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Run your analysis now →Filing growth compares 2021 (227 records) with 2024 (102) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 2,845 records in scope (CR5), not by the ranked leaders only.
Overlay metrology measures how well one patterned layer aligns to the layer beneath it; edge placement error extends that concern to the cumulative misalignment across an entire multi-patterning stack. As feature pitches shrink and multi-patterning schemes stack more layers, the tolerance for misalignment shrinks faster than the measurement tools improve, which is why target design, correction per exposure and grating asymmetry compensation show up repeatedly across the claim sets in this dataset.
The 2,845 records in scope span 2015 through the 2026 cut-off, concentrated overwhelmingly in photolithography and dimensional-measurement classifications rather than general semiconductor device art. That composition signals a field where the contested ground is measurement technique and correction algorithm, not the device structures being measured.
Two views of the same 2,845 records: how filing activity has moved year over year, and which IPC subclasses carry the claim volume.
Filings peaked at 285 in 2018 and ran near that level through the early 2020s before falling from 227 in 2021 to 102 in 2024, a -55% move over that three-year span. 2025 and 2026 figures are still incomplete because publication typically lags filing by around 18 months, so the apparent decline in the newest years should not be read as the field slowing.
G03F (photolithography and photomechanics) appears in 76.1% of all 2,845 records, far ahead of G01N material analysis (21.6%) and G01B dimensional measurement (20.0%). H01L, G06F and G06T each cover meaningful minorities, reflecting the data-processing and correction-algorithm layer that sits on top of the physical measurement. Because records can carry multiple IPC classes, these shares sum to well over 100% and should be read individually against the 2,845-record total, not against each other.
Shares are the percentage of the 2,845 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about overlay metrology and edge placement error and every answer comes back with the patent numbers behind it.
Try EurekaAn overlay metrology system includes a controller that receives, from an overlay metrology tool, overlay measurements on multiple sets of overlay targets across a range of values of a measurement parameter, where a given set of targets includes designs drawn from two or more overlay target types. The controller determines scaling metric values based on the standard deviation of the overlay measurements within each set, then determines how those scaling metric values vary across the target designs to flag process-sensitivity.Filed by KLA Corporation, granted 2022-05-17.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20120044470A1 | Substrate for Use in Metrology, Metrology Method and Device Manufacturing Method | 1,613 |
| 2 | US20060066855A1 | Method and apparatus for angular-resolved spectroscopic lithography characterization | 1,451 |
| 3 | EP1628164A2 | Method and apparatus for angular-resolved spectroscopic lithography characterisation | 1,332 |
| 4 | US20060033921A1 | Method and apparatus for angular-resolved spectroscopic lithography characterization | 969 |
| 5 | US20160161863A1 | Metrology method, computer product and system | 951 |
| 6 | US20160370717A1 | Recipe selection based on inter-recipe consistency | 777 |
| 7 | US8797554B2 | Determining a structural parameter and correcting an asymmetry property | 755 |
| 8 | US20130258310A1 | Metrology Method and Apparatus, Lithographic System and Device Manufacturing Method | 663 |
| 9 | US20130271740A1 | Lithographic Apparatus, Substrate and Device Manufacturing Method | 626 |
| 10 | WO2013178422A1 | Metrology method and apparatus, substrate, lithographic system and device manufacturing method | 540 |
Citation counts are measured within this searched corpus and favour older filings; treat them as a signal of influence on later filers, not as a ranking of current commercial importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three findings that change where a new filer should and should not spend claim-drafting effort.
With 2,643 of 2,845 records held by five assignees, and the leader alone holding 1,612, this is not a fragmented field with room at the margins — it is a small number of holders with layered, continuation-heavy portfolios. A new entrant filing broad overlay-measurement claims will read directly onto prior art from the leader.
Filings dropped from 227 in 2021 to 102 in 2024. Given the roughly 18-month gap between filing and publication, 2025 and 2026 figures in this dataset are structurally incomplete, and a similar pattern held in earlier partial years before catching up in later data pulls.
