Piezoelectric Ceramics Patents: Who Leads, Where the Gaps Are 2026
- Filing has cooled since its 2024 peak. 40 families in 2024 gave way to a lighter 2025-2026, though the final year is still filling in as publications lag filing.
- Three IPC subclasses carry almost all the volume. H10N, H01L and C04B each cover roughly half of the 876 families, while B41J, H03H and H04R sit far behind as thinner, more specialised claim territory.
- The largest assignees have gone quiet in the latest year. Names like General Electric, Canon, Murata and Panasonic show zero filings in the most recent year tracked, leaving momentum open to newer entrants.
Filing growth compares 2021 (36 records) with 2024 (40) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 876 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This landscape tracks 876 patent families published between 2015 and mid-2026 that combine piezoelectric ceramic composition language with device-level claim terms such as poling, depolarization temperature, actuator displacement and energy harvesting. The search string deliberately pairs a materials phrase with an application phrase, so the corpus sits at the intersection of ceramics chemistry and solid-state device engineering rather than either field alone.
Filing is spread across three core IPC subclasses — solid-state devices, semiconductor devices and ceramics — with smaller but distinct pockets in vibration generation, audio transducers, printing and impedance filtering. The United States and China together receive the majority of filings, with Europe, WIPO and Japan making up most of the remainder.
Filing trend and technology composition
Annual filing counts and IPC distribution for the 876 families in this corpus, drawn directly from the underlying dataset.
A peak in 2024, then a pullback
Filings rose from 28 in 2017 to a peak of 40 in 2024, passing through 32 at the 2022 midpoint. The 2025-2026 figures trail off, but because publication typically lags filing by around 18 months, the most recent one to two years understate actual filing activity rather than confirm a real decline.
Three subclasses dominate, five others are thin
H10N (509 records), H01L (493) and C04B (474) between them cover almost all of the corpus, reflecting how tightly device claims, semiconductor-adjacent claims and ceramics composition claims overlap in this field. H02N, B06B, H04R, B41J and H03H each sit well under 80 records, marking narrower, more specialised application areas rather than core contested ground.
Shares are the percentage of the 876 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Piezoelectric Ceramics and Devices with Eureka
This page is one run against one query. Ask Eureka your own question about piezoelectric ceramics and devices and every answer comes back with the patent numbers behind it.
Try EurekaRepresentative and most-cited filings
Lead-free piezoelectric ceramic films and a method for making thereof
This invention relates to a method of making lead-free piezoelectric ceramic films. Specifically, the invention is directed to a method for fabricating lead-free piezoelectric free standing films having enhanced piezoelectric properties. The films may be used for a number of applications including incorporation in microelectronic devices such as energy harvesting devices and sensor technologies.Filed by Drexel University, published 2014-01-02, this application sits at the boundary of the corpus window and illustrates the lead-free composition route that much of the later filing builds on.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20070257634A1 | Self-powered portable electronic device | 360 |
| 2 | US5844349A | Composite autoclavable ultrasonic transducers and methods of making | 227 |
| 3 | US5340510A | Method for making piezoelectric ceramic/polymer composite transducers | 212 |
| 4 | US6088894A | Methods of making composite ultrasonic transducers | 209 |
| 5 | US4999819A | Transformed stress direction acoustic transducer | 170 |
| 6 | US5392259A | Micro-grooves for the design of wideband clinical ultrasonic transducers | 136 |
| 7 | US4812698A | Piezoelectric bending actuator | 116 |
| 8 | US4786837A | Composite conformable sheet electrodes | 115 |
| 9 | US8703040B2 | Method for manufacturing a piezoelectric ceramic body | 102 |
| 10 | US5702629A | Piezeoelectric ceramic-polymer composites | 97 |
Citation counts reflect influence within this searched corpus and skew toward older filings; treat them as a marker of prior-art density, not current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Browse MCP servers →What the filing pattern signals
Reading the IPC spread, the office distribution and the citation table together points to where claim space is dense and where it has room.
Growth has flattened, not accelerated
Filing climbed from 28 families in 2017 to a peak of 40 in 2024 before easing off. That is a mature, cyclical pace rather than a technology in a growth phase — new entrants are more likely to be filling gaps than racing to stake early claims.
Device claims outweigh pure materials claims
H10N and H01L together outnumber the core ceramics subclass C04B, showing that most contested claim territory is in how the ceramic is integrated into a device — electrodes, layering, actuation — rather than in the ceramic composition itself.
Ultrasonic transducer art anchors the field
The most-cited records are transducer and composite-manufacture patents from the 1990s and a 2007 self-powered device filing. Their citation weight reflects age and foundational status in the corpus, not present-day filing priority.
