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Run your analysis now →Filing growth compares 2021 (192 records) with 2024 (98) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 5,004 records in scope (CR5), not by the ranked leaders only.
This dataset tracks patent filings and publications addressing module encapsulant materials for photovoltaic panels — ethylene vinyl acetate (EVA) and polyolefin elastomer (POE) formulations, and the reliability metrics tied to them: acetic acid generation, volume resistivity, crosslinking degree, lamination cycle behaviour, backsheet adhesion and yellowing index. It spans 5,004 records published between 2015 and mid-2026, drawing on both dedicated PV encapsulant filings and adjacent polymer-science patents whose claims overlap this chemistry.
Because encapsulant performance is judged on decades-long field exposure, much of the claim language centres on accelerated-aging proxies rather than finished-module data — resistivity thresholds, crosslinking percentages and yellowing indices stand in for weathering that cannot be tested in real time before a filing deadline.
Pick a task. Every answer cites the patents behind it.
Publication counts by year and by IPC subclass, drawn from the full 5,004-record set in scope for this search.
Publications rose to a peak of 315 in 2017, then declined; the confirmed comparison is 192 records in 2021 against 98 in 2024, a 49% drop over that span. Counts from 2025 onward are still incomplete because publication trails filing by roughly 18 months, so the most recent bars understate true filing activity and should not be read as a further slowdown.
C08L (polymer compositions) leads at 30.1% of the 5,004 records, followed by C08K (polymer additives) at 23.5%. H01B (cables, conductors and insulators) and B32B (layered products) each cover a material share, while H01L (semiconductor devices) appears in 14.2% of records — evidence that most claim activity is written around the encapsulant compound itself rather than its integration into the finished cell stack. Because records can carry multiple IPC codes, these shares add to more than 100% of the record total.
Shares are the percentage of the 5,004 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about photovoltaic module encapsulant materials and every answer comes back with the patent numbers behind it.
Try EurekaA conductive heating composition built from a polyolefin elastomer, a crystalline non-grafted polyolefin and a crystalline grafted or copolymerized polymer plus a conductive filler. The claims specify a surface resistivity window of 1.0E+01 to 1.0E+06 ohm and a volume resistivity window of 8.0E+01 ohm-cm to under 1.0E+05 ohm-cm, together with a defined resistance-versus-temperature slope and a bend-durability limit after 300 repeated flexes.Filed by Flexheat Corp., published 2020-07-02.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US7535624B2 | Electro-optic display and materials for use therein | 1,034 |
| 2 | US20100210745A1 | Molecular Healing of Polymeric Materials, Coatings, Plastics, Elastomers, Composites, Laminates, Adhesives, a… | 718 |
| 3 | US20080216887A1 | Interconnect Technologies for Back Contact Solar Cells and Modules | 381 |
| 4 | US7110163B2 | Electro-optic display and lamination adhesive for use therein | 360 |
| 5 | US7602374B2 | Methods for reducing edge effects in electro-optic displays | 356 |
| 6 | US20100233146A1 | Coatings and Surface Treatments Having Active Enzymes and Peptides | 317 |
| 7 | US20110240064A1 | Polymeric Coatings Incorporating Bioactive Enzymes for Cleaning a Surface | 292 |
| 8 | US4985313A | Wire and cable | 276 |
| 9 | US20070035808A1 | Electro-optic display and materials for use therein | 255 |
| 10 | US20070276092A1 | Thermoplastic Elastomer Composition, Method for Producing Same and Formed Article | 254 |
Citation counts favour older filings that have had more time to accumulate references; treat them as a signal of influence within this searched corpus, not as a ranking of current technical importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three readings of the dataset that matter more than the raw counts.
The five leading assignees together hold 28.3% of all 5,004 records in scope, with a sizeable gap between the leader at 650 records and fifth place at 102. That gap means the field has one clear incumbent by volume rather than a tight cluster of equals, and the tenth-ranked assignee at 67 records shows the concentration thins quickly outside the top five.
The 2017 peak of 315 records has not been matched since, and the confirmed 2021-to-2024 comparison shows a 49% decline from 192 to 98 records. Because 2025 and 2026 data are still filling in under an 18-month publication lag, this decline should be read through 2024 only, not projected forward from the incomplete recent bars.
C08L (polymer compositions) and C08K (additives) together outweigh H01L (semiconductor devices) and H01B (insulators) as filing categories, indicating that the densest claim territory is the encapsulant compound's own formulation — crosslinking agents, stabilisers and resistivity modifiers — rather than how the material is integrated into the finished module.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to photovoltaic module encapsulant materials, with the prior art for and against each one.
