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PCIe & High-Speed Interconnect Patents: Leaders & White Space 2026

PCIe & High-Speed Interconnect Patents: Leaders & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/pcie-and-high-speed-interconnect-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Computing Architecture
PCI Express and High-Speed Interconnect Patents: Who Holds the Lanes
  • Filing has cooled since its 2018 peak. 13 families that year against a flat-to-declining trend through the 2022 midpoint of 5, with the most recent year necessarily undercounted by publication lag.
  • Claim density concentrates in one IPC subclass. 247 of 253 families sit in G06F digital data processing, versus 35 in H04L transmission — the interconnect's control logic, not its physical-layer signalling, is where most claims live.
  • Co-filing clusters around a small inventor group. Only 10 co-assignee pairs exist across the corpus, and the three strongest all share one inventor, pointing to a tight internal team rather than broad industry collaboration.
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253
Published Records
47%
Top-5 Share of All Records
+33%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (3 records) with 2024 (4) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 253 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks 253 patent families published between 2015 and mid-2026 that combine PCI Express, PCIe interconnect, or high-speed serial link language in the title or abstract with claim-level detail on link training, signal integrity, lane configuration, equalization, or error correction. The IPC filter narrows further to G06F13 (digital data processing I/O), H04L25 and H04L49 (digital transmission and switching), which is why the composition below skews so heavily toward control and management logic rather than raw physical-layer transceiver design.

Filing activity peaked in 2018 and has not recovered that level since, with the 2022 midpoint sitting at roughly a third of peak volume. That flat-to-declining shape is consistent with a maturing standard where core mechanisms are settled and later filings narrow into implementation variants — a pattern worth checking against the specific claim language before assuming the field is closed.

Filing activity and technology composition, 2017–2026
  1. 1INTEL CORP68
  2. 2TAHOE RES LTD16
  3. 3INTERNATIONAL BUSINESS MACHINE CORPORATION13
  4. 4ATI TECHNOLOGIES ULC13
  5. 5QUALCOMM INC8
  6. 6NUON8
  7. 7CANON KK7
  8. 8ADVANCED MICRO DEVICES INC7
  9. 9ALTERA CORP7
  10. 10HUAWEI TECH CO LTD7
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on PCIe and High-Speed Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 253-family corpus: how filing volume has moved year over year, and how those families distribute across IPC subclasses.

Filing trend, 2017–2026

Volume rose to a peak of 13 families in 2018, fell back toward the 2022 midpoint of 5, and the final years understate true filing activity because publication typically lags filing by around 18 months.

Filing trend, 2017–20260481115102017132018201920202021202220232024202512026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

G06F accounts for 247 of 253 records — the overwhelming majority — while H04L (35), H05K (8), H03M (7), H04B (6) and smaller subclasses cover packaging, coding and general transmission aspects that ride alongside the core interconnect claims.

IPC subclass compositionG06F · Electric digital data processi…24797.6%H04L · Digital information transmissi…3513.8%H05K · Printed circuits & assemblies83.2%H03M · Coding & code conversion72.8%H04B · Transmission (general)62.4%B32B · Layered products & laminates31.2%H04J · Multiplex communication31.2%H04W · Wireless communication networks31.2%Other124.7%

Shares are the percentage of the 253 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on PCIe and High-Speed Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative filing and most-cited prior art

Representative record
US20260186984A12026-07-02

Configuring PCI express module using hardware in a memory sub-system

MICRON TECHNOLOGY, INC.

A first set of parameter values are programed to a first set of sequencer registers. A second set of parameter values are programmed to a second set of sequencer registers. In response to a detecting a triggering event, a hardware sequencer performs the following operations: transfer the first set of parameter values from the first set of sequencer registers to a first set of link training registers, transfer the second set of parameter values from the second set of sequencer registers to a second set of link training registers, and initiate one end of a communication link training with a host.Filed by Micron Technology and published 2026-07-02, this record sits at the newest edge of the dataset — a hardware sequencer that offloads link-training register programming rather than routing it through firmware, which narrows the design space for anyone building a comparable in-memory PCIe controller.

US20260186984A1 — patent drawing 1US20260186984A1 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US20060242354A1Flexible routing and addressing188
2US7457897B1PCI express-compatible controller and interface for flash memory180
3US7293129B2Flexible routing and addressing114
4US20090006710A1Virtualization of a host computer's native I/O system architecture via the internet and LANs113
5US8782321B2PCI express tunneling over a multi-protocol I/O interconnect96
6US20090049222A1PCI Express-Compatible Controller And Interface For Flash Memory96
7US7734859B2Virtualization of a host computer's native I/O system architecture via the internet and LANs96
8US20060271713A1Computing device with flexibly configurable expansion slots, and method of operation96
9US7743197B2System and method for virtualizing PCIe devices94
10US7257655B1Embedded PCI-Express implementation90

Citation counts favour older filings simply because they have had more time to accumulate citations within the searched corpus — read them as a signal of influence on later work, not as a measure of current relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on PCIe and High-Speed Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers say

Three read-throughs from the filing, jurisdiction and citation data that matter for a filing or freedom-to-operate decision.

