This dataset tracks 15 published patent families between 2015 and the 2026 cut-off, filtered specifically to filings that address load transient response, quiescent current, multi-rail integration, efficiency at light load or package thermal claims within H02M, H02J and G05F. That is a narrow, curated slice of the much larger PMIC patent universe rather than a count of every PMIC-related filing. Broader keyword searches without the IPC and claim-language filters would return a substantially larger set.

The tracked assignees in this corpus include Renesas Electronics America, Intersil America, Chengdu Monolithic Power Systems, STMicroelectronics, Texas Instruments and Nuvia, though none show any filings in the most recent reporting year. Rankings in a corpus this size can shift with a single new filing, so treat any leader-follower gap as indicative rather than definitive. The most-cited individual record, on LDO transient response, is a useful signal of technical influence separate from filing volume.

The filing trend in this dataset shows a peak of 4 filings in 2023 following a flat midpoint of zero in 2022, then a decline toward the 2026 cut-off. Part of that recent drop is a reporting artefact: patent publication typically lags actual filing by around 18 months, so 2025 and 2026 figures will rise as later publications are indexed. The 2023 peak itself likely reflects a specific product cycle among one or two assignees rather than an industry-wide surge.

US20240297588A1, filed by Renesas Electronics America and published 2024-09-05, claims a power converter that runs a PMIC in low power mode for an initial load current, then transitions to high power mode by activating an external power module either before or alongside the PMIC's own phase, with the PMIC and external module on separate chips. This specifically covers cross-chip low-to-high power mode transitions and tri-state activation sequencing. Designs that keep the PMIC and its additional current-sourcing phase on a single die, or that use a different transition sequencing, would sit outside this specific claim scope, though a full claim chart is needed before relying on that distinction.

Based on IPC overlap in this corpus, sub-areas like light-load efficiency thresholds for multi-rail PMICs, package thermal claims on stacked-die PMICs, and quiescent current control during tri-state transitions show only light coverage. The core claim density sits in H02M power conversion and G05F control circuitry, with much thinner representation in adjacent classes such as G02F optical control overlap. These thin areas are candidates for new claims, but each needs its own targeted search before assuming the space is genuinely open, since a 15-family corpus can miss adjacent filings outside this exact keyword and IPC scope.