https://www.patsnap.com/resources/blog/rd-blog/polyimide-molding-process-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Polymers & Composites
Polyimide Molding Process Patents: Who Holds the Claim Space
  • Filing has flattened since its 2020 peak. 45 families filed that year against 32 at the 2022 midpoint and 7 so far in the most recent (partial) year — a plateau, not a growth curve.
  • Europe and Japan outpace the US as filing destinations. 289 EPO and 278 Japan filings sit ahead of 214 US filings, meaning a US-only clearance search misses most of the record.
  • Every top assignee shows zero filings in the latest year. The six most active filers — spanning Japanese, Chinese and US-headquartered entities — all recorded no new filings in the most recent year tracked.
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1,115
Published Records
39%
Top-5 Share of All Records
-24%
Filing Growth 2021→2024
EP
Leading Jurisdiction

Filing growth compares 2021 (29 records) with 2024 (22) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 1,115 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This landscape tracks 1,115 patent families filed against a search string combining polyimide and polyimide film terms with molding-process language — compression molding, film casting, extrusion molding, shaping process — restricted to the core IPC classes for polymer shaping (C08J5/18, B29C43, C08L79/08). The window runs from 2015 through the 2026 data cut-off, with the most recent year necessarily partial since publication typically lags filing by around eighteen months.

The technology composition skews heavily toward polymer chemistry classes — C08L, C08G, C08J and C08K together account for the bulk of records — with process-hardware classes B29C and B29K present but smaller. That split says the claim space is dominated by formulation and film-property work built around molding steps, rather than by molding equipment itself.

Filing activity and technology composition, 2017–2026
  1. 1MITSUI CHEMICALS INC199
  2. 2MITSUBISHI GAS CHEM CO INC81
  3. 3EI DU PONT DE NEMOURS & CO66
  4. 4UBE CORPORATION53
  5. 5SABIC INNOVATIVE PLASTICS IP BV40
  6. 6TORAY INDUSTRIES INC34
  7. 7KANEKA CORP31
  8. 8SABIC GLOBAL TECHNOLOGIES BV30
  9. 9NTN CORP23
  10. 10SHPP GLOBAL TECH BV23
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Polyimide Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The numbers

Filing trend and technology mix

Two views of the same 1,115-family dataset: activity over time, and where those families sit across the polymer and processing IPC classes.

A decade of filings, peaking in 2020

Annual filings rose from 18 in 2017 to a peak of 45 in 2020, held near 32 at the 2022 midpoint, and have since declined toward 7 in the most recent partial year. Read the tail end as an artefact of publication lag, not a real drop-off — but the shape from 2017 to 2022 is a genuine plateau after growth, not sustained expansion.

A decade of filings, peaking in 2020013253850182017201820194520202021202220232024202572026Most recent year is partial — publication lag means later filings are not yet visible.

Polymer chemistry classes dominate over process hardware

C08L (polymer compositions, 885 records) and C08G (condensation polymers, 515) lead the IPC composition, with C08J (polymer processing, 431) and C08K (additives, 366) close behind. B29C (shaping of plastics, 207) and B29K (moulding materials index, 108) are present but represent a minority share — most of the documented invention activity concerns what goes into the polyimide, not the equipment that shapes it.

Polymer chemistry classes dominate over process hardwareC08L · Polymer compositions88579.4%C08G · Condensation polymers51546.2%C08J · Polymer processing & solutions43138.7%C08K · Use of additives in polymers36632.8%B29C · Shaping of plastics20718.6%B29K · Plastics moulding materials (i…1089.7%H05K · Printed circuits & assemblies998.9%B32B · Layered products & laminates968.6%Other62255.8%

Shares are the percentage of the 1,115 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Polyimide Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Representative filing

A representative record from the corpus

Representative record
EP0431636A11991-06-12

EP0431636A1 — Extruded multi-layer polyimide film and process for its production

UBE INDUSTRIES LIMITED

An extruded multi-layer polyimide film comprises at least one thin layer with a thickness of not more than 10 µm comprising an aromatic polyimide derived from an aromatic tetracarboxylic acid compound and an aromatic diamine having two or more benzene rings, unitarily arranged on a base layer comprising an aromatic polyimide derived from a biphenyltetracarboxylic acid compound and a phenylene diamine. The film is produced by multi-layer extrusion molding — a casting method of casting solution.Filed by UBE INDUSTRIES LIMITED; illustrates the layered-film, casting-based approach that recurs across the most-cited records in this set.

EP0431636A1 — patent drawing 1EP0431636A1 — patent drawing 2
View full record
Most-cited records in this landscape
#Publication no.Patent titleCitations
1US4595548AProcess for preparing essentially colorless polyimide film containing phenoxy-linked diamines250
2US4603061AProcess for preparing highly optically transparent/colorless aromatic polyimide film184
3US6919422B2Polyimide resin with reduced mold deposit171
4JP1986264028APolyimide film having high dimensional stability and production thereof94
5US4895972AProcess for lowering the dielectric constant of polyimides using diamic acid additives92
6US6150456AHigh dielectric constant flexible polyimide film and process of preparation89
7US6159611AHigh dielectric constant flexible polyimide film and process of preparation82
8US5670052ASeparating aromatics from non-aromatics by polyimide-polyester membrane77
9US7026032B2Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolym…73
10US4816516APolyimide resin-fluoropolymer compositions64

Citation counts favour older filings simply because they have had more time to be cited — read them as a signal of historical influence within this search corpus, not as a ranking of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Polyimide Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Signals

What the data implies for filing strategy

Four patterns stand out once the raw counts are read against each other.

