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Binder Jetting Post-Processing Patents: Who Leads, Trends 2026

Binder Jetting Post-Processing Patents: Who Leads, Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/post-processing-of-binder-jetted-and-sintered-parts-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Additive Manufacturing
Post-Processing of Binder Jetted and Sintered Parts: Patents Behind Distortion Control, HIP and Infiltration
  • Filing has cooled since 2019. the peak year at 250 records has given way to a flat-to-declining trend through the 2022 midpoint of 216, with 2026 figures still partial.
  • No single company dominates. the leader holds 194 records and the top 5 combined account for just 10.2% of all 7,275 records in scope — this is a fragmented field, not a gated one.
  • Ceramics and powder metallurgy overlap heavily. C04B and B22F each cover roughly 40% of records, meaning most filings sit at the intersection of ceramic and metal powder processing rather than in either alone.
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7,275
Published Records
10%
Top-5 Share of All Records
-10%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··8 min readSourced from Patsnap Eureka
Field Overview

What this landscape covers

Binder jetted and sintered parts leave the printer or green stage with dimensional distortion, open porosity and rough surfaces that have to be corrected before the part is usable. This landscape tracks the patent activity around that correction step: sintering support strategy to control shrinkage and warp, hot isostatic pressing to close residual porosity, infiltration to fill pore networks with a secondary phase, and surface finish improvement for parts coming off high-throughput batch furnaces. The search string pairs post-processing-specific terms with the broader sintering and infiltration literature, which is why ceramics (C04B) and powder metallurgy (B22F) classes carry the largest share of records.

7,275 records are in scope, spanning filings from 2015 through a partial 2026 cut. Because publication lags filing by roughly 18 months, the most recent one to two years of the trend will read lower than final filing volumes turn out to be.

Filing activity and technology composition, 2017-2026
  1. 1NITTO DENKO CORP194
  2. 2BAKER HUGHES CO150
  3. 3PROTERIAL LTD147
  4. 4TOSOH CORP129
  5. 5SUMITOMO ELECTRIC INDUSTRIES LTD120
  6. 6GENERAL ELECTRIC CO93
  7. 7KENNAMETAL INC91
  8. 8SHIN ETSU CHEMICAL CO LTD88
  9. 9SANDVIK INTELLECTUAL PROPERTY AB87
  10. 10MITSUBISHI MATERIALS CORP87
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Post-Processing of Binder Jetted and Sintered Parts covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Numbers

Filing trend and technology composition

Two views of the same 7,275 records: how filing volume has moved year over year, and which IPC subclasses the underlying technology actually sits in.

A peak in 2019, then a plateau

Filings ran from 241 in 2017 to a peak of 250 in 2019, held near 216 at the 2022 midpoint, and stood at 29 in 2026 — a partial year given the mid-2026 data cut-off rather than evidence of collapse. Read the last one to two years as undercounted, not as a real drop-off.

A peak in 2019, then a plateau063125188250241201720182502019202020212022202320242025292026Most recent year is partial — publication lag means later filings are not yet visible.

Ceramics and powder metallurgy dominate, additive-specific classes are thin

C04B (ceramics, cement and refractories) covers 40.4% of the 7,275 records and B22F (powder metallurgy) covers 38.7%, with C22C (alloys) at 27.8% close behind — these three overlap on most records, reflecting how post-processing patents typically claim a material system alongside a process. B33Y, the classification code specific to additive manufacturing, appears on only 3.9% of records, which says the post-processing art here is still largely filed as sintering and metallurgy know-how rather than as 3D-printing-specific claims.

Ceramics and powder metallurgy dominate, additive-specific classes are thinC04B · Ceramics, cement & refractories2,94040.4%B22F · Powder metallurgy2,81238.7%C22C · Alloys2,02427.8%C23C · Coating & surface deposition7069.7%H01F · Magnets, inductors & transform…3995.5%B33Y · Additive manufacturing (3D pri…2823.9%H01L · Semiconductor devices2733.8%B28B · Shaping clay & cement products2203.0%Other5,02969.1%

Shares are the percentage of the 7,275 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Post-Processing of Binder Jetted and Sintered Parts covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Prior Art

Most-cited records and a representative filing

Representative Filing
US20200215613A12020-07-09

US20200215613A1 — High-throughput hot isostatic pressing micro-synthesis for combinatorial materials

CENTRAL IRON AND STEEL RESEARCH INSTITUTE

The invention relates to a method of high-throughput hot isostatic pressing micro-synthesis for combinatorial materials and a sleeve mould. The mould comprises a honeycomb-array-sleeve and an upper cover with an exhaust tube; single cells inside the honeycomb-array-sleeve are filled with powder materials, the upper cover is sealed onto the sleeve by welding, and the assembly is processed as a batch under hot isostatic pressing.Filed by Central Iron and Steel Research Institute, published 2020-07-09.

