Eureka on the web
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →Filing growth compares 2021 (8 records) with 2024 (13) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 116 records in scope (CR5), not by the ranked leaders only.
Integrated modulators convert electrical signals into optical ones inside a photonic chip, and their performance — bandwidth, insertion loss, drive voltage, linearity — is the primary bottleneck between photonic integration and commercial coherent or datacom deployment. Three architectures dominate the claimed IP: the Mach-Zehnder modulator (MZM), which splits and recombines light through phase-shifted arms; the ring modulator, which exploits resonance for a smaller footprint at the cost of thermal sensitivity; and the thin-film lithium niobate (TFLN) modulator, which offers high electro-optic coefficient and low chirp on a platform that is increasingly compatible with wafer-scale processing. Each architecture maps to a distinct trade-off space, and the IPC classification reflects that: the large majority of families are anchored in G02F (optical modulation and switching), with secondary classification in G02B for waveguide and coupling structures and H04B for transmission system context.
The corpus of 116 patent families spans a decade of activity. Publication lags filing by roughly 18 months, so the apparent softening in the most recent year understates actual recent activity; that caveat noted, the plateau visible from 2022 onward is real and reflects a maturing primary claim landscape. Secondary filings — continuations, divisionals and CIPs refining claim scope rather than staking new territory — account for a meaningful share of late-period publications, which means density maps overstate how much open territory has already been claimed.
Pick a task. Every answer cites the patents behind it.
Annual family counts and IPC distribution together indicate where the field has been heavily contested and where it has not. Reading both in parallel avoids the trap of mistaking filing volume for technological breadth.
Families grew from 13 in 2017 to a peak of 17 in 2022, then declined. That trajectory is characteristic of a maturing core: the foundational MZM and ring modulator geometries attracted the heaviest filing through the late 2010s, and by the early 2020s the primary claim space was sufficiently dense that incremental filings faced steep prior-art hurdles. The most recent year's figure is understated by publication lag and should be read as a floor, not a ceiling, but the directional signal is consistent with saturation at the architecture level. Activity is shifting toward integration challenges — driver co-design, packaging, thermal stabilisation — rather than the modulator element itself.
114 of 116 families carry a G02F classification, confirming that modulator physics remains the primary anchor of claim scope. The 48 G02B co-classifications reflect waveguide routing, coupler design and mode-matching claims that are inseparable from modulator function. The 23 H04B co-classifications mark families that claim system-level features — line coding, equalization, bias control — alongside the optical element, making them structurally harder to design around because invalidating the optical claim does not dispose of the system claim. The thin tail in H01L and H01S flags a small set of families integrating the modulator with driver transistors or on-chip laser sources — an area where filing density is low and claim scope may therefore be broader.
Shares are the percentage of the 116 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about photonic integrated circuit - integrated modulator and every answer comes back with the patent numbers behind it.
Try EurekaDiscloses a silicon photonics transmitter built around a Mach-Zehnder modulator and a distributed monitoring architecture. Multiple optical couplers tap a fraction of the propagating field; corresponding photodetectors feed a monitor circuit that computes the sum and difference of their photocurrents. A modulator controller uses the differential signal to adjust the MZM bias voltage in real time, maintaining the operating point against thermal drift and fabrication offset without requiring an external reference.The bias-control loop is claimed as an integral element of the transmitter, not as a separable subsystem. Any silicon photonics MZM transmitter that uses photocurrent-difference feedback to maintain quadrature bias will need to assess freedom to operate against this family.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20170194309A1 | Photonic integrated circuit package | 111 |
| 2 | US20170194310A1 | Photonic integrated circuit package | 82 |
| 3 | US20170194308A1 | Photonic integrated circuit package | 68 |
| 4 | WO2020191217A1 | Optoelectronic computing systems | 60 |
| 5 | US20170163000A1 | Photonic Integrated Circuit Including Compact Lasers With Extended Tunability | 57 |
| 6 | US20160103382A1 | Methods and devices for photonic m-ary pulse amplitude modulation | 52 |
| 7 | US20160363835A1 | MZM linear driver for silicon photonics device characterized as two-channel wavelength combiner and locker | 42 |
| 8 | US10026723B2 | Photonic integrated circuit package | 34 |
| 9 | US20170163001A1 | Photonic Integrated Circuit Including Compact Lasers With Extended Tunability | 29 |
| 10 | US20120045163A1 | Optical circuit apparatus, method, and application | 24 |
Citation counts within a searched corpus favour older records. High citation indicates influence over subsequent prosecution and litigation, not necessarily current commercial relevance. Families are rendered with their publication numbers and assignee details in the table below.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →With 116 families across a decade, the corpus is compact enough that individual assignee strategies are legible. Citation concentration and co-assignment patterns both carry strategic information beyond simple filing counts.
