Magnetron Sputter Coating Patents: Top Companies & Trends 2026
A data-backed view of magnetron sputter coating patent filings: who leads, how concentrated the field is, where filing has slowed since 2021, and which technical branches remain under-claimed.
Filing growth = 2021 (57 records) → 2024 (35); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 2,755 records in scope (CR5), not the ranked leaders only.
What this landscape covers
Magnetron sputter coating sits at the intersection of physical vapor deposition process engineering and the plasma hardware that sustains it. This landscape covers 2,755 published records filed or published between 2015 and 2026, spanning claims on magnetron target design, sputtering source geometry, chamber and electrode configuration, and the thin-film products deposited by the process. Because patent families neutralise repeat filings across jurisdictions, the assignee ranking here is built on family counts rather than raw document counts, giving a fairer picture of who actually holds distinct inventions.
Coverage runs through a data cut-off of 2026-08-31, but publication typically lags filing by around 18 months, so the most recent one to two years understate real filing activity. Read the 2024 datapoint as the last complete year in the trend, and treat everything after it as still filling in.
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Filing trend and technology composition
Two views of the same 2,755 records: how filing volume has moved year over year, and which IPC subclasses the claims actually sit in. Because a single record can carry several IPC codes, the composition shares add up to well over 100% of the record total — that is expected, not an error.
Filing rose to a 2018 peak, then fell
Annual filings climbed from 53 in 2017 to a peak of 63 in 2018, then eased off. The most reliable recent signal is the 2021-to-2024 span, where filings fell from 57 to 35 — a 39% drop over three years. Treat 2025 and 2026 as provisional given publication lag.
Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.
C23C and H01J dominate; the rest is a long tail
C23C coating and surface deposition claims appear in 98.7% of records, effectively the definition of the field. H01J electron-and-discharge-tube claims sit inside 34.7% of records, confirming that most inventions bundle chamber or plasma-source hardware with the film-forming step. Beyond those two, B32B layered products (9.1%), H10P (7.9%), H01L semiconductor devices (7.7%), C03C glass and enamel (6.4%) and G02B optics (4.2%) mark narrower, application-specific branches.
Shares are the percentage of the 2,755 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Physical Vapor Deposition: Magnetron Sputter Coating Patent Landscape with Eureka
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Try EurekaThe prior art anchoring this field
CA1242991A — Magnetron sputter coating source for both magnetic and nonmagnetic target materials
A magnetron sputter coating source built to handle sputter targets ranging from nonmagnetic to highly ferromagnetic, replacing fixed permanent magnets with an electromagnetic coil whose energising current is widely adjustable. That adjustability lets the source accommodate large-inventory magnetic targets and gives direct control over the electrical impedance of the glow discharge through coil current alone.Filed by Novellus Systems Inc., granted 1988-10-11 — a foundational design still cited by later coil-driven and variable-field magnetron sources.
View full record| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20040094402A1 | Self-ionized and capacitively-coupled plasma for sputtering and resputtering | 665 |
| 2 | US4851095A | Magnetron sputtering apparatus and process | 547 |
| 3 | US20040063320A1 | Manufacturing apparatus and method for large-scale production of thin-film solar cells | 455 |
| 4 | US20170032942A1 | Surface coating for chamber components used in plasma systems | 375 |
| 5 | US4812217A | Method and apparatus for feeding and coating articles in a controlled atmosphere | 357 |
| 6 | US6679981B1 | Inductive plasma loop enhancing magnetron sputtering | 334 |
| 7 | US6365010B1 | Sputtering apparatus and process for high rate coatings | 311 |
| 8 | US6251242B1 | Magnetron and target producing an extended plasma region in a sputter reactor | 299 |
| 9 | US6027766A | Photocatalytically-activated self-cleaning article and method of making same | 287 |
| 10 | US5922176A | Spark eliminating sputtering target and method for using and making same | 287 |
Ranked by citation count within this search corpus. Older records accumulate citations simply by being available longer, so treat this as a signal of influence on later filers, not a measure of current commercial relevance.
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Browse MCP servers →What the numbers mean for filing strategy
Read together, the concentration figures, the trend, and the technology composition point to a field that is broad in application but not tightly controlled by any one filer.
