Power Modules & Packaging Patents: Top Companies & Trends 2026
- Concentrated but not dominated. the leading assignee holds 467 records, yet the top 5 combined account for only 10.6% of all 14,129 records in scope — most of the field sits with a long tail of filers.
- Filing growth has cooled, not reversed. filings ran from 999 in 2021 to 807 in 2024, a -19% shift over that span, against a 2023 peak of 1,010 — the most recent years remain incomplete due to publication lag.
- Semiconductor devices dominate the classification mix. H01L appears on 28.9% of records, ahead of printed circuits (H05K, 19.6%) and power conversion (H02M, 19.0%), showing where claim density is heaviest.
Filing growth compares 2021 (999 records) with 2024 (807) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 14,129 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
This dataset tracks patent activity at the intersection of power modules and their physical and electrical packaging — bonding pads, package substrates, thermal interfaces, and the switching-frequency and power-stage circuitry that sits around them. The search spans 14,129 published records filed or published between 2015 and the 2026 data cut-off, covering both discrete power semiconductor packaging and the board-level integration that connects modules into systems.
The scope sits across several IPC subclasses rather than one: semiconductor device structures (H01L), printed circuit assemblies (H05K), power conversion circuitry (H02M), and adjacent classes touching electric vehicles, motors and power supply systems. That spread reflects a field where the packaging problem — getting heat out, current in, and signals through reliably — is solved differently depending on whether the filer is a chipmaker, a systems integrator or a vehicle OEM.
Filing trends and technology composition
Two views of the same 14,129 records: how filing activity has moved year over year, and which IPC subclasses carry the claim density.
Filing trend, 2017–2026
Annual filings rose from 662 in 2017 to a peak of 1,010 in 2023, then eased to 807 by 2024 — a -19% move from the 2021 level of 999. Treat 2025 and 2026 figures as provisional: publication typically lags filing by around 18 months, so the most recent years will fill in as more records publish.
Technology composition by IPC subclass
H01L (semiconductor devices) leads at 28.9% of the 14,129 records in scope, followed by H05K (printed circuits, 19.6%) and H02M (power conversion, 19.0%). Because a single record can carry multiple IPC classes, these shares sum to well over 100% — they describe where claims cluster, not a partition of the field.
Shares are the percentage of the 14,129 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Power Modules & Packaging Patent Landscape with Eureka
This page is one run against one query. Ask Eureka your own question about power modules & packaging patent landscape and every answer comes back with the patent numbers behind it.
Try EurekaA representative record
Parallel fuel cell electrical power system
A parallel fuel cell electrical power system combines multiple fuel cell electrical power modules, each with its own fuel-cell stack, current switch and reverse current protection element, onto a shared DC bus. Connecting the modules in parallel lets fuel-cell stacks with fixed individual power capacity be combined to output a variable range of voltages for a load.Filed by Chung-Hsin Electric and Machinery Manufacturing Corp., published 2011-08-18.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6211626B1 | Illumination components | 2,644 |
| 2 | US20040143297A1 | Advanced automatic external defibrillator powered by alternative and optionally multiple electrical power sou… | 1,510 |
| 3 | US6166496A | Lighting entertainment system | 1,275 |
| 4 | US6528954B1 | Smart light bulb | 1,246 |
| 5 | US20150120094A1 | Unmanned aerial vehicle delivery system | 1,163 |
| 6 | US20190125476A1 | Surgical instrument systems comprising lockout mechanisms | 1,136 |
| 7 | US6340868B1 | Illumination components | 1,122 |
| 8 | US20190125388A1 | Surgical instrument systems comprising handle arrangements | 1,080 |
| 9 | US6459919B1 | Precision illumination methods and systems | 1,062 |
| 10 | US20190125377A1 | Surgical instrument systems comprising battery arrangements | 1,048 |
Citation counts inside a searched corpus tend to favour older records that have had more time to accumulate citations — read them as a signal of influence within this dataset, not as a ranking of current technical importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Three findings that shape where new claims are likely to survive scrutiny and where they are likely to collide with dense prior art.
No single assignee controls the field
The leading assignee holds 467 records out of 14,129, and the top 5 combined reach only 10.6% of all records in scope. That is real leadership, but it leaves the large majority of filing activity spread across a long tail — a structure more open to new entrants than a landscape with a dominant single filer.
Growth has cooled from a 2023 peak
Filings peaked at 1,010 in 2023 after climbing from 662 in 2017, then fell to 807 by 2024 — a -19% shift from the 2021 level of 999. Because publication lags filing by roughly 18 months, the softer 2025-26 figures are not yet a reliable read on current filing intent.