The most-cited record in the corpus has attracted 111 forward citations, and the top five records account for a disproportionate share of all citations within the dataset. This concentration pattern is typical of a technology where a small number of foundational claims — on PIC packaging and optoelectronic computing integration — have shaped how subsequent applicants have drafted their own claims. High citation density around a handful of families means the prosecution history of those families is strategically important reading for anyone entering the space.
Nearly 60% of families in the corpus were filed at the USPTO, with EPO and PCT together covering most of the remainder. Only two families were filed at CNIPA despite significant Chinese manufacturing activity in silicon photonics. This asymmetry creates two distinct risks: US-filed claims have dense prior art to navigate, while the Chinese jurisdiction is comparatively open for any assignee willing to file there, particularly on TFLN and ring modulator integration approaches.
The three strongest co-assignee pairs each share exactly six families, forming a closed triangle that suggests a structured joint research agreement rather than ad-hoc collaboration. When academic institutions and commercial partners co-assign, the resulting patents often carry broader claims because the research mandate is less constrained by immediate product geometry. Competitors should treat this cluster's families as potentially blocking foundational waveguide-modulator integration claims, not merely incremental refinements.
Several significant assignees — including large semiconductor and telecoms firms — show zero filings in the most recent year, with some recording a full year-on-year decline. A filing pause can mean a technology programme has shifted to trade-secret protection, that a design generation has closed, or that the team is focused on continuations and claim narrowing rather than new priority dates. In a corpus this size, a pause by one significant assignee visibly alters the aggregate trend, so the decline should not be read as sector-wide disengagement.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to photonic integrated circuit - integrated modulator, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Dutch Research Council (NWO) | POET Technologies Inc. | 6 |
| Dutch Research Council (NWO) | Eindhoven University of Technology (TU/e) | 6 |
| POET Technologies Inc. | Eindhoven University of Technology (TU/e) | 6 |
| imec | Ghent University | 3 |
| imec | UNIV OF AEGEAN | 3 |
The NWO–Technische Universiteit Eindhoven–POET Technologies triangle is the most active co-assignment cluster in the corpus. Academic co-inventors in joint filings frequently contribute foundational method claims that are harder to design around than purely product-focused claims from a single commercial assignee. Any FTO analysis covering waveguide-integrated modulator methods should prioritise these families.
Filing volume across 116 families is distributed between a small set of recurring assignees and a longer tail of single-filing entrants. The ranking itself is rendered in the table; the strategic reading is in how different assignee types approach claim construction.
Activity is concentrated at the top of the assignee ranking, with a small number of organisations accounting for a disproportionate share of families. Below them is a long tail of assignees with one or two families each — often representing a specific product generation or a single foundational disclosure. The tail is not inconsequential: single-family assignees sometimes hold the broadest claims in a corpus because they were the first to articulate a particular integration approach.
Research institutes and universities — notably NWO and Technische Universiteit Eindhoven — appear in the top co-assignment cluster alongside commercial entities. Academic filers tend to claim methods and structures at a higher level of generality because they are not constrained by a specific product geometry. This makes their claims resilient against design-around attempts that rely on material substitution or dimensional changes.
The most recent data year shows zero new families from each of the top recurring assignees. This pause is broad enough to be a real signal: it may reflect a technology generation reaching product release and moving into trade-secret mode, or a strategic shift toward defending existing claims rather than filing new priority dates. New entrants filing now face less immediate prior-art pressure from these specific assignees in the most recent generation of claims.
| Assignee | Recent year | YoY |
|---|---|---|
| Nokia Solutions and Networks Oy | 0 | -100% |
| Infinera Corporation | 0 | — |
| Advanced Micro Foundry Pte. Ltd. | 0 | — |
| Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) | 0 | -100% |
| Dutch Research Council (NWO) | 0 | — |
| POET Technologies Inc. | 0 | — |
| Orion Corporation | 0 | — |
| Eindhoven University of Technology (TU/e) | 0 | — |
The filing plateau and geographic concentration together point to a field in transition: the core claim space is dense, but adjacent integration challenges remain comparatively open. Three strategic moves are worth considering.
US20240380492A1's photocurrent-difference bias architecture is representative of a broader pattern in the corpus: system-level integration claims that wrap a well-known optical element in a novel control scheme. Any product team implementing closed-loop MZM bias stabilisation should commission a specific FTO analysis against this family and related filings before finalising the control circuit architecture.
