https://www.patsnap.com/resources/blog/rd-blog/photovoltaic-module-encapsulant-materials-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · PV Module Reliability
Photovoltaic module encapsulant materials patents: mapping who holds EVA and polyolefin elastomer claim territory
  • 28.3% concentration at the top. the five leading assignees hold 1,417 of the 5,004 records in scope, but the next ranked group thins out fast into a long tail of single- and few-filing entrants.
  • Filing has cooled from its 2017 peak. output ran at 315 records that year and confirmed filings fell 49% between 2021 (192) and 2024 (98), the last year unaffected by publication lag.
  • Polymer chemistry classes dominate over device classes. C08L polymer compositions and C08K additive claims each outrank H01L semiconductor-device claims, showing the claim pressure sits in the material, not the cell integration.
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5,004
Published Records
28%
Top-5 Share of All Records
-49%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (192 records) with 2024 (98) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 5,004 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Field Overview

What this landscape covers

This dataset tracks patent filings and publications addressing module encapsulant materials for photovoltaic panels — ethylene vinyl acetate (EVA) and polyolefin elastomer (POE) formulations, and the reliability metrics tied to them: acetic acid generation, volume resistivity, crosslinking degree, lamination cycle behaviour, backsheet adhesion and yellowing index. It spans 5,004 records published between 2015 and mid-2026, drawing on both dedicated PV encapsulant filings and adjacent polymer-science patents whose claims overlap this chemistry.

Because encapsulant performance is judged on decades-long field exposure, much of the claim language centres on accelerated-aging proxies rather than finished-module data — resistivity thresholds, crosslinking percentages and yellowing indices stand in for weathering that cannot be tested in real time before a filing deadline.

Filing activity and technology composition, 2015–2026
  1. 1DOW GLOBAL TECHNOLOGIES LLC650
  2. 2BOREALIS AG289
  3. 3EI DU PONT DE NEMOURS & CO267
  4. 4TORAY PLASTICS (AMERICA) INC109
  5. 5XEROX CORP102
  6. 6UNION CARBIDE CORP87
  7. 7SIKA TECH AG80
  8. 8CANON KK74
  9. 9UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY LLC72
  10. 10SHARP KK67
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Photovoltaic Module Encapsulant Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Publication counts by year and by IPC subclass, drawn from the full 5,004-record set in scope for this search.

Filing trend: a 2017 peak followed by a real pullback

Publications rose to a peak of 315 in 2017, then declined; the confirmed comparison is 192 records in 2021 against 98 in 2024, a 49% drop over that span. Counts from 2025 onward are still incomplete because publication trails filing by roughly 18 months, so the most recent bars understate true filing activity and should not be read as a further slowdown.

Filing trend: a 2017 peak followed by a real pullback010020030040031520172018201920202021202220232024202572026Most recent year is partial — publication lag means later filings are not yet visible.

Technology composition: polymer chemistry outweighs device integration

C08L (polymer compositions) leads at 30.1% of the 5,004 records, followed by C08K (polymer additives) at 23.5%. H01B (cables, conductors and insulators) and B32B (layered products) each cover a material share, while H01L (semiconductor devices) appears in 14.2% of records — evidence that most claim activity is written around the encapsulant compound itself rather than its integration into the finished cell stack. Because records can carry multiple IPC codes, these shares add to more than 100% of the record total.

Technology composition: polymer chemistry outweighs device integrationC08L · Polymer compositions1,50630.1%C08K · Use of additives in polymers1,17723.5%H01B · Cables, conductors & insulators95819.1%B32B · Layered products & laminates78115.6%H01L · Semiconductor devices71114.2%C08J · Polymer processing & solutions65913.2%G03G · Electrography & electrophotogr…50510.1%C08F · Addition polymers (vinyl etc.)3667.3%Other3,86077.1%

Shares are the percentage of the 5,004 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Photovoltaic Module Encapsulant Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Representative filing and most-cited prior art

Representative Record
US20200207959A12020-07-02

US20200207959A1 — Conductive heating composition and flexible conductive heating device using the same

FLEXHEAT CORP.

A conductive heating composition built from a polyolefin elastomer, a crystalline non-grafted polyolefin and a crystalline grafted or copolymerized polymer plus a conductive filler. The claims specify a surface resistivity window of 1.0E+01 to 1.0E+06 ohm and a volume resistivity window of 8.0E+01 ohm-cm to under 1.0E+05 ohm-cm, together with a defined resistance-versus-temperature slope and a bend-durability limit after 300 repeated flexes.Filed by Flexheat Corp., published 2020-07-02.

