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HiPIMS Sputtering Patents: Top Companies & Filing Trends 2026

HiPIMS Sputtering Patents: Top Companies & Filing Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/physical-vapor-deposition-hipims-sputtering-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Surface Engineering & Coatings
HiPIMS Sputtering Patents: Who Holds the Claim Space

A patent landscape review of HiPIMS (High Power Impulse Magnetron Sputtering) covering 763 published families, filing trends to 2024, IPC composition and the leaders holding the most-cited claims.

763
Published Records
55%
Top-5 Share of All Records
+12%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth = 2021 (17 records) → 2024 (19); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 763 records in scope (CR5), not the ranked leaders only.

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Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What the HiPIMS patent record shows

High Power Impulse Magnetron Sputtering (HiPIMS) is a pulsed variant of magnetron PVD that delivers very high peak power to the target while keeping average power manageable, producing denser, better-adhered coatings than conventional DC sputtering. The patent record tracked here spans 763 published families filed between 2015 and the 2026 cut-off, drawn from claims and abstracts that name HiPIMS or high-power impulse magnetron sputtering directly, or that combine HiPIMS-style pulsing with PVD/sputter claims under the core coating classification C23C14.

Filing activity peaked in 2019 at 57 records and has settled into a lower but still growing pattern since — 2021 to 2024 rose 12%, from 17 to 19 filings a year. Because publication typically lags filing by around 18 months, the 2025 and 2026 counts in this dataset are still filling in and should not be read as a slowdown.

Filing activity by year, 2017–2026
  1. 1OERLIKON SURFACE SOLUTIONS AG PFAFFIKON262
  2. 2WALTER AG71
  3. 3EVATEC AG31
  4. 4APPLIED MATERIALS INC28
  5. 5IHI HAUZER TECH COATING BV27
  6. 6FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV26
  7. 7MOLDINO TOOL ENG LTD21
  8. 8CEMECON AG20
  9. 9SANDVIK INTELLECTUAL PROPERTY AB16
  10. 10NOVOSOUND LTD16
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Physical Vapor Deposition: HiPIMS Sputtering Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trends and technology composition

The dataset covers 763 published records with a data cut-off of 2026-08-31. The two views below show when the field grew and which parts of the classification system carry the claims.

A 2019 peak, then a steadier climb

Annual filings ran from 44 in 2017 up to a peak of 57 in 2019, before settling into the 2021–2024 band that closed at 19 filings, up 12% over that three-year span. The most recent years in the chart are undercounted because publication lags filing by roughly 18 months.

A 2019 peak, then a steadier climb015304560442017201857201920202021202220232024202512026Most recent year is partial — publication lag means later filings are not yet visible.

Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.

Coating claims dominate, with electron-tube and semiconductor overlap

C23C (coating and surface deposition) touches 89.8% of the 763 records, confirming this is fundamentally a coatings dataset. H01J (electron and discharge tubes) appears in 35.9% of records, reflecting the plasma-source hardware shared with HiPIMS discharges, while H01L (semiconductor devices) sits at 7.2% and battery-related H01M at just 2.4% — each record can carry more than one class, so these shares add up past 100%.

Coating claims dominate, with electron-tube and semiconductor overlapC23C · Coating & surface deposition68589.8%H01J · Electron & discharge tubes27435.9%H10P658.5%H01L · Semiconductor devices557.2%B32B · Layered products & laminates334.3%B23B · Turning & boring243.1%A61L · Sterilising & disinfecting192.5%H01M · Batteries, cells & fuel cells182.4%Other26134.2%

Shares are the percentage of the 763 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Physical Vapor Deposition: HiPIMS Sputtering Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited HiPIMS records

Representative Filing
US20110315543A12011-12-29

Forming memory using high power impulse magnetron sputtering (US20110315543A1)

MICRON TECHNOLOGY, INC.

One or more method embodiments include forming a resistive memory material on a structure using high power impulse magnetron sputtering (HIPIMS), wherein the resistive memory material is formed on the structure in an environment having a temperature of approximately 400 degrees Celsius or less.Filed by Micron Technology, Inc., published 2011-12-29 — an early example of HiPIMS claimed outside its traditional hard-coating base, applied instead to resistive memory fabrication.