Analyse this family in Patsnap EurekaWith only two families at CNIPA despite substantial Chinese manufacturing capacity in silicon photonics, the Chinese national phase represents a geographic opportunity. Assignees with existing US or PCT families should audit national-phase entry deadlines; those without existing priority dates should consider whether a CNIPA first-filing strategy for TFLN or ring modulator integration is warranted.
Run a jurisdictional gap analysis in Patsnap EurekaThe presence of six families with G06N co-classifications signals early AI-modulator integration activity, but the density is low. Co-packaged optics — where the driver and modulator share a package with the switch ASIC — is similarly sparse in the corpus. Both sub-areas are technically specific enough to support broad independent claims and commercially important enough to attract licensing interest.
Explore white space in Patsnap EurekaA Mach-Zehnder modulator splits an optical signal into two arms, applies a differential phase shift via the electro-optic effect, then recombines the arms so that constructive or destructive interference encodes the data. A ring modulator instead uses a microring resonator evanescently coupled to a bus waveguide: when the drive voltage shifts the ring's resonant wavelength onto or off the bus wavelength, the signal is modulated. MZMs offer inherently broadband, chirp-manageable operation and are preferred for long-haul and high-baud-rate coherent links, while ring modulators are compact and energy-efficient, making them attractive for short-reach datacom. The trade-off is thermal sensitivity: rings must be actively stabilised, and that stabilisation challenge is one of the remaining open areas in the patent corpus.
The corpus of 116 families is distributed between a small number of recurring assignees and a longer tail of single-filing entrants. The top of the ranking is rendered in the assignee table on this page. Notably, a tight co-assignment cluster — linking a Dutch national research organisation, a technical university, and a commercial photonics firm — accounts for the densest collaboration activity, each pair sharing six co-assigned families. Several large semiconductor and telecommunications firms that filed actively through 2022 have shown zero new families in the most recent data year, which may signal a strategic shift rather than withdrawal from the technology.
Within this corpus, TFLN modulator claims appear as a subset of the broader electro-optic modulator population classified under G02F1/035. Filing density on TFLN-specific integration — particularly thermal compensation methods, electrode geometry optimisation, and heterogeneous bonding to silicon waveguide platforms — is lower than on mature silicon carrier-depletion MZM designs, suggesting meaningful white space remains. However, 'lower density' is not the same as 'clear': several foundational TFLN platform patents from outside this corpus (filed at CNIPA, for example) may still affect freedom to operate. Any entrant should run a platform-specific search before treating TFLN as open territory.
With 69 of 116 families filed at the USPTO and only 2 at CNIPA, the claim landscape is geographically skewed. A company manufacturing or selling primarily in Asia-Pacific faces a different risk profile than a US-market competitor: the dense US prior art constrains claim breadth for new USPTO filings, but the thin CNIPA presence means that a well-drafted Chinese filing on an integration approach not yet claimed there could achieve broad protection. European filers face an intermediate situation — 19 EPO families and 16 PCT families provide meaningful prior art, but EPO examination standards and prosecution practice differ enough from the USPTO that claim scope may vary substantially between jurisdictions. Geographic portfolio planning should treat these three jurisdictions as distinct rather than assuming US allowances will be mirrored elsewhere.
A plateau in family counts at the architecture level is a maturity signal, not a decline signal. It indicates that the primary claim space — broad independent claims on MZM, ring modulator, and TFLN modulator structures — is sufficiently occupied that new filers are working in a narrower window, typically refining manufacturing methods, control electronics, or system-level integration rather than the optical element itself. The G06N co-classifications (AI-assisted modulator control) and the H01L co-classifications (driver–modulator integration) are the visible edges of this shift. Publication lag also means the most recent year in the trend is understated; the true 2025 filing rate will not be fully visible until mid-2026 at the earliest. Read the plateau as a signal to focus on adjacent integration claims rather than as evidence that the field is commercially unimportant.
A closed three-party co-assignment structure — where each pair shares the same count of co-assigned families — strongly suggests a formal joint research or consortium agreement rather than ad-hoc collaboration. Co-owned patents require all owners to consent to exclusive licensing in most jurisdictions, which can complicate exclusive deals but also means the patent holder group is likely to have a coordinated licensing strategy. Academic co-assignees (NWO and Eindhoven) are typically more willing to license than vertically integrated commercial OEMs, but the presence of a commercial co-assignee (POET Technologies / POET Technologies Inc.) means any licence negotiation will involve commercial interests as well. Any company seeking a licence to or freedom to operate against this cluster's families should approach all three co-assignees.
Go past this page: query the whole photonic integrated circuit - integrated modulator corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.
Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.