US20200207959A1 — patent drawing 1US20200207959A1 — patent drawing 2
View full record
Most-cited records in this corpus
#Publication no.Patent titleCitations
1US7535624B2Electro-optic display and materials for use therein1,034
2US20100210745A1Molecular Healing of Polymeric Materials, Coatings, Plastics, Elastomers, Composites, Laminates, Adhesives, a…718
3US20080216887A1Interconnect Technologies for Back Contact Solar Cells and Modules381
4US7110163B2Electro-optic display and lamination adhesive for use therein360
5US7602374B2Methods for reducing edge effects in electro-optic displays356
6US20100233146A1Coatings and Surface Treatments Having Active Enzymes and Peptides317
7US20110240064A1Polymeric Coatings Incorporating Bioactive Enzymes for Cleaning a Surface292
8US4985313AWire and cable276
9US20070035808A1Electro-optic display and materials for use therein255
10US20070276092A1Thermoplastic Elastomer Composition, Method for Producing Same and Formed Article254

Citation counts favour older filings that have had more time to accumulate references; treat them as a signal of influence within this searched corpus, not as a ranking of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Photovoltaic Module Encapsulant Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three readings of the dataset that matter more than the raw counts.

Concentration
28.3%
of 5,004 records held by top 5

The top of the field is dense but not closed

The five leading assignees together hold 28.3% of all 5,004 records in scope, with a sizeable gap between the leader at 650 records and fifth place at 102. That gap means the field has one clear incumbent by volume rather than a tight cluster of equals, and the tenth-ranked assignee at 67 records shows the concentration thins quickly outside the top five.

Ranking covers 100 companies, counted in records.
Momentum
-49%
2021 to 2024 filing change

Filing volume has genuinely cooled since 2017

The 2017 peak of 315 records has not been matched since, and the confirmed 2021-to-2024 comparison shows a 49% decline from 192 to 98 records. Because 2025 and 2026 data are still filling in under an 18-month publication lag, this decline should be read through 2024 only, not projected forward from the incomplete recent bars.

2024 is the latest year treated as complete.
Claim geography
30.1%
of records classed C08L

The pressure sits in polymer chemistry, not cell integration

C08L (polymer compositions) and C08K (additives) together outweigh H01L (semiconductor devices) and H01B (insulators) as filing categories, indicating that the densest claim territory is the encapsulant compound's own formulation — crosslinking agents, stabilisers and resistivity modifiers — rather than how the material is integrated into the finished module.

Classes overlap; shares are against the 5,004-record total.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to photovoltaic module encapsulant materials, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Photovoltaic Module Encapsulant Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds the ground, and where it opens up

A ranking of 100 companies by records in scope, with a look at where recent-year filing has actually gone quiet.

Leader by volume
650
records

One incumbent holds a clear volume lead

The leading assignee's 650 records sit well above the fifth-place figure of 102, a gap that marks a genuine scale advantage rather than a photo finish. Recent-year momentum data shows even this leader's filing has slowed sharply, down 92% year over year in the latest year, consistent with the broader 2021-to-2024 pullback across the field.

Latest-year momentum: -92% YoY for the leader.
Momentum check
0
latest-year records for several ranked assignees

Several established filers have gone quiet

Multiple assignees that appear high in the historical ranking show zero records in the latest available year, including entities with long-standing polymer and encapsulant portfolios. That pattern is consistent with the 18-month publication lag rather than necessarily a withdrawal from the space, but it is worth checking recent public announcements before assuming continued activity.

Zero-filing status may reflect publication lag, not exit.
Collaboration
10
co-assignee pairs identified

Joint filing is rare and concentrated around one hub

Only 10 co-assignee pairs appear in the dataset, and the strongest links all run through the same leading assignee paired with related corporate entities and named inventors. That pattern points to internal corporate structuring rather than cross-company joint development as the main driver of co-assignment here.

Strongest pair: 18 shared records.
🔍
Under-claimed sub-areas worth checking before filing
Branches with lighter claim density relative to the core EVA/POE formulation space.
Recyclable encapsulant formulationsLow-temperature lamination cycle chemistryBifacial-module backsheet adhesionHalogen-free flame-retardant encapsulantsEncapsulant-integrated moisture barriers
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Dow Global Technologies LLC1-92%
E.I. du Pont de Nemours & Co.0—
Borealis AG0—
Union Carbide Chemicals & Plastics Technology LLC0—
Toray Plastics (America), Inc.0-100%
Xerox Corporation0—
Sika Technology AG0-100%
Canon Inc.0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Photovoltaic Module Encapsulant Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to specific next steps rather than a single conclusion.

Check whether the 2024 pullback is chemistry-specific

The 49% decline from 2021 to 2024 is field-wide, but it is worth checking whether it concentrates in EVA formulation claims specifically or spans POE and additive chemistries equally before deciding where to file.

Explore filing trends by class

Watch the leader's slowed filing rate

A 92% year-over-year drop from the top assignee is a large enough swing to warrant checking whether it reflects a genuine strategy shift or an artefact of the publication lag before adjusting freedom-to-operate assumptions.

Review assignee momentum

Map the under-claimed branches against product roadmaps

Recyclable and halogen-free encapsulant chemistries show lighter claim density than the core formulation space; a targeted search against a specific roadmap item can confirm whether that gap is real or an artefact of search terms.

Run a focused white-space search
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Photovoltaic Module Encapsulant Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Photovoltaic Module Encapsulant Materials covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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