Semiconductor device claims carry the most weight
H01L appears on 28.9% of the 14,129 records, well ahead of printed circuits (H05K, 19.6%) and power conversion circuitry (H02M, 19.0%). Filers targeting device-level packaging structures are entering the most heavily claimed part of the landscape; those working in board-level or system integration have comparatively more room.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to power modules & packaging patent landscape, with the prior art for and against each one.
Who is active, and where momentum is fading
The ranked leaders span semiconductor device makers, power conversion specialists and vehicle OEMs. Recent-year momentum figures should be read cautiously — they reflect the same publication lag that understates the 2025-26 filing trend.
A clear leader, not a monopoly
The top-ranked assignee holds 467 records against a fifth-place figure of 195 and a tenth-place figure of 156 — a steep drop after the leader, then a gradual taper typical of a field with many active but smaller filers.
The mid-field is still substantial
Even the tenth-ranked assignee holds 156 records, indicating that meaningful filing programmes extend well past the handful of best-known names in this space.
Latest-year counts should not be read as retreat
Several long-running filers show 0-2 records in the latest year, with YoY changes as steep as -78% to -100%. This pattern is consistent across most active assignees and reflects the roughly 18-month publication lag rather than a genuine pullback from the field.
| Assignee | Recent year | YoY |
|---|---|---|
| Micron Technology, Inc. | 2 | -78% |
| Wolfspeed, Inc. | 2 | -86% |
| Archer Aviation Inc. | 1 | -96% |
| Semiconductor Components Industries, LLC (ON Semiconductor) | 1 | -95% |
| Mitsubishi Electric Corporation | 0 | -100% |
| Infineon Technologies AG | 0 | -100% |
| ABB (Switzerland) Ltd. | 0 | -100% |
| SolarEdge Technologies Ltd. | 0 | -100% |
Where to take this analysis
The landscape data points to specific next steps depending on whether the goal is freedom-to-operate, competitive tracking, or identifying open claim space.
Map claims against the H01L cluster
With 28.9% of records classed under semiconductor devices, a freedom-to-operate check for any new device-packaging claim should start here before moving to adjacent classes.
Explore claim clustering in EurekaTrack the long tail, not just the leader
Because the top 5 hold only 10.6% of all records in scope, competitive monitoring needs to cover the mid-field assignees holding 150-200 records each, not just the named leader.
Set up assignee monitoring in EurekaRevisit 2025-26 filings once they mature
Publication lag means the last two years of the trend will keep filling in; a re-run of this landscape in a year will give a materially more complete picture of current filing intent.
Run an updated search in EurekaCommon questions about this landscape
The ranked leaders in this dataset are drawn mainly from semiconductor device makers, power conversion specialists and vehicle OEMs, with the top assignee holding 467 records. However, the top 5 combined account for only 10.6% of all 14,129 records in scope, so no single company dominates the field. A meaningful share of activity sits with a long tail of mid-sized filers holding well over 150 records each, which is worth tracking alongside the named leader.
Filings rose steadily from 662 in 2017 to a peak of 1,010 in 2023, then eased to 807 in 2024, a -19% change from the 2021 level of 999. That is a cooling from peak, not a collapse. Figures for 2025 and 2026 should be treated as provisional because publication typically lags actual filing by around 18 months, so the most recent years will continue to fill in as more records publish.
Semiconductor device structures, classified under H01L, appear on 28.9% of the 14,129 records in scope, making it the most heavily claimed subclass. Printed circuit and assembly claims (H05K) follow at 19.6%, and power conversion circuitry (H02M) at 19.0%. Because records often carry more than one IPC class, these figures overlap rather than sum to a whole field, but they consistently point to device-level packaging as the densest area to file into.
Relative to the dense H01L and H05K clusters, sub-areas such as thermal interface materials for stacked-die configurations, bonding pad reliability under thermal cycling, and switching-frequency control tailored to wide-bandgap devices show comparatively lighter claim density in this dataset. These are not unclaimed, but they sit outside the heaviest concentration of filings, which typically means more room for a defensible first claim. Any filing strategy targeting these areas should still run a focused prior-art search rather than relying on aggregate density alone.
US20110200906A1 describes a parallel fuel cell electrical power system in which multiple fuel cell power modules, each with its own stack, current switch and reverse current protection element, connect to a shared DC bus to combine fixed individual capacities into a variable output voltage. It is a representative record in this landscape rather than the most-cited one, so its practical blocking effect depends on how closely a new claim tracks the specific parallel-bus and reverse-current-protection architecture it describes. Anyone filing in fuel-cell or multi-module DC-bus power architectures should review its claims directly rather than relying on the abstract alone.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.