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PIC Simulation Patents: Who Leads, Where the Gaps Are 2026

PIC Simulation Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/photonic-integrated-circuit-simulation-and-modeling-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Photonics & Optics
Photonic Integrated Circuit Simulation and Modeling Patents
  • 22 families total. a small, tightly-scoped corpus rather than a crowded field — filing activity peaked in 2020 and has not returned to that level since.
  • G02B dominates the composition. 17 of the records sit in optical elements & systems, with lasers (H01S) a distant second at 6 — modeling claims cluster around device geometry, not algorithms.
  • No single assignee shows recent-year momentum. every tracked assignee, including the most active filers, recorded zero filings in the latest year — a sign the field's IP is dormant rather than actively contested right now.
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22
Published Records
55%
Top-5 Share of All Records
US
Leading Jurisdiction
21
Active Filers Ranked

Top-5 share is the combined record count of the five largest assignees divided by all 22 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this patent set covers

This landscape tracks patent families at the intersection of photonic integrated circuit (PIC) design and simulation or modeling methods — FDTD solvers, mode solvers, device-level modeling and photonic circuit simulation tools — filed against optical and computational IPC classes between 2015 and mid-2026. The scope is deliberately narrow: it excludes general silicon photonics fabrication patents that do not touch simulation, and it excludes pure software patents that do not reference a photonic device context.

Twenty-two families is a small corpus by patent-landscape standards, which makes ranking noise a real risk: a single well-cited filing can look disproportionately important simply because the base rate is low. Read the trend and composition data as directional, not as a market-share statement.

Filing activity and technology composition, 2015-2026
  1. 1PHOTON DESIGN LTD3
  2. 2MASSACHUSETTS INST OF TECH3
  3. 3YALE UNIVERSITY2
  4. 4MCGILL UNIV2
  5. 5APPLE INC2
  6. 6CLARKSON UNIVERSITY2
  7. 7SAMSUNG ELECTRONICS CO LTD2
  8. 8SILTERRA MALAYSIA1
  9. 9WELLS FARGO BANK NA1
  10. 10INDIAN INST OF TECH MADRAS1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Photonic Integrated Circuit Simulation and Modeling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 22 families: how filing activity has moved year over year, and which IPC subclasses carry the claims.

Filing trend, 2017-2026

Filings rose from 2 in 2017 to a peak of 4 in 2020, dropped to 0 at the 2022 midpoint, and show 0 in the most recent year. Because publication lags filing by roughly 18 months, the last one to two years will always look thinner than they eventually turn out to be — but the flat-to-declining shape predates that lag effect.

Filing trend, 2017-2026012342201720182019420202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

G02B (optical elements & systems) accounts for 17 of the 22 records, making it the default home for simulation and modeling claims in this space. H01S (lasers), G06F (digital data processing), B82Y, F21V, G02F and H01L each appear in low single digits, suggesting simulation-specific claims are still being drafted primarily as optics claims rather than as computational-method claims.

IPC subclass compositionG02B · Optical elements & systems1777.3%H01S · Lasers & stimulated emission627.3%G06F · Electric digital data processi…313.6%B82Y · Nanotechnology applications29.1%F21V · Lighting device components29.1%G02F · Optical control & modulation29.1%H01L · Semiconductor devices29.1%

Shares are the percentage of the 22 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Photonic Integrated Circuit Simulation and Modeling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative and most-cited filings

Representative Filing
US12026445B12024-07-02

Method and apparatus for photonic circuit simulation

PHOTON DESIGN LTD

Describes a non-transitory medium storing instructions that automatically identify computational regions across a photonic integrated circuit, without requiring user input, and perform electromagnetic simulation across adjoining regions of the device.Filed by Photon Design Ltd, published 2024-07-02 as US12026445B1.

US12026445B1 — patent drawing 1US12026445B1 — patent drawing 2
View full filing
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US20050220396A1Multi-channel drop filter using photonic crystal20
2US20160341896A1Methods and systems relating to optical waveguide tapers19
3US20130188904A1Hybrid laser light sources for photonic integrated circuits19
4US20200393615A1Pixel array implemented on photonic integrated circuit (PIC)14
5US20200225401A1Integrated Freeform Optical Couplers13
6US9829629B2Methods and systems relating to optical waveguide tapers8
7WO2020180391A1Scalable integration of hybrid optoelectronic and quantum optical systems into photonic circuits4
8US11480728B2Pixel array implemented on photonic integrated circuit (PIC)3
9US20180143375A1Multi-Mode Forked Grating Coupler3
10US11378733B2Integrated freeform optical couplers2

Citation counts reflect influence within the searched corpus and skew toward older filings; they are not a measure of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Photonic Integrated Circuit Simulation and Modeling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three read-outs from the composition and citation data that matter more than the raw counts.

