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Particleboard & Fibreboard Patents: Who Leads, Where Gaps Are 2026

Particleboard & Fibreboard Patents: Who Leads, Where Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/particleboard-and-fibreboard-manufacturing-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Wood & Panel Products
Particleboard and Fibreboard Manufacturing Patents
  • Filing peaked in 2021 at 27 records, then fell 93% to just 2 by 2024 — a sharp pullback, not a gradual slowdown. the last complete year of data
  • The top 10 of 72 ranked assignees hold 63.9% of all 227 records in scope, leaving a long tail of single- or few-filing entrants below them
  • B27N particle/fibre board classes cover just 50.2% of records, meaning half the filings sit in adhesive, polymer or laminate classes adjacent to the core board process
Get a prior-art report on your approach
227
Published Records
41%
Top-5 Share of All Records
-93%
Filing Growth 2021→2024
EP
Leading Jurisdiction

Filing growth compares 2021 (27 records) with 2024 (2) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 227 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the patent record shows

Particleboard and fibreboard manufacturing patents cluster around mat forming, hot pressing, resin dosage and the defects that come from getting those steps wrong — blistering, uneven density profiles, and thickness swelling once the board meets moisture. The 227 records in scope span 2015 through mid-2026, with the field’s classification split telling its own story: B27N board-forming claims sit alongside a heavy presence of C09J adhesive and C08G/C08L polymer chemistry classes, because the resin system and the press cycle are claimed together as often as they are claimed apart.

Filing activity rose through the late 2010s, peaked in 2021, and has fallen sharply since — publication lag means the most recent one to two years will always look thinner than they eventually turn out to be, but the drop from 2021 to 2024 is large enough to read as a real pullback in new filing rather than a reporting artefact.

Filing activity by year, 2015–2026
  1. 1CARGILL INC28
  2. 2WESSER & DUEHOLM ARKITEKT & INGENIORFA VSTEN DUEHOLM23
  3. 3HEXION INC14
  4. 4FORCE TECH14
  5. 5FORESA TECH S L U14
  6. 6ECOSYNTHETIX INC12
  7. 7RIVERWOOD INTERNATIONAL CORP12
  8. 8SANOVO BIOSECURITY AS10
  9. 9CHIMAR HELLAS9
  10. 10HEXION RESEARCH BELGIUM SA9
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Particleboard and Fibreboard Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trends and technology composition

Two views of the same 227 records: how filing activity has moved year over year, and which IPC subclasses the claims actually sit in.

A 2021 peak followed by a steep drop

Filings ran from 7 in 2017 up to a peak of 27 in 2021, then fell to 2 by 2024 — a 93% decline over that three-year span. 2025 and 2026 figures are still filling in under the usual 18-month publication lag, so they should not yet be read as a continuation of the decline.

A 2021 peak followed by a steep drop0815233072017201820192020272021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Adhesive and polymer classes rival the core board class

B27N (particle/fibre board) appears in 50.2% of records, but C09J adhesives (26.4%), C08G condensation polymers (23.8%) and C08L polymer compositions (22.5%) each cover roughly a quarter of the field — because a class can be a resin chemistry patent as easily as a forming-line patent, these shares add to well over 100% and should be read as overlap, not fragmentation.

Adhesive and polymer classes rival the core board classB27N · Particle/fibre board11450.2%C09J · Adhesives6026.4%C08G · Condensation polymers5423.8%C08L · Polymer compositions5122.5%B29C · Shaping of plastics2310.1%C08J · Polymer processing & solutions187.9%B32B · Layered products & laminates177.5%E04F · Building finishing135.7%Other7633.5%

Shares are the percentage of the 227 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Particleboard and Fibreboard Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited records in this space

Representative filing
US20090211692A12009-08-27

Method and System for Enhanced Manufacturing of Biomass-Based Products (US20090211692A1)

WESSER OG DUEHOLM ARKITEKT-OG INGENIORFIRMA V/STEN DUEHOLM

A method and device for manufacturing plates such as fibreboards, where biomass particles carrying a thermosetting binder are spread onto a forming belt to build a mat, then compressed to finished thickness in a hot press that hardens the binder. The invention adds ultrasound application to the process to improve manufacturing efficiency.Filed by Wesser & Dueholm, this record anchors the mat-forming-plus-hot-press claim structure that recurs across the dataset.

