HiPIMS Sputtering Patents: Top Companies & Filing Trends 2026
A patent landscape review of HiPIMS (High Power Impulse Magnetron Sputtering) covering 763 published families, filing trends to 2024, IPC composition and the leaders holding the most-cited claims.
Filing growth = 2021 (17 records) → 2024 (19); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 763 records in scope (CR5), not the ranked leaders only.
What the HiPIMS patent record shows
High Power Impulse Magnetron Sputtering (HiPIMS) is a pulsed variant of magnetron PVD that delivers very high peak power to the target while keeping average power manageable, producing denser, better-adhered coatings than conventional DC sputtering. The patent record tracked here spans 763 published families filed between 2015 and the 2026 cut-off, drawn from claims and abstracts that name HiPIMS or high-power impulse magnetron sputtering directly, or that combine HiPIMS-style pulsing with PVD/sputter claims under the core coating classification C23C14.
Filing activity peaked in 2019 at 57 records and has settled into a lower but still growing pattern since — 2021 to 2024 rose 12%, from 17 to 19 filings a year. Because publication typically lags filing by around 18 months, the 2025 and 2026 counts in this dataset are still filling in and should not be read as a slowdown.
Filing trends and technology composition
The dataset covers 763 published records with a data cut-off of 2026-08-31. The two views below show when the field grew and which parts of the classification system carry the claims.
A 2019 peak, then a steadier climb
Annual filings ran from 44 in 2017 up to a peak of 57 in 2019, before settling into the 2021–2024 band that closed at 19 filings, up 12% over that three-year span. The most recent years in the chart are undercounted because publication lags filing by roughly 18 months.
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
Coating claims dominate, with electron-tube and semiconductor overlap
C23C (coating and surface deposition) touches 89.8% of the 763 records, confirming this is fundamentally a coatings dataset. H01J (electron and discharge tubes) appears in 35.9% of records, reflecting the plasma-source hardware shared with HiPIMS discharges, while H01L (semiconductor devices) sits at 7.2% and battery-related H01M at just 2.4% — each record can carry more than one class, so these shares add up past 100%.
Shares are the percentage of the 763 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Physical Vapor Deposition: HiPIMS Sputtering Patent Landscape with Eureka
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Try EurekaThe most-cited HiPIMS records
Forming memory using high power impulse magnetron sputtering (US20110315543A1)
One or more method embodiments include forming a resistive memory material on a structure using high power impulse magnetron sputtering (HIPIMS), wherein the resistive memory material is formed on the structure in an environment having a temperature of approximately 400 degrees Celsius or less.Filed by Micron Technology, Inc., published 2011-12-29 — an early example of HiPIMS claimed outside its traditional hard-coating base, applied instead to resistive memory fabrication.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20090075114A1 | Method for the manufacture of a hard material coating on a metal substrate and a coated substrate | 93 |
| 2 | US20080135401A1 | RF substrate bias with high power impulse magnetron sputtering (hipims) | 87 |
| 3 | US20160053366A1 | High power impulse magnetron sputtering process to achieve a high density high sp3 containing layer | 71 |
| 4 | US20090068450A1 | Method and Apparatus for Multi-Cathode PVD Coating and Substrate with PVD Coating | 69 |
| 5 | US20100183900A1 | Method for producing PVD coatings | 55 |
| 6 | US20170287578A1 | Nuclear fuel claddings, production method thereof and uses of same against oxidation/hydriding | 54 |
| 7 | DE102006017382A1 | Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen | 54 |
| 8 | US20140234616A1 | Coating of substrates using hipims | 52 |
| 9 | US20110005920A1 | Low Temperature Deposition of Amorphous Thin Films | 47 |
| 10 | DE102008021912A1 | Pretreating and/or coating bodies with high power impulse magnetron sputtering-power supplies in metallic coa… | 45 |
Citation counts favour older filings inside any searched corpus — treat them as a signal of influence on later filers, not a ranking of current technical importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the concentration and class data mean for a filing decision
Three patterns stand out once the ranking and classification data are read together: a top-heavy assignee base, a coatings-dominated classification profile, and a small set of recurring co-filing relationships.