US20110315543A1 — patent drawing 1US20110315543A1 — patent drawing 2
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Highest-citation records in the dataset
#Publication no.Patent titleCitations
1US20090075114A1Method for the manufacture of a hard material coating on a metal substrate and a coated substrate93
2US20080135401A1RF substrate bias with high power impulse magnetron sputtering (hipims)87
3US20160053366A1High power impulse magnetron sputtering process to achieve a high density high sp3 containing layer71
4US20090068450A1Method and Apparatus for Multi-Cathode PVD Coating and Substrate with PVD Coating69
5US20100183900A1Method for producing PVD coatings55
6US20170287578A1Nuclear fuel claddings, production method thereof and uses of same against oxidation/hydriding54
7DE102006017382A1Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen54
8US20140234616A1Coating of substrates using hipims52
9US20110005920A1Low Temperature Deposition of Amorphous Thin Films47
10DE102008021912A1Pretreating and/or coating bodies with high power impulse magnetron sputtering-power supplies in metallic coa…45

Citation counts favour older filings inside any searched corpus — treat them as a signal of influence on later filers, not a ranking of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Physical Vapor Deposition: HiPIMS Sputtering Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the concentration and class data mean for a filing decision

Three patterns stand out once the ranking and classification data are read together: a top-heavy assignee base, a coatings-dominated classification profile, and a small set of recurring co-filing relationships.

Concentration
54.9%
of 763 records held by the top 5

The leader board is short and heavy

The single leading assignee holds 262 records on its own, and the top five combined account for 54.9% of all 763 records in scope. Fifth place already sits at 27 records and tenth place at 16 — a steep drop-off that leaves the rest of the 100 ranked companies filing in single or low double digits.

Ranking covers 100 companies, by record count
Growth
+12%
filings, 2021 to 2024

Past the 2019 peak, but still climbing

Annual filings hit a peak of 57 in 2019, dropped back, then grew 12% from 17 filings in 2021 to 19 in 2024 — the last year in this dataset that can be read as complete. Years after 2024 will look lower simply because publication has not caught up with filing yet.

2024 is the most recent complete year
Classification
89.8%
of records touch C23C

This is a coatings dataset with a hardware overlap

C23C coating classifications appear in 89.8% of the 763 records, while H01J electron/discharge-tube classifications appear in 35.9% — the plasma-source hardware that HiPIMS discharges depend on. Smaller footprints in H01L (7.2%), B32B (4.3%) and H01M (2.4%) mark where HiPIMS claims have started reaching into semiconductors, laminates and batteries without yet building density there.

Shares exceed 100% because records can carry multiple classes
Co-filing
10 pairs
co-assignee relationships recorded

A small, repeating filing cluster

Only 10 co-assignee pairs appear across the dataset, and the strongest pairing recurs across three of them — the same handful of organisations filing jointly on coating and tooling claims. That is a narrow enough set that a new entrant into HiPIMS coatings for cutting tools should expect to run into this cluster's prior art directly.

Strongest pair recorded at 21 shared filings
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Physical Vapor Deposition: HiPIMS Sputtering Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The concentration and classification patterns above point to specific next steps for teams deciding where to file or partner.

Map the leader's actual claim boundaries

Concentration at the top tells you who to watch, not what they've actually locked down. Pulling the independent claims of the leading assignees' most-cited filings shows where their coverage genuinely stops.

Explore claim scope in Eureka

Test the under-claimed branches

H01M and B32B carry a small fraction of HiPIMS records relative to the coatings core. Before assuming that means opportunity, check whether it reflects a technical mismatch or a genuinely open branch.

Run a white-space check in Eureka

Watch the co-filing cluster

A small number of organisations account for all ten recorded co-assignee pairs. Tracking their joint filings is a faster way to anticipate the next wave of tooling and coating claims than watching any single assignee alone.

Track assignee activity in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Physical Vapor Deposition: HiPIMS Sputtering Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about HiPIMS patent activity

Answers are grounded in the same dataset. Derived from a Patsnap search on Physical Vapor Deposition: HiPIMS Sputtering Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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