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Magnetron Sputter Coating Patents: Top Companies & Trends 2026

Magnetron Sputter Coating Patents: Top Companies & Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/physical-vapor-deposition-magnetron-sputter-coating-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Surface Engineering & Coatings
Magnetron sputter coating patents: who holds the claim space and where it is still open

A data-backed view of magnetron sputter coating patent filings: who leads, how concentrated the field is, where filing has slowed since 2021, and which technical branches remain under-claimed.

2,755
Published Records
20%
Top-5 Share of All Records
-39%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth = 2021 (57 records) → 2024 (35); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 2,755 records in scope (CR5), not the ranked leaders only.

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Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

Magnetron sputter coating sits at the intersection of physical vapor deposition process engineering and the plasma hardware that sustains it. This landscape covers 2,755 published records filed or published between 2015 and 2026, spanning claims on magnetron target design, sputtering source geometry, chamber and electrode configuration, and the thin-film products deposited by the process. Because patent families neutralise repeat filings across jurisdictions, the assignee ranking here is built on family counts rather than raw document counts, giving a fairer picture of who actually holds distinct inventions.

Coverage runs through a data cut-off of 2026-08-31, but publication typically lags filing by around 18 months, so the most recent one to two years understate real filing activity. Read the 2024 datapoint as the last complete year in the trend, and treat everything after it as still filling in.

Filing activity and technology composition, 2015-2026
  1. 1OERLIKON SURFACE SOLUTIONS AG PFAFFIKON195
  2. 2APPLIED MATERIALS INC147
  3. 3TEER COATINGS75
  4. 4EVATEC AG66
  5. 5HON HAI PRECISION INDUSTRY CO LTD60
  6. 6HONG FU JIN PRECISION IND (SHENZHEN) CO LTD57
  7. 7TOKYO ELECTRON LTD49
  8. 8PREMARK RWP HLDG48
  9. 9FRAUNHOFER GESELLSCHAFT ZUR FORDERUNG DER ANGEWANDTEN FORSCHUNG EV41
  10. 10VARIAN MEDICAL SYSTEMS INC34
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Physical Vapor Deposition: Magnetron Sputter Coating Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Numbers

Filing trend and technology composition

Two views of the same 2,755 records: how filing volume has moved year over year, and which IPC subclasses the claims actually sit in. Because a single record can carry several IPC codes, the composition shares add up to well over 100% of the record total — that is expected, not an error.

Filing rose to a 2018 peak, then fell

Annual filings climbed from 53 in 2017 to a peak of 63 in 2018, then eased off. The most reliable recent signal is the 2021-to-2024 span, where filings fell from 57 to 35 — a 39% drop over three years. Treat 2025 and 2026 as provisional given publication lag.

Filing rose to a 2018 peak, then fell020406080532017632018201920202021202220232024202562026Most recent year is partial — publication lag means later filings are not yet visible.

Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.

C23C and H01J dominate; the rest is a long tail

C23C coating and surface deposition claims appear in 98.7% of records, effectively the definition of the field. H01J electron-and-discharge-tube claims sit inside 34.7% of records, confirming that most inventions bundle chamber or plasma-source hardware with the film-forming step. Beyond those two, B32B layered products (9.1%), H10P (7.9%), H01L semiconductor devices (7.7%), C03C glass and enamel (6.4%) and G02B optics (4.2%) mark narrower, application-specific branches.

C23C and H01J dominate; the rest is a long tailC23C · Coating & surface deposition2,71898.7%H01J · Electron & discharge tubes95734.7%B32B · Layered products & laminates2509.1%H10P2177.9%H01L · Semiconductor devices2137.7%C03C · Glass & enamel compositions1756.4%G02B · Optical elements & systems1174.2%H05H · Plasma & particle accelerators792.9%Other1,61058.4%

Shares are the percentage of the 2,755 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Physical Vapor Deposition: Magnetron Sputter Coating Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The prior art anchoring this field

Representative record
CA1242991A1988-10-11

CA1242991A — Magnetron sputter coating source for both magnetic and nonmagnetic target materials

NOVELLUS SYSTEMS INC.