No single gatekeeper
The leader holds 195 records, but the top 5 combined still account for only 19.7% of all 2,755 records in scope, and the top 10 combined reach 28.0%. That is meaningful share, not control — freedom-to-operate work has to look past the leader to a genuine long tail of single- and low-filing entrants.
Cooling, not collapsing
Annual filings fell from 57 in 2021 to 35 in 2024, a 39% decline over that span, after peaking at 63 in 2018. That is a real deceleration in a maturing process technology, not a sign the underlying deposition method is being abandoned — chamber and hardware claims (H01J) keep pace with core coating claims.
Hardware and film claims travel together
C23C coating claims appear in 98.7% of records, essentially defining the field, but more than a third of records also claim H01J plasma or discharge-tube elements. Filing a coating-only claim without addressing the source hardware around it leaves an opening that a third of the field has already closed.
US and EPO carry the bulk of filing activity
The United States receives the largest share of filings (947), followed by the EPO (506) and WIPO/PCT filings (253), with South Korea, Canada and Australia each in triple digits. A freedom-to-operate search limited to one jurisdiction will miss a meaningful share of the active claim set.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to physical vapor deposition: magnetron sputter coating patent landscape, with the prior art for and against each one.
Where to take this analysis
The figures above answer where the field stands. The next step is applying them to a specific filing decision.
Map a specific claim against the ranked leaders
Run a target claim against the assignees who hold the densest coating and chamber-hardware positions before committing drafting time to that branch.
Open Eureka to compare claimsTrack the H01J and B32B branches for movement
These narrower subclasses carry lower filing density than core C23C claims — a useful early-warning list for shifts in where new applications are landing.
Set up monitoring in EurekaTest white space before drafting
Under-claimed combinations, such as bundling coil-driven magnetic control with newer chamber materials, are worth checking for prior art density before investing in a full application.
Explore white space in EurekaCommon questions on magnetron sputter coating patents
This landscape is built on 2,755 published records filed or published between 2015 and 2026, and the assignee ranking is counted in patent families rather than raw documents so repeat filings across jurisdictions do not inflate any one applicant's position. Because publication lags filing by roughly 18 months, the true count for 2025 and 2026 will keep rising as those applications publish. Treat the total as a snapshot at the 2026-08-31 data cut-off, not a final figure.
No — filing peaked at 63 in 2018 and has since declined; the most reliable recent comparison, 2021 to 2024, shows a drop from 57 to 35 filings, a 39% fall. That is a genuine deceleration in a process technology that has been in commercial use for decades, not evidence that the technology is being abandoned. Filings on adjacent hardware, such as electron-and-discharge-tube claims under H01J, have continued alongside the core coating claims, which suggests engineering effort is shifting toward chamber and source design rather than disappearing.
The ranking covers the leading 100 companies by family count within this dataset, with the top-ranked assignee holding 195 records and fifth place at 60. The top 5 combined hold 19.7% of all 2,755 records in scope, and the top 10 combined hold 28.0% — meaningful positions, but far short of control of the field. A long tail of lower-volume filers holds the remainder, so freedom-to-operate work needs to look well past the named leaders.
CA1242991A, granted in 1988 to Novellus Systems, claims a magnetron sputter source that uses an adjustable electromagnetic coil in place of fixed permanent magnets, letting a single source handle targets ranging from nonmagnetic to highly ferromagnetic. Its relevance today is as foundational prior art: any coil-driven or variable-magnetic-field magnetron source design should be checked against it and its citing family, since design-arounds for older permanent-magnet-only claims may not clear a coil-based approach. It is a citation anchor rather than an active blocking claim after this length of time, but it shapes how later coil-based claims were drafted.
Core coating claims under C23C appear in 98.7% of the 2,755 records, so that subclass is effectively saturated as a definition of the field rather than a differentiator. Narrower branches carry far lower density: H05H plasma-and-particle-accelerator claims sit in only 2.9% of records, and G02B optical-element claims in 4.2%, both well below the 34.7% carried by H01J chamber and discharge-tube claims. Those lower-density branches are the more promising starting points for a differentiated first claim, provided a prior-art search confirms the specific combination is genuinely open.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.