A ranking of 100 companies by records in scope, with a look at where recent-year filing has actually gone quiet.
The leading assignee's 650 records sit well above the fifth-place figure of 102, a gap that marks a genuine scale advantage rather than a photo finish. Recent-year momentum data shows even this leader's filing has slowed sharply, down 92% year over year in the latest year, consistent with the broader 2021-to-2024 pullback across the field.
Multiple assignees that appear high in the historical ranking show zero records in the latest available year, including entities with long-standing polymer and encapsulant portfolios. That pattern is consistent with the 18-month publication lag rather than necessarily a withdrawal from the space, but it is worth checking recent public announcements before assuming continued activity.
Only 10 co-assignee pairs appear in the dataset, and the strongest links all run through the same leading assignee paired with related corporate entities and named inventors. That pattern points to internal corporate structuring rather than cross-company joint development as the main driver of co-assignment here.
| Assignee | Recent year | YoY |
|---|---|---|
| Dow Global Technologies LLC | 1 | -92% |
| E.I. du Pont de Nemours & Co. | 0 | — |
| Borealis AG | 0 | — |
| Union Carbide Chemicals & Plastics Technology LLC | 0 | — |
| Toray Plastics (America), Inc. | 0 | -100% |
| Xerox Corporation | 0 | — |
| Sika Technology AG | 0 | -100% |
| Canon Inc. | 0 | -100% |
The dataset points to specific next steps rather than a single conclusion.
The 49% decline from 2021 to 2024 is field-wide, but it is worth checking whether it concentrates in EVA formulation claims specifically or spans POE and additive chemistries equally before deciding where to file.
Explore filing trends by classA 92% year-over-year drop from the top assignee is a large enough swing to warrant checking whether it reflects a genuine strategy shift or an artefact of the publication lag before adjusting freedom-to-operate assumptions.
Review assignee momentumRecyclable and halogen-free encapsulant chemistries show lighter claim density than the core formulation space; a targeted search against a specific roadmap item can confirm whether that gap is real or an artefact of search terms.
Run a focused white-space searchOne assignee leads the ranked field with 650 of the 5,004 records in scope, well ahead of the fifth-place assignee at 102 records. The top five combined hold 28.3% of all records, meaning the field has a clear volume leader but is not tightly controlled by a small cluster — concentration drops off quickly beyond the leading few. Anyone assessing freedom to operate should treat the leader's portfolio as the first thing to clear, then check the long tail for narrower blocking claims rather than assuming the top five cover everything.
The dataset does not split claim volume cleanly between EVA and POE chemistries alone, since the search spans both plus adjacent additive and processing classes. What is clear is that C08L (polymer compositions) and C08K (additive use) are the two largest IPC categories, at 30.1% and 23.5% of the 5,004 records respectively, showing formulation-level claims — crosslinking agents, stabilisers, resistivity control — dominate over device-integration claims in H01L or H01B. A chemistry-specific search within this corpus would be needed to separate EVA-specific from POE-specific density precisely.
Filings peaked at 315 records in 2017 and confirmed data shows a 49% decline from 192 records in 2021 to 98 in 2024. This could reflect a maturing formulation space where core chemistry claims are already staked out, a shift in R&D investment toward other module components, or normal cyclicality in a specialty materials field. It is not safe to extend this trend into 2025 or 2026, because publication lags filing by roughly 18 months and those years are still filling in on the record.
US20200207959A1, filed by Flexheat Corp. and published 2020-07-02, claims a conductive heating composition built from a polyolefin elastomer combined with a crystalline non-grafted polyolefin and a crystalline grafted or copolymerized polymer plus conductive filler. Its claims are anchored to specific numeric ranges — surface resistivity from 1.0E+01 to 1.0E+06 ohm, volume resistivity from 8.0E+01 ohm-cm up to just under 1.0E+05 ohm-cm, a defined resistance-temperature slope, and a bend-durability spec after 300 flex cycles. Anyone formulating a polyolefin-elastomer-based conductive or resistive composition in that resistivity band should check this claim set specifically rather than assume it only touches heating devices.
Based on the IPC composition in this dataset, device-integration classes like H01L (14.2% of records) and cross-cutting categories carry lighter claim density than the core polymer-formulation classes C08L and C08K. Sub-areas worth checking specifically include recyclable encapsulant formulations, low-temperature lamination cycle chemistry, and halogen-free flame-retardant encapsulants — none of these appear as dominant IPC categories in this corpus, suggesting narrower claim coverage relative to the core EVA/POE formulation space. A targeted novelty search on any one of these before drafting is still advisable, since a thin category in this dataset does not guarantee freedom to operate.
Go past this page: query the whole photovoltaic module encapsulant materials corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.
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