US20200215613A1 — patent drawing 1US20200215613A1 — patent drawing 2
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Highest-citation records in the corpus
#Publication no.Patent titleCitations
1US6136948ASinterable semi-crystalline powder and near-fully dense article formed therewith701
2WO1996006881A2Sinterable semi-crystalline powder and article formed therewith687
3US5431967ASelective laser sintering using nanocomposite materials401
4US5745834AFree form fabrication of metallic components371
5US6676892B2Direct selective laser sintering of metals370
6US20070102199A1Earth-boring rotary drill bits and methods of manufacturing earth-boring rotary drill bits having particle-ma…316
7US4499048AMethod of consolidating a metallic body302
8US5997795AProcesses for forming photonic bandgap structures284
9US5640667ALaser-directed fabrication of full-density metal articles using hot isostatic processing266
10US20130136868A1Selective laser melting / sintering using powdered flux237

Citation counts favour older records simply because they have had more time to accumulate citations within this searched corpus — treat them as a marker of influence on later filings, not as a signal of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Post-Processing of Binder Jetted and Sintered Parts covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Reading the Data

What the concentration and trend numbers mean for filing strategy

Three figures worth sitting with before deciding where to file or search for prior art.

Concentration
10.2%
top 5 share of 7,275 records

The top of the field is thin

The leading assignee holds 194 records and the top 5 combined reach only 10.2% of all 7,275 records in scope. Compare that with the top 10 at 16.3% — each additional five assignees adds only about six points of share, which points to a long tail of single- and few-filing entrants rather than a handful of firms locking up the space.

Fragmented ownership, not a gated field.
Trend
250 → 29
peak (2019) vs. latest partial year

Momentum has flattened, not accelerated

Filing peaked in 2019 and the 2022 midpoint of 216 shows a field that is flat to declining rather than growing. Several of the largest assignees by cumulative volume show zero filings in the latest year, which is consistent with either a maturing patent position or reporting lag rather than exit from the technology.

Treat the final two years as undercounted.
Overlap
40.4% + 38.7%
C04B and B22F shares of 7,275 records

Ceramics and metal powder claims overlap heavily

C04B and B22F each cover roughly two-fifths of records, and C22C adds another 27.8% — most filings in this dataset combine a material system claim with a process claim rather than isolating either. B33Y, the code specific to additive manufacturing, sits at just 3.9%, so purely print-process claims are comparatively rare here.

Material-plus-process claims are the norm.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to post-processing of binder jetted and sintered parts, with the prior art for and against each one.

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Co-assignee activity is sparse
AssigneeCo-assigneeShared families
Sandvik Intellectual Property ABEuropean Tungsten Powder Company10
Proterial, Ltd.Hitachi, Ltd.9
Mitsubishi Materials CorpInternational Superconductivity Technology Center9
Baker Hughes CoEASON JIMMY W8
Proterial, Ltd.Hitachi Medical Corporation6
Baker Hughes CoSTEVENS JOHN H6
Mitsubishi Materials CorpHitachi, Ltd.6
Kennametal IncLIU YIXIONG5

Only 10 co-assignee pairs appear across the dataset, and the strongest pairs cluster around two or three named organisations working together repeatedly rather than a broad collaboration network — most filing here is done by single assignees.

Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Post-Processing of Binder Jetted and Sintered Parts covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Competitive Landscape

Assignees and where the claim space is still open

The ranked leaders span materials suppliers, sintered-component makers and toolmakers rather than a single dominant player, and recent-year filing has gone quiet even among the largest cumulative filers.

Leader position
194 records
top-ranked assignee

A modest lead, not a monopoly

The top-ranked assignee holds 194 records against a fifth-place figure of 120 and a tenth-place figure of 87 — the drop-off from first to tenth is gradual rather than a cliff, consistent with a field where process know-how is distributed across many material and equipment specialists.

Ranking covers 100 assignees, the full set returned.
Recent momentum
0 in latest year
across several top cumulative filers

Large cumulative filers have gone quiet recently

Several of the assignees with the largest cumulative record counts show zero filings in the latest year. That is consistent with granted portfolios being defended rather than expanded, or with publication lag masking filings not yet visible — either way, recent activity does not track cumulative rank.

Cross-check any single assignee before assuming exit.
Collaboration
10 pairs
co-assignee pairs in the dataset

Filing is mostly solo

With only 10 co-assignee pairs identified and the strongest pair appearing 10 times, joint filing is the exception in this landscape. Toolmakers and materials suppliers each tend to file under their own name rather than in joint ventures.

Watch for exceptions as a signal of a specific technical partnership.
🔍
Under-claimed branches worth a closer look
Sub-areas where filing density is comparatively light relative to the core sintering and HIP claims
batch furnace load optimisationpost-print surface finish for ceramicsdistortion-compensating support geometryinfiltration alloy selection for porosity gradingcombinatorial HIP fixture design
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Nitto Denko Corp0
Proterial, Ltd.0
Baker Hughes Co0
Tosoh Corp0
Sumitomo Electric Industries, Ltd.0
General Electric Co0
Kennametal Inc0-100%
Mitsubishi Materials Corp0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Post-Processing of Binder Jetted and Sintered Parts covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Next Steps

Where to take this analysis

The dataset points to a fragmented, flattening field with heavy overlap between ceramic and metal-powder claims — the next step is usually narrowing to a specific process branch or assignee.

Search prior art on a specific sub-branch

Distortion-compensating support geometry and infiltration alloy selection show lighter filing density than core sintering and HIP claims — worth a targeted freedom-to-operate check before committing to a claim there.

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Track a specific assignee's recent activity

Cumulative rank and recent-year filing diverge sharply for several top assignees here, so a portfolio-level check matters more than the overall ranking.

Monitor assignee activity in Eureka →
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Post-Processing of Binder Jetted and Sintered Parts covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Post-Processing of Binder Jetted and Sintered Parts covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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