Filing trajectory
45 → 7
peak year to latest partial year

Growth has stalled, not accelerated

After rising from 18 filings in 2017 to a peak of 45 in 2020, annual filings held near the 2022 midpoint of 32 before tapering. Even allowing for publication lag on the most recent years, the underlying trend from 2017 to 2022 is flat-to-declining rather than expanding.

Filing trend, 2017-2026
Jurisdiction split
289 EPO vs 214 US
receiving-office filings

Europe and Japan lead the filing map

EPO (289) and Japan (278) each exceed US filings (214), with China (142), WIPO/PCT (54) and Canada (30) trailing. A clearance or freedom-to-operate search confined to US filings would miss the majority of the documented record.

Receiving offices
Claim density
885 C08L records
largest IPC subclass

Formulation claims outweigh process-hardware claims

C08L (polymer compositions) alone touches 885 of the 1,115 records, roughly four times the count in B29C (shaping of plastics, 207). Most of the occupied claim space concerns the polyimide formulation itself, with molding-equipment claims comparatively thin.

IPC composition
Collaboration pattern
10 co-assignee pairs
across the dataset

Collaboration is sparse and clustered around one filer

Only ten co-assignee pairs appear across the entire dataset, and the strongest three all involve the same corporate assignee paired with different named inventors. Most filers in this space patent independently rather than through joint ownership.

Co-assignee network
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Co-assignee network
AssigneeCo-assigneeShared families
SABIC Innovative Plastics IP B.V.ODLE ROY RAY10
SABIC Innovative Plastics IP B.V.MULLEN TARA J8
SABIC Innovative Plastics IP B.V.HAGBERG ERIK8
SABIC Innovative Plastics IP B.V.CHAN KWOK PONG8
Mitsui Chemicals, Inc.NTN Corporation7
NTN CorporationYOBEA RULON INDS7
Mitsui Chemicals, Inc.NTN RULON CORP4
E. I. du Pont de Nemours and Company (DuPont)ZAHR GEORGE ELIAS4

The strongest co-assignee links all run through a single corporate filer paired with different named inventors — a sign of internal inventor teams rather than cross-company joint filing.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Polyimide Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Assignees

Who holds the claim space

The most active filers span Japanese, Chinese and US-headquartered organisations, but recent-year activity across all of them has gone quiet.

Filing scale
1,115 families
across the ranking

Concentration sits among a small set of repeat filers

The assignee ranking spans 1,115 patent families, but recent-year momentum data shows the same handful of names — spanning UBE, Toray, DuPont, Mitsubishi Gas Chemical, Mitsui Chemicals and SABIC's IP entity — recurring at the top across the full window.

Assignee ranking
Recent momentum
0 in latest year
across six leading assignees

The leaders have all gone quiet in the most recent year

Every one of the six most-tracked assignees — including UBE, Toray, DuPont and both major Japanese and Chinese chemical groups — shows zero filings in the latest year in this dataset. That is consistent with publication lag rather than a real exit, but it means recent competitive moves are not yet visible here.

Momentum by assignee
Collaboration
10 pairs, one hub
co-assignee network

Joint filing is rare and internally clustered

Only ten co-assignee pairs exist in the dataset, and the three strongest all pair the same corporate assignee with different named inventors rather than with another company. Cross-company joint ownership is effectively absent from this landscape.

Co-assignee pairs
🔍
Where the claim space is thinner
Sub-areas that sit outside the dense formulation clusters and away from the most-cited prior art.
Multi-layer extrusion casting for sub-10µm layersLow-dielectric-constant diamic acid additive systemsPrinted-circuit-integrated polyimide film (H05K overlap)Laminate/lay-up structures (B32B overlap)Mold-deposit-reducing resin formulations
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Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Mitsui Chemicals, Inc.0
Mitsubishi Gas Chemical Company, Inc.0
E. I. du Pont de Nemours and Company (DuPont)0
SABIC Innovative Plastics IP B.V.0
UBE Corporation0
Toray Industries, Inc.0
Kaneka Corporation0
General Electric Company0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Polyimide Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Next steps

Where to take this next

The dataset points to specific follow-up work rather than a single conclusion.

Map the formulation-vs-process split claim by claim

With C08L formulation classes outweighing B29C process classes roughly four to one, a claim-level read of the process-hardware filings would clarify how much genuine freedom to operate exists on the equipment side.

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Watch for the publication-lag catch-up

Zero recent-year filings across every leading assignee is most likely a reporting artefact; revisit this trend once filings from the last 18 months have published to see whether the plateau holds.

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Check jurisdiction coverage against your target markets

With EPO and Japan filings each ahead of US filings, any freedom-to-operate work should extend beyond a US-only search.

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Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Polyimide Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Polyimide Molding Process covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.