https://www.patsnap.com/resources/blog/rd-blog/overlay-metrology-and-edge-placement-error-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Semiconductor Metrology
Overlay Metrology and Edge Placement Error Patents
  • 92.9% concentration. The top five assignees together hold 2,643 of the 2,845 records in scope — a field where five companies have effectively closed the door on new entrants.
  • A -55% swing that isn't a slowdown. Filings fell from 227 in 2021 to 102 in 2024, but publication lag means 2025 and 2026 numbers are still filling in — treat the recent drop with caution, not as proof the field is cooling.
  • Photolithography dominates the claim map. G03F covers 76.1% of all 2,845 records, meaning most inventive effort is being spent on lithography-adjacent claims rather than the broader materials-analysis or data-processing classes.
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2,845
Published Records
93%
Top-5 Share of All Records
-55%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (227 records) with 2024 (102) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 2,845 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Field Overview

What overlay metrology and edge placement error patenting actually covers

Overlay metrology measures how well one patterned layer aligns to the layer beneath it; edge placement error extends that concern to the cumulative misalignment across an entire multi-patterning stack. As feature pitches shrink and multi-patterning schemes stack more layers, the tolerance for misalignment shrinks faster than the measurement tools improve, which is why target design, correction per exposure and grating asymmetry compensation show up repeatedly across the claim sets in this dataset.

The 2,845 records in scope span 2015 through the 2026 cut-off, concentrated overwhelmingly in photolithography and dimensional-measurement classifications rather than general semiconductor device art. That composition signals a field where the contested ground is measurement technique and correction algorithm, not the device structures being measured.

Filing activity and technology composition, 2015–2026
  1. 1ASML NETHERLANDS BV1,612
  2. 2KLA CORP805
  3. 3KLA TENCOR TECHNOLOGY CORP163
  4. 4INTERNATIONAL BUSINESS MACHINE CORPORATION34
  5. 5TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD29
  6. 6NANOMETRICS INC26
  7. 7D2S INC15
  8. 8INTEL CORP15
  9. 9ASML HLDG NV15
  10. 10INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)15
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Overlay Metrology and Edge Placement Error covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trend and technology composition

Two views of the same 2,845 records: how filing activity has moved year over year, and which IPC subclasses carry the claim volume.

Filing trend, 2017–2026

Filings peaked at 285 in 2018 and ran near that level through the early 2020s before falling from 227 in 2021 to 102 in 2024, a -55% move over that three-year span. 2025 and 2026 figures are still incomplete because publication typically lags filing by around 18 months, so the apparent decline in the newest years should not be read as the field slowing.

Filing trend, 2017–202607515022530026420172852018201920202021202220232024202522026Most recent year is partial — publication lag means later filings are not yet visible.

Technology composition by IPC subclass

G03F (photolithography and photomechanics) appears in 76.1% of all 2,845 records, far ahead of G01N material analysis (21.6%) and G01B dimensional measurement (20.0%). H01L, G06F and G06T each cover meaningful minorities, reflecting the data-processing and correction-algorithm layer that sits on top of the physical measurement. Because records can carry multiple IPC classes, these shares sum to well over 100% and should be read individually against the 2,845-record total, not against each other.

Technology composition by IPC subclassG03F · Photolithography & photomechan…2,16676.1%G01N · Material analysis & testing61521.6%G01B · Measuring length & dimensions56920.0%H01L · Semiconductor devices49417.4%G06F · Electric digital data processi…39914.0%G06T · Image data processing & genera…2298.0%H10W1806.3%H10P1103.9%Other68624.1%

Shares are the percentage of the 2,845 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Overlay Metrology and Edge Placement Error covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited records in this landscape

Representative Filing
US11333982B22022-05-17

US11333982B2 — Scaling metric for quantifying metrology sensitivity to process variation

KLA CORPORATION

An overlay metrology system includes a controller that receives, from an overlay metrology tool, overlay measurements on multiple sets of overlay targets across a range of values of a measurement parameter, where a given set of targets includes designs drawn from two or more overlay target types. The controller determines scaling metric values based on the standard deviation of the overlay measurements within each set, then determines how those scaling metric values vary across the target designs to flag process-sensitivity.Filed by KLA Corporation, granted 2022-05-17.

US11333982B2 — patent drawing 1US11333982B2 — patent drawing 2
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Highest-citation records in scope
#Publication no.Patent titleCitations
1US20120044470A1Substrate for Use in Metrology, Metrology Method and Device Manufacturing Method1,613
2US20060066855A1Method and apparatus for angular-resolved spectroscopic lithography characterization1,451
3EP1628164A2Method and apparatus for angular-resolved spectroscopic lithography characterisation1,332
4US20060033921A1Method and apparatus for angular-resolved spectroscopic lithography characterization969
5US20160161863A1Metrology method, computer product and system951
6US20160370717A1Recipe selection based on inter-recipe consistency777
7US8797554B2Determining a structural parameter and correcting an asymmetry property755
8US20130258310A1Metrology Method and Apparatus, Lithographic System and Device Manufacturing Method663
9US20130271740A1Lithographic Apparatus, Substrate and Device Manufacturing Method626
10WO2013178422A1Metrology method and apparatus, substrate, lithographic system and device manufacturing method540

Citation counts are measured within this searched corpus and favour older filings; treat them as a signal of influence on later filers, not as a ranking of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Overlay Metrology and Edge Placement Error covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three findings that change where a new filer should and should not spend claim-drafting effort.