The leader board is short and heavy
The single leading assignee holds 262 records on its own, and the top five combined account for 54.9% of all 763 records in scope. Fifth place already sits at 27 records and tenth place at 16 — a steep drop-off that leaves the rest of the 100 ranked companies filing in single or low double digits.
Past the 2019 peak, but still climbing
Annual filings hit a peak of 57 in 2019, dropped back, then grew 12% from 17 filings in 2021 to 19 in 2024 — the last year in this dataset that can be read as complete. Years after 2024 will look lower simply because publication has not caught up with filing yet.
This is a coatings dataset with a hardware overlap
C23C coating classifications appear in 89.8% of the 763 records, while H01J electron/discharge-tube classifications appear in 35.9% — the plasma-source hardware that HiPIMS discharges depend on. Smaller footprints in H01L (7.2%), B32B (4.3%) and H01M (2.4%) mark where HiPIMS claims have started reaching into semiconductors, laminates and batteries without yet building density there.
A small, repeating filing cluster
Only 10 co-assignee pairs appear across the dataset, and the strongest pairing recurs across three of them — the same handful of organisations filing jointly on coating and tooling claims. That is a narrow enough set that a new entrant into HiPIMS coatings for cutting tools should expect to run into this cluster's prior art directly.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to physical vapor deposition: hipims sputtering patent landscape, with the prior art for and against each one.
Where to take this analysis
The concentration and classification patterns above point to specific next steps for teams deciding where to file or partner.
Map the leader's actual claim boundaries
Concentration at the top tells you who to watch, not what they've actually locked down. Pulling the independent claims of the leading assignees' most-cited filings shows where their coverage genuinely stops.
Explore claim scope in EurekaTest the under-claimed branches
H01M and B32B carry a small fraction of HiPIMS records relative to the coatings core. Before assuming that means opportunity, check whether it reflects a technical mismatch or a genuinely open branch.
Run a white-space check in EurekaWatch the co-filing cluster
A small number of organisations account for all ten recorded co-assignee pairs. Tracking their joint filings is a faster way to anticipate the next wave of tooling and coating claims than watching any single assignee alone.
Track assignee activity in EurekaCommon questions about HiPIMS patent activity
The tracked dataset contains 763 published patent records filed between 2015 and the 2026 cut-off date that either name HiPIMS or high power impulse magnetron sputtering directly, or combine HiPIMS-style pulsing claims with PVD/sputter language under the core coating classification C23C14. Annual filings peaked in 2019 at 57 records. Because publication lags filing by roughly 18 months, the most recent one to two years in any such count will always look lower than the true filing rate turns out to be.
Filing activity is heavily concentrated: the single leading assignee holds 262 of the 763 records, and the top five assignees combined account for 54.9% of all records in scope. The top ten together reach 67.9%. Below tenth place, which holds 16 records, the field spreads into a long tail of companies filing in the single digits, so competitive monitoring should focus on the handful at the top plus any repeat co-filers rather than the full ranked list.
Claims distinguish HiPIMS by its pulsed power delivery profile — very high peak power applied in short pulses with a low duty cycle — rather than the continuous or steady-pulsed power used in conventional DC or pulsed-DC magnetron sputtering. This pulsing is claimed because it changes plasma ionisation density and, in turn, coating microstructure and adhesion. In this dataset, C23C coating classifications appear in 89.8% of records and H01J electron/discharge-tube classifications in 35.9%, reflecting that most claims cover either the resulting coating or the plasma-source hardware that produces the pulse.
Filings grew 12% between 2021 and 2024, from 17 to 19 records a year, after an earlier peak of 57 in 2019. That is a real if modest increase, not a decline. Years beyond 2024 in any raw count will appear to drop off, but that is a publication-lag artefact rather than a genuine slowdown, since patent filings typically take about 18 months to reach publication.
While C23C coating claims dominate at 89.8% of the 763 records, smaller footprints show HiPIMS reaching into other fields: H01L semiconductor devices at 7.2%, B32B layered products and laminates at 4.3%, A61L sterilising and disinfecting at 2.5%, and H01M batteries and fuel cells at 2.4%. These smaller shares mark branches where HiPIMS claims exist but are far less dense than in the coatings core, which is useful context for anyone assessing freedom to operate outside traditional hard-coating tooling.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.