Composition
17 of 22
records in G02B

Claims are drafted as optics, not algorithms

The overwhelming majority of records sit in G02B (optical elements & systems), with only 3 in G06F (digital data processing). Simulation and modeling inventions in this field are being claimed through the physical device they model, not through the computational method itself — a gap for anyone drafting a pure algorithmic claim.

IPC composition, 2015-2026
Citations
20 citations
top-cited record

Influence skews old

The most-cited record dates to 2005; three of the five most-cited filings predate 2017. Citation counts favour older documents simply because they've had longer to accumulate references — treat the citation table as a map of historical influence, not of what's commercially active today.

Most-cited records table
Momentum
0 in latest year
across every tracked assignee

No assignee is currently active

Every assignee with recent activity, including Photon Design Ltd and academic filers, shows zero filings in the latest tracked year. Combined with the flat 2022 midpoint, this points to a field where prior claims are settled rather than a live filing race.

Recent-year momentum by assignee
Filing venues
14 of 22
filed in the United States

Filing is US-centred with limited multi-jurisdiction spread

United States receives 14 of the 22 records, versus 4 via PCT/WIPO and 3 via the EPO. A single filing from India is the only exposure outside the US/Europe/PCT axis — freedom-to-operate work outside the US should not assume equivalent coverage.

Receiving office breakdown
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to photonic integrated circuit simulation and modeling, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Photonic Integrated Circuit Simulation and Modeling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the claims, and where they don't

With 22 families spread across a mix of corporate, academic and individual filers, no single assignee controls the field — but a few co-filing clusters show where research groups have concentrated their claims.

Assignee
22 families
total ranked assignees

A long tail, not a concentrated market

The assignee ranking spans corporate filers (Photon Design Ltd, Apple Inc./Apple), academic institutions (Yale University/Yale University) and named individual inventors (ZUO HAIJIE, YU SHAOLIANG). No single filer dominates the 22-family corpus.

Assignee ranking, 2015-2026
Collaboration
10 pairs
co-assignee pairs identified

Co-filing clusters around individual inventors

The strongest co-assignee links — ZUO HAIJIE with YU SHAOLIANG, HU JUEJUN and GU TIAN, each appearing twice — suggest a small research group filing jointly rather than a corporate lab structure.

Co-assignee pair analysis
Momentum
0 latest-year filings
across all six tracked assignees

Everyone has gone quiet at once

Photon Design Ltd, Apple, Yale University and the named individual filers all show zero filings in the most recent tracked year. That uniform pause makes it hard to call a current leader — recent silence, not recent dominance, is the defining pattern.

Recent-year momentum table
🔍
Under-claimed sub-areas
Branches with thin coverage relative to the core optics claims
Inverse-design mode solver algorithmsThermal-aware PIC co-simulationMulti-physics FDTD/electronic co-designFoundry-PDK-linked simulation modelsMachine-learning-assisted mode solving
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
PHOTON DESIGN LTD0
Apple Inc.0
Yale University0
ZUO HAIJIE0
YU SHAOLIANG0
QUITORIANO NATHANIEL0
PARK YOUNG SOO0
NADOVICH CHRISTOPHER T0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Photonic Integrated Circuit Simulation and Modeling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this

The dataset points to a narrow, currently dormant field with claim gaps around computational method rather than device structure.

Map the white space claims

Run a deeper query against G06F-classified simulation methods specifically — inverse design, ML-assisted mode solving and multi-physics co-simulation — to confirm how thin coverage actually is before drafting.

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Watch for a filing restart

With every tracked assignee at zero in the latest year, a single new filer entering could reset the competitive picture. Set an alert on the core IPC classes rather than on named assignees.

Set up monitoring in Eureka →

Check freedom-to-operate against the top-cited records

The five most-cited filings, several predating 2017, still anchor the citation graph. Any new simulation-method filing should be checked against them even though they are old.

Run a clearance search in Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Photonic Integrated Circuit Simulation and Modeling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about PIC simulation patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Photonic Integrated Circuit Simulation and Modeling covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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