US20090211692A1 — patent drawing 1US20090211692A1 — patent drawing 2
View full filing
Highest-cited records in scope
#Publication no.Patent titleCitations
1US20030056873A1Production of high added value products from wastes147
2US5435954AMethod for forming articles of reinforced composite material117
3WO2001039946A1Production of high added value products from wastes41
4US20130190428A1Wood Composite Process Enhancement30
5US6841101B2Production of high added value products from resin-bonded waste composite wood products29
6US5635583ACatalytic composition and method for curing urea-formaldehyde resin23
7WO2016141126A1Method of making lignocellulosic composites20
8US20090326185A1Storage stable melamine-urea-formaldehyde resins and applications thereof18
9US20160257815A1Method of making lignocellulosic composites16
10US20090007931A1Method And Device For Drying A Flow Of Biomass Particles15

Citation counts inside a searched corpus favour older records; treat this as a signal of influence within the field, not of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Particleboard and Fibreboard Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Concentration, timing and classification overlap each point to a different conclusion about where new claims are likely to clear prior art.

Concentration
63.9% of 227
held by the top 10 of 72 ranked assignees

The top of the field is dense, the rest is thin

With the leader alone at 28 records and a fifth-place holder at 14, the top 10 combined account for 145 of the 227 records in scope. Below that, the ranking of 72 assignees thins out quickly into single- and few-filing entrants, which is where most freedom-to-operate work will actually need to focus.

Top 10 = 63.9% of all records in scope
Momentum
-93% (2021→2024)
peak to last complete year

A sharp pullback, not a plateau

Filing rose to a peak of 27 records in 2021 and had fallen to 2 by 2024. That is a much steeper drop than a maturing-technology slowdown would produce, and it is worth checking whether it tracks a specific resin-chemistry or wood-cost cycle rather than declining interest in board manufacturing itself.

2024 is the last year treated as complete
Classification overlap
50.2% B27N
of 227 records carry the core board class

Board claims are rarely filed alone

Only half of records sit in B27N, the dedicated particle/fibre board class; adhesive and polymer chemistry classes each cover roughly a quarter of the field independently. A claim drafted purely on the mechanical forming side, without addressing the resin system, is drafting into a smaller slice of the prior art than it might appear.

Shares overlap; a record can carry multiple classes
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to particleboard and fibreboard manufacturing, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Particleboard and Fibreboard Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the gaps sit

The ranked leaders concentrate around resin and board chemistry, while the geographic filing pattern and the thin recent-year momentum both point to a field pausing rather than one still being actively staked out.

Leader
28 records
top-ranked assignee

A single filer well ahead of the field

The leading assignee holds 28 of the 227 records in scope, noticeably ahead of the fifth-place holder at 14 and the tenth-place holder at 9 — a steep drop-off that marks this as a concentrated rather than evenly distributed field.

Leader vs. fifth place: 28 vs. 14
Co-filing
10 pairs
co-assignee relationships identified

One strong collaboration stands out

Of the 10 co-assignee pairs in the dataset, one pairing recurs at a scale well above the others, suggesting a long-running joint filing relationship rather than a one-off collaboration. The remaining pairs are much smaller and more incidental.

Strongest pair recurs well above the rest
Geography
52 EPO filings
leading receiving office

Europe leads receiving offices, the US follows closely

Europe (EPO) receives the largest share of filings at 52, with the United States at 39 and WIPO/PCT filings at 23. Canada, Austria and Australia each register in double digits, pointing to a field with meaningful but not dominant filing activity outside Europe and North America.

EPO 52 · US 39 · PCT 23
🔍
Under-claimed branches worth checking before filing
These sit adjacent to the dense core claims and show comparatively thin coverage in the current record set.
Ultrasound-assisted mat consolidationIn-line density profile correctionLow-formaldehyde resin dosage controlBlister-defect detection during hot pressingThickness-swelling mitigation coatings
Rank all filers by momentum →
Recent-year filing momentum has gone quiet across the top names
AssigneeRecent yearYoY
Cargill Inc0
WESSER & DUEHOLM ARKITEKT & INGENIORFA VSTEN DUEHOLM0
Force Technology0
FORESA TECH S L U0-100%
Riverwood International Corp0
EcoSynthetix Inc0
Hexion Inc0
Hexion Research Belgium SA0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Particleboard and Fibreboard Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this next

The dataset points to specific next steps depending on whether the goal is freedom-to-operate, competitive tracking or drafting new claims.

Check the white space chips against your own claim draft

The under-claimed branches listed above are thin in this record set, not empty — verify against full claim text before assuming clear space.

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Watch the co-filing relationship for signals

The strongest co-assignee pair in this dataset recurs at a scale well above the others; tracking its future filings may show where the underlying technology is heading next.

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Re-run the trend once 2025 data settles

Publication lag means the last one to two years of filing counts are always undercounted; revisit the 2021-2024 comparison once later years are more complete.

Set up monitoring in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Particleboard and Fibreboard Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about particleboard and fibreboard patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Particleboard and Fibreboard Manufacturing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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