G03F photolithography classification appears on more than three-quarters of the 2,845 records, well ahead of G01N and G01B measurement classes. That skew shows most inventive activity target designs, correction schemes and exposure-time compensation, not the underlying device structures.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to overlay metrology and edge placement error, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| ASML Netherlands B.V. | ASML Holding N.V. | 12 |
| ASML Netherlands B.V. | University of Amsterdam | 10 |
| ASML Netherlands B.V. | Netherlands Organisation for Scientific Research (foundation) | 10 |
| ASML Netherlands B.V. | STICHTING VU | 10 |
| KANDEL DANIEL | LEVINSKI VLADIMIR | 9 |
| KLA-Tencor Technology Corporation | KANDEL DANIEL | 8 |
| KLA-Tencor Technology Corporation | ADEL MICHAEL E | 8 |
| KANDEL DANIEL | ADEL MICHAEL E | 8 |
Ten co-assignee pairs appear in the dataset. The strongest links sit within a single corporate family and its university and research-institute collaborators, which suggests joint filings here reflect internal group structure and sponsored research rather than open industry consortia.
The ranking returned by the data endpoint covers 100 companies, counted in records — it is the full ranking, not a top-50 or top-100 cut. Activity is dominated by a handful of equipment and foundry names, with everyone else filing in single digits by comparison.
The leading assignee alone accounts for 1,612 of the 2,845 records in scope, more than half the entire dataset by itself. Recent-year momentum for this assignee shows only 2 filings in the latest year, a -95% year-on-year change that is consistent with publication lag rather than an actual pullback.
Fifth place holds 29 records and tenth place holds 15 — both far below the leader's 1,612. That gap illustrates how thin the field gets past the top handful of names, even though the ranking runs to 100 companies.
Multiple mid-tier assignees in this dataset show zero filings in the latest tracked year. Given the 18-month publication lag, this is more likely incomplete data catching up than a genuine exit from the field, and should be read alongside the multi-year trend rather than in isolation.
| Assignee | Recent year | YoY |
|---|---|---|
| ASML Netherlands B.V. | 2 | -95% |
| KLA Corporation | 0 | -100% |
| KLA-Tencor Technology Corporation | 0 | — |
| International Business Machines Corporation (IBM) | 0 | — |
| Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | 0 | — |
| Nanometrics Incorporated | 0 | — |
| Intel Corporation | 0 | — |
| Interuniversity Microelectronics Centre (imec) | 0 | — |
The landscape points to a field with a closed top tier and specific open branches. The next step is narrowing to the claims that matter for a specific product or process.
With one assignee holding 1,612 of 2,845 records, any new overlay-target or correction-per-exposure filing should be checked directly against that portfolio before drafting.
Run a claim comparison in EurekaSub-areas like grating asymmetry correction and in-die sampling optimisation show thinner density than the core G03F claim space and are worth monitoring for freedom-to-operate.
Set up white space monitoring in EurekaThe dataset shows one assignee far ahead of the rest, holding 1,612 of the 2,845 records in scope — more than half the entire field by record count. The next four largest holders combined bring the top five to 2,643 records, or 92.9% of all records in scope. Past that top tier, holdings drop sharply: fifth place holds 29 records and tenth place holds 15, even though the full ranking runs to 100 companies.
Filings did fall from 227 in 2021 to 102 in 2024, a -55% change over that span, but this should not be read as the field cooling. Patent publication typically lags filing by around 18 months, so the 2025 and 2026 figures in any dataset cut off in mid-2026 are structurally incomplete. The safer read is that 2024 is the most recent complete year, and it still shows over a hundred filings.
Edge placement error is the cumulative positional deviation of a feature edge relative to its intended location, aggregating overlay error, critical-dimension variation and other process shifts across a multi-patterning stack. It matters more than overlay alone once a design uses several lithography and etch steps to build one layer, because small overlay errors compound. Patent filers treat the two together because a target design or correction scheme aimed at overlay control usually also affects the edge placement error budget downstream.
The technology composition data shows heavy concentration in G03F photolithography classification, at 76.1% of the 2,845 records, with lighter coverage in adjacent branches like machine-learning-driven grating asymmetry correction and in-die sampling plan optimisation. These branches sit in the same functional area but have not accumulated the same claim density, meaning a well-drafted filing there is less likely to read directly onto existing dominant portfolios. Any freedom-to-operate check should still start with the leading assignee's holdings before relying on white space alone.
At 92.9% of all 2,845 records held by the top five assignees, this field is unusually concentrated even by semiconductor-equipment standards, where a handful of tool makers and foundries typically dominate. The concentration is driven by the capital and metrology-hardware intensity of the technology: building and validating an overlay measurement tool requires equipment infrastructure that only a few companies have, which limits the pool of realistic filers. That structure makes the leader's portfolio the practical starting point for any competitive or freedom-to-operate analysis in this space.
Go past this page: query the whole overlay metrology and edge placement error corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.
Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.
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