Panel Level Packaging Substrates Patents: Top Companies & Trends 2026
Panel Level Packaging Substrates Patents: Who Leads and Where Filing Is Heading
47.4% concentration. The top 5 of 41 ranked assignees hold 81 of 171 records in scope — just under half the field sits with a handful of filers. Annual filings rose from 11 in 2017 to a peak of 20 in 2021, then declined to 12 by 2024 — a 40% drop over that three-year span. 2025 and 2026 figures are still filling in due to publication lag and should not be read as a real decline yet.
- 1HEWLETT PACKARD DEVELOPMENT COMPANY LP25
- 2INTEL CORP18
- 3DECA TECH USA INC16
- 4PYXIS CF PTE LTD11
- 5CORNING INC11
See the full panel level packaging substrates analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Frequently asked questions
Who are the leading patent filers in panel level packaging substrates?
The assignee ranking covers 41 companies across 171 records in scope, with the leading filer holding 25 records versus 11 for the fifth-placed company and 7 for the tenth. The top 5 combined account for 47.4% of all records, and the top 10 reach 70.2%, so filing activity is concentrated among a relatively small group rather than spread evenly. That said, the ranking includes a long tail of companies with only a handful of filings each, which is typical for a packaging process technology where many integrators file defensively around narrow claims.
Is patent filing in panel level packaging substrates growing or slowing?
Filings rose through the late 2010s and peaked at 20 in 2021, then fell to 12 by 2024 — a 40% decline over that three-year span. This is a genuine slowdown over that period rather than noise. However, because publication typically lags actual filing by around 18 months, the 2025 and 2026 figures in the dataset are still incomplete and should not be read as evidence of further decline until later data catches up.
What technology areas do panel level packaging substrate patents cover?
The overwhelming majority — 94.2% of the 171 records in scope — carry an H01L semiconductor-device classification, with H10W appearing in 57.3%. Smaller but notable classes include H10P, H10B (memory device manufacture), B41J, C03C (glass and enamel compositions), H05K (printed circuits) and B81B (MEMS), each covering between roughly 3.5% and 14% of records. Because a single record can carry multiple IPC classes, these shares add up to more than 100%, and they point to where panel-level packaging intersects with adjacent hardware categories like glass carriers and MEMS integration.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Panel Level Packaging Substrates covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.