The leading assignee in this dataset holds 47 of the 619 records in scope, with the next four companies combining with it for 180 records — 29.1% of the total. That leaves the majority of filings spread across a long tail of companies with far fewer records each. No single company holds a dominant or blocking position across the field.

Filings rose to a peak of 81 in 2023 after starting at 24 in 2017. Comparing the only two years that can both be treated as complete, filings fell from 76 in 2021 to 50 in 2024, a 34% decline. Because publication typically lags actual filing by around 18 months, the 2025 and 2026 counts in this dataset are still incomplete and should not be read as evidence the field is cooling.

Double-sided cooling attaches heat exchangers to both faces of the semiconductor die stack rather than one, using substrates like direct bonded copper on each side to sandwich the dies. This roughly doubles the heat extraction path and is a recurring claim element in the most-cited records in this dataset. It typically requires more complex die-attach and interconnect processes than single-sided designs, which is reflected in how often sintered die attach and insulation coordination appear alongside it in claims.