Power Modules & Packaging Patents: Top Companies & Trends 2026
Power modules and packaging patents: who is filing, what they claim, and where the gaps are
Concentrated but not dominated. the leading assignee holds 467 records, yet the top 5 combined account for only 10.6% of all 14,129 records in scope — most of the field sits with a long tail of filers. Annual filings rose from 662 in 2017 to a peak of 1,010 in 2023, then eased to 807 by 2024 — a -19% move from the 2021 level of 999. Treat 2025 and 2026 figures as provisional: publication typically lags filing by around 18 months, so the most recent years will fill in as more records publish.
- 1MICRON TECHNOLOGY INC3.3%
- 2MITSUBISHI ELECTRIC CORP2.3%
- 3INFINEON TECHNOLOGIES AG2.1%
- 4HITACHI ENERGY LTD1.5%
- 5WOLFSPEED INC1.4%
See the full power modules & packaging patent landscape analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who are the leading patent filers in power modules and packaging?
The ranked leaders in this dataset are drawn mainly from semiconductor device makers, power conversion specialists and vehicle OEMs, with the top assignee holding 467 records. However, the top 5 combined account for only 10.6% of all 14,129 records in scope, so no single company dominates the field. A meaningful share of activity sits with a long tail of mid-sized filers holding well over 150 records each, which is worth tracking alongside the named leader.
Is patent filing activity in power modules and packaging growing or slowing?
Filings rose steadily from 662 in 2017 to a peak of 1,010 in 2023, then eased to 807 in 2024, a -19% change from the 2021 level of 999. That is a cooling from peak, not a collapse. Figures for 2025 and 2026 should be treated as provisional because publication typically lags actual filing by around 18 months, so the most recent years will continue to fill in as more records publish.
Which technology areas carry the most patent claim density in this field?
Semiconductor device structures, classified under H01L, appear on 28.9% of the 14,129 records in scope, making it the most heavily claimed subclass. Printed circuit and assembly claims (H05K) follow at 19.6%, and power conversion circuitry (H02M) at 19.0%. Because records often carry more than one IPC class, these figures overlap rather than sum to a whole field, but they consistently point to device-level packaging as the densest area to file into.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Power Modules & Packaging Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.