A magnetron sputter coating source built to handle sputter targets ranging from nonmagnetic to highly ferromagnetic, replacing fixed permanent magnets with an electromagnetic coil whose energising current is widely adjustable. That adjustability lets the source accommodate large-inventory magnetic targets and gives direct control over the electrical impedance of the glow discharge through coil current alone.Filed by Novellus Systems Inc., granted 1988-10-11 — a foundational design still cited by later coil-driven and variable-field magnetron sources.

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Most-cited records in scope
#Publication no.Patent titleCitations
1US20040094402A1Self-ionized and capacitively-coupled plasma for sputtering and resputtering665
2US4851095AMagnetron sputtering apparatus and process547
3US20040063320A1Manufacturing apparatus and method for large-scale production of thin-film solar cells455
4US20170032942A1Surface coating for chamber components used in plasma systems375
5US4812217AMethod and apparatus for feeding and coating articles in a controlled atmosphere357
6US6679981B1Inductive plasma loop enhancing magnetron sputtering334
7US6365010B1Sputtering apparatus and process for high rate coatings311
8US6251242B1Magnetron and target producing an extended plasma region in a sputter reactor299
9US6027766APhotocatalytically-activated self-cleaning article and method of making same287
10US5922176ASpark eliminating sputtering target and method for using and making same287

Ranked by citation count within this search corpus. Older records accumulate citations simply by being available longer, so treat this as a signal of influence on later filers, not a measure of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Physical Vapor Deposition: Magnetron Sputter Coating Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for filing strategy

Read together, the concentration figures, the trend, and the technology composition point to a field that is broad in application but not tightly controlled by any one filer.

Concentration
19.7%
of 2,755 records held by the top 5 assignees combined

No single gatekeeper

The leader holds 195 records, but the top 5 combined still account for only 19.7% of all 2,755 records in scope, and the top 10 combined reach 28.0%. That is meaningful share, not control — freedom-to-operate work has to look past the leader to a genuine long tail of single- and low-filing entrants.

Top 10 combined: 772 records, 28.0% of scope
Filing momentum
-39%
change in annual filings, 2021 to 2024

Cooling, not collapsing

Annual filings fell from 57 in 2021 to 35 in 2024, a 39% decline over that span, after peaking at 63 in 2018. That is a real deceleration in a maturing process technology, not a sign the underlying deposition method is being abandoned — chamber and hardware claims (H01J) keep pace with core coating claims.

Peak year: 2018 at 63 filings
Claim bundling
34.7%
of records also carry H01J electron/discharge-tube claims

Hardware and film claims travel together

C23C coating claims appear in 98.7% of records, essentially defining the field, but more than a third of records also claim H01J plasma or discharge-tube elements. Filing a coating-only claim without addressing the source hardware around it leaves an opening that a third of the field has already closed.

B32B laminate claims: 9.1% of records
Geographic filing
947
US-received filings, the largest single office

US and EPO carry the bulk of filing activity

The United States receives the largest share of filings (947), followed by the EPO (506) and WIPO/PCT filings (253), with South Korea, Canada and Australia each in triple digits. A freedom-to-operate search limited to one jurisdiction will miss a meaningful share of the active claim set.

EPO: 506 · WIPO/PCT: 253 · South Korea: 189
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Physical Vapor Deposition: Magnetron Sputter Coating Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The figures above answer where the field stands. The next step is applying them to a specific filing decision.

Map a specific claim against the ranked leaders

Run a target claim against the assignees who hold the densest coating and chamber-hardware positions before committing drafting time to that branch.

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Track the H01J and B32B branches for movement

These narrower subclasses carry lower filing density than core C23C claims — a useful early-warning list for shifts in where new applications are landing.

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Test white space before drafting

Under-claimed combinations, such as bundling coil-driven magnetic control with newer chamber materials, are worth checking for prior art density before investing in a full application.

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Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Physical Vapor Deposition: Magnetron Sputter Coating Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on magnetron sputter coating patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Physical Vapor Deposition: Magnetron Sputter Coating Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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