Concentration
92.9%
of 2,845 records held by top 5

The top of the field is closed, not just crowded

With 2,643 of 2,845 records held by five assignees, and the leader alone holding 1,612, this is not a fragmented field with room at the margins — it is a small number of holders with layered, continuation-heavy portfolios. A new entrant filing broad overlay-measurement claims will read directly onto prior art from the leader.

Denominator: all 2,845 records in scope.
Trend
-55%
2021 → 2024 filing change

The recent dip is a lag artefact, not a retreat

Filings dropped from 227 in 2021 to 102 in 2024. Given the roughly 18-month gap between filing and publication, 2025 and 2026 figures in this dataset are structurally incomplete, and a similar pattern held in earlier partial years before catching up in later data pulls.

Figures from the filing trend, 2021 and 2024 only.
Composition
76.1%
of records classed G03F

Claim pressure sits on lithography technique, not device art

G03F photolithography classification appears on more than three-quarters of the 2,845 records, well ahead of G01N and G01B measurement classes. That skew shows most inventive activity target designs, correction schemes and exposure-time compensation, not the underlying device structures.

IPC shares are computed against the 2,845-record total; a record may carry multiple classes.
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to overlay metrology and edge placement error, with the prior art for and against each one.

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Cross-filing between assignees
AssigneeCo-assigneeShared families
ASML Netherlands B.V.ASML Holding N.V.12
ASML Netherlands B.V.University of Amsterdam10
ASML Netherlands B.V.Netherlands Organisation for Scientific Research (foundation)10
ASML Netherlands B.V.STICHTING VU10
KANDEL DANIELLEVINSKI VLADIMIR9
KLA-Tencor Technology CorporationKANDEL DANIEL8
KLA-Tencor Technology CorporationADEL MICHAEL E8
KANDEL DANIELADEL MICHAEL E8

Ten co-assignee pairs appear in the dataset. The strongest links sit within a single corporate family and its university and research-institute collaborators, which suggests joint filings here reflect internal group structure and sponsored research rather than open industry consortia.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Overlay Metrology and Edge Placement Error covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Who's Filing

The assignee landscape

The ranking returned by the data endpoint covers 100 companies, counted in records — it is the full ranking, not a top-50 or top-100 cut. Activity is dominated by a handful of equipment and foundry names, with everyone else filing in single digits by comparison.

Leader
1,612
records

One holder dominates the record count

The leading assignee alone accounts for 1,612 of the 2,845 records in scope, more than half the entire dataset by itself. Recent-year momentum for this assignee shows only 2 filings in the latest year, a -95% year-on-year change that is consistent with publication lag rather than an actual pullback.

Momentum figures reflect the latest, still-incomplete filing year.
Mid-field
29
records, fifth place

A steep drop-off after the top few

Fifth place holds 29 records and tenth place holds 15 — both far below the leader's 1,612. That gap illustrates how thin the field gets past the top handful of names, even though the ranking runs to 100 companies.

Counts are in records, per the assignee ranking.
Momentum
0
latest-year filings, several major holders

Several established holders show no latest-year activity

Multiple mid-tier assignees in this dataset show zero filings in the latest tracked year. Given the 18-month publication lag, this is more likely incomplete data catching up than a genuine exit from the field, and should be read alongside the multi-year trend rather than in isolation.

Momentum figures are year-on-year and cover the most recent, partial year only.
🔍
Under-claimed sub-areas worth checking before filing
These branches show thinner claim density relative to the core lithography and dimensional-measurement classes.
Machine-learning-driven grating asymmetry correctionCross-layer edge placement error budgetingIn-die sampling plan optimisationProcess-induced overlay shift modellingNon-lithographic on-product overlay proxies
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
ASML Netherlands B.V.2-95%
KLA Corporation0-100%
KLA-Tencor Technology Corporation0—
International Business Machines Corporation (IBM)0—
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)0—
Nanometrics Incorporated0—
Intel Corporation0—
Interuniversity Microelectronics Centre (imec)0—
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Overlay Metrology and Edge Placement Error covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The landscape points to a field with a closed top tier and specific open branches. The next step is narrowing to the claims that matter for a specific product or process.

Map a target design against the leader's claim set

With one assignee holding 1,612 of 2,845 records, any new overlay-target or correction-per-exposure filing should be checked directly against that portfolio before drafting.

Run a claim comparison in Eureka

Track the under-claimed branches

Sub-areas like grating asymmetry correction and in-die sampling optimisation show thinner density than the core G03F claim space and are worth monitoring for freedom-to-operate.

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Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Overlay Metrology and Edge Placement Error covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Overlay Metrology and Edge Placement Error covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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