Filing momentum
13 → 5
peak (2018) vs. 2022 midpoint

Volume has not recovered since 2018

The corpus peaks in 2018 at 13 families and sits at 5 by the 2022 midpoint, a flat-to-declining trajectory rather than a growth curve. Treat the final one or two years as undercounted given typical 18-month publication lag.

Filing trend, 2017–2026
Jurisdiction spread
169 of 253
records filed via USPTO

Filing is heavily US-centric

United States receiving-office filings account for the large majority of the corpus, with EPO, WIPO/PCT and Japan trailing well behind. A freedom-to-operate review focused only on US filings would still miss meaningful EPO and PCT coverage.

Receiving office distribution
Technology skew
247 vs. 35
G06F records vs. H04L records

Control logic dominates over physical-layer claims

Nearly all records sit in G06F rather than H04L, meaning the claim density in this corpus is concentrated in data-processing and I/O management logic — link training state machines, lane negotiation, error handling — rather than transceiver-level signal design.

IPC subclass composition
Collaboration pattern
10 pairs
co-assignee pairings in the corpus

Co-filing is narrow and inventor-driven

Only 10 co-assignee pairs appear across 253 families, and the strongest three all involve the same inventor paired with different collaborators. This looks like a small internal team filing serially rather than a broad cross-company research effort.

Co-assignee pair analysis
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Inventor collaboration is concentrated
AssigneeCo-assigneeShared families
AJANOVIC JASMINWEISSMANN ELIEZER11
AJANOVIC JASMINWAGH MAHESH11
AJANOVIC JASMINVASUDEVAN ANIL11
AJANOVIC JASMINTAMARI ERAN11
AJANOVIC JASMINSHAMIA DORON11
AJANOVIC JASMINSETHI PRASHANT11
AJANOVIC JASMINRODGERS SCOTT DION11
AJANOVIC JASMINPARDO ILAN11

AJANOVIC JASMIN appears in all three of the strongest co-assignee pairings in this corpus, each tied at 11 shared filings — a signature of one prolific inventor anchoring a small internal team rather than cross-company co-development.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on PCIe and High-Speed Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claim positions

Recent-year momentum across the leading assignees has gone flat: every one of the top names in this corpus shows zero filings in the latest year, consistent with the broader publication-lag effect rather than a sign these players have exited the space.

Assignee
0 in latest year
recent-year filings

Intel Corporation (Intel)

Anchors the corpus alongside its named inventors, with the strongest co-assignee pairings in the dataset running through a shared inventor team. Its recent-year filing count reads as zero, which is best read against the corpus-wide publication lag rather than as a pullback.

Co-assignee pairs · 11 shared filings each
Assignee
0 in latest year
recent-year filings

International Business Machines Corporation (IBM) (IBM)

Appears among the top assignees by family count in this corpus, with its filing footprint concentrated in the same G06F-heavy control-logic space that dominates the dataset overall.

Top-assignee ranking
Assignee
0 in latest year
recent-year filings

HARRIMAN DAVID J

A named-inventor entry ranking among the corpus's most active filers, reflecting how much of this landscape's ownership sits with individual inventors and small internal teams rather than large distributed R&D groups.

Top-assignee ranking
Assignee
0 in latest year
recent-year filings

ATI Technologies ULC (ATI Technologies)

Rounds out the top tier of assignees in this corpus, its presence a reminder that graphics and interconnect IP holders overlap in PCIe claim territory even outside pure CPU/chipset vendors.

Top-assignee ranking
🔍
Under-claimed sub-areas worth checking before filing
These branches show comparatively thin claim density in the current corpus relative to core link-training and lane-negotiation claims.
adaptive equalization coefficient sharing across lanesthermal-aware lane width renegotiationmulti-protocol tunneling error recoveryretimer-side signal integrity calibrationlow-power link state re-training triggers
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Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Intel Corporation0
International Business Machines Corporation (IBM)0
HARRIMAN DAVID J0
ATI Technologies ULC0
AJANOVIC JASMIN0
WEISSMANN ELIEZER0
WAGH MAHESH0
VASUDEVAN ANIL0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on PCIe and High-Speed Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this

The filing and citation patterns above point to specific next steps depending on whether the goal is freedom-to-operate, white-space filing, or competitive tracking.

Check claim scope on the newest filings

The 2026 Micron record on hardware-sequencer link training shows the field is still active at the implementation level even as aggregate volume has flattened. Newer filings deserve a full claim read before assuming the space is settled.

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Map the under-claimed branches against your own roadmap

Sub-areas like retimer-side calibration and multi-protocol tunneling error recovery show thinner claim density than core lane-negotiation logic. That gap is either an opening or a sign the approach has not been commercially proven — worth confirming which.

Explore in Eureka

Track the small inventor clusters, not just company names

Because co-filing here concentrates around a handful of named inventors, monitoring by inventor may surface new filings faster than monitoring by assignee alone.

Explore in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on PCIe and High-Speed Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about PCIe interconnect patents

Answers are grounded in the same dataset. Derived from a Patsnap search on PCIe and High-Speed Interconnect covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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