Established players have stopped filing recently
Several of the largest historical filers, including General Electric, Canon, Murata and Panasonic, show no filings in the latest tracked year. That pause does not mean the technology is abandoned; it more likely reflects portfolio consolidation or a shift to trade-secret protection for incremental improvements.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to piezoelectric ceramics and devices, with the prior art for and against each one.
Assignees and collaboration patterns
Filing is led by a mix of industrial conglomerates, ceramics specialists and universities, with co-filing concentrated in a small number of repeated pairings.
Collaboration is limited and specific
Only ten co-assignee pairs appear in the corpus. The strongest pairing links Xerox with the National Research Council of Canada, followed by Canon with University of Yamanashi and Xi'an Jiaotong University with the National Institute for Materials Science, suggesting durable, project-level partnerships rather than broad industry alliances.
US and China dominate filing venue
The United States receives the largest share of filings at 301, with China close behind at 224. Europe, WIPO and Japan together account for a smaller but still meaningful share, indicating that protection strategies are concentrated in the two largest device markets.
Historical leaders have gone quiet
General Electric, Saudi Basic Global Technologies, Canon, Penn State Research Foundation, Murata and Panasonic all show no filings in the most recent year. Whether this reflects genuine pullback or a publication-lag artefact will only become clear as later-year data fills in.
| Assignee | Recent year | YoY |
|---|---|---|
| General Electric | 0 | — |
| Saudi Basic Global Technologies (SABIC) | 0 | — |
| Canon | 0 | — |
| Penn State Research Foundation | 0 | — |
| Murata Manufacturing | 0 | — |
| Panasonic | 0 | — |
| Kyocera | 0 | — |
| Hewlett-Packard Development Company, L.P. | 0 | — |
Where to take this analysis
The dataset points to specific next steps depending on whether the goal is freedom-to-operate, licensing or new filing strategy.
Check the thin IPC branches for open claims
B41J, H03H and H04R carry a fraction of the volume in H10N, H01L and C04B. Before assuming crowding, run a targeted search inside these narrower subclasses to see whether the low count reflects real white space or simply a smaller application market.
Explore IPC white space in EurekaWatch for re-entry from quiet assignees
Six major historical filers show zero activity in the latest year. A resumed filing from any of them, especially paired with a new co-assignee, would be an early signal of a strategic pivot back into this space.
Track assignee activity in EurekaCommon questions about piezoelectric ceramics patents
PZT (lead zirconate titanate) patents cover the long-established, highest-performance piezoelectric ceramic composition, while lead-free piezoelectric patents cover alternative compositions developed to avoid lead content for environmental and regulatory reasons. This corpus includes both search terms because device and manufacturing claims often apply to either material family. Lead-free filings, such as the representative Drexel University application in this dataset, tend to emphasize achieving comparable piezoelectric coefficients without lead, which remains an active area of claim activity even as overall filing has flattened.
Filing in this corpus is led by a mix of large industrial conglomerates, ceramics and electronics specialists, and research universities, with no single company holding an overwhelming share. Notably, several historically prominent filers, including General Electric, Canon, Murata and Panasonic, show no filings in the most recent tracked year, which opens room for newer entrants to build position. Reviewing the full assignee ranking alongside recent-year momentum gives a more accurate picture than relying on historical totals alone.
Patent applications typically publish around 18 months after they are filed, so any year close to the data cut-off will always show fewer records than were actually filed. In this dataset the trend runs through 2026, and the drop-off in the final year or two reflects this publication lag rather than a genuine collapse in filing activity. The more reliable read is the trend up to the 2024 peak, with later years treated as provisional.
The core claim territory in this corpus sits in three IPC subclasses covering solid-state devices, semiconductor devices and ceramics composition, which together account for the vast majority of records. Narrower subclasses covering printing applications, impedance filters and audio transducers carry far fewer filings, which can indicate either genuine open space or simply a smaller application market. A freedom-to-operate search focused on those thinner subclasses, cross-checked against actual product categories, is the fastest way to confirm which explanation applies.
US20140004000A1, filed by Drexel University, claims a method for fabricating lead-free piezoelectric free-standing films with enhanced piezoelectric properties for uses including energy harvesting and sensors. Anyone developing a similar fabrication method for lead-free films should review its specific process claims closely, since overlapping method steps rather than the general concept of lead-free piezoelectrics are what would create a conflict. Designing around it typically means varying the fabrication process itself, such as deposition method or film-forming technique, rather than the target material composition alone.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.