have only one record in this set. That thinness could mean genuine white space or simply that claims are being filed elsewhere under different keywords — worth a targeted search.
Explore in EurekaWatch for renewed filing activity
With every tracked assignee at zero in the latest year, a single new filing from an incumbent like Sumitomo or NEC would be a meaningful signal that the field is reactivating. Set up ongoing monitoring rather than a one-time pull.
Explore in EurekaCommon questions about this landscape
The most-cited records in this landscape are US20100092128A1, an optical transceiver module patent cited 66 times, and a related family on connecting structures between optical modules and optical connectors cited 38 times. Sumitomo Electric Industries also holds a highly cited EMI-tolerance transceiver patent, US20130136458A1. These citation counts reflect influence within the searched corpus and favour older filings that have had more time to accumulate citations, so they should be read as historical significance rather than current market dominance. No assignee in the tracked set shows filing activity in the most recent year, so influence here is inherited rather than actively defended.
Filing activity peaked in 2018 at three families and had eased to one by the 2022 midpoint, indicating a plateau rather than growth. The 2026 figure is partial because publication typically lags actual filing by roughly 18 months, so the final tally for the most recent one to two years will likely rise somewhat once late publications appear. Even allowing for that lag, the multi-year trend before 2026 does not show the acceleration you would expect from an expanding technology area.
Almost all of the records, 19 of 21, fall under IPC subclass G02B, covering optical elements and systems, with a further five touching H04B transmission claims. Only single records exist in G02F modulation and control, G06F digital data processing, H01S lasers, and H05K printed circuit assembly. In practice this means most enforceable claim language describes physical optical hardware and module structure rather than simulation algorithms or software methods as a standalone invention.
The thinnest branches by IPC are G02F (optical modulation and control) and G06F (digital data processing), each with a single tracked record, compared with 19 in the core G02B optical-elements cluster. That gap suggests modulation-domain and digital-processing-specific simulation methods, such as signal integrity simulation for co-packaged optics or FDTD modeling tied to digital processing claims, are under-claimed relative to the physical-hardware space. A search should still confirm whether that thinness reflects genuine open space or filings classified under different keywords outside this search string.
Based on recent-year momentum, none of the tracked assignees, including Sumitomo Electric, NEC, NTT, Panasonic and Oki Electric, show any filings in the latest year covered by this dataset. The assignee base also includes newer entrants such as Qingdao Hisense Broadband Multimedia Technology, Suzhou Lianxun Instrument and Zhejiang University, but the same zero-activity pattern applies across the tracked set. This makes the field one to monitor for renewed activity rather than one with a clear current leader to benchmark against.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.