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Nanoscale Surface Metrology Patents: Leaders & Trends 2026

Nanoscale Surface Metrology Patents: Leaders & Trends 2026
https://www.patsnap.com/resources/blog/rd-blog/precision-and-ultraprecision-manufacturing-nanoscale-surface-metrology-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Precision & Ultraprecision Manufacturing
Nanoscale surface metrology patents: who is filing, what they claim, and where the field is thinning out

A patent landscape review of nanoscale surface metrology: filing trends since 2017, the concentration of assignees, IPC technology mix, and the most-cited foundational patents shaping AFM, interferometry and scanning-pro

3,419
Published Records
12%
Top-5 Share of All Records
-54%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth = 2021 (155 records) → 2024 (71); 2024 is the last year we treat as complete. Top-5 share = the 5 largest assignees ÷ all 3,419 records in scope (CR5), not the ranked leaders only.

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Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Field Overview

What this landscape covers

Nanoscale surface metrology sits at the intersection of dimensional measurement and semiconductor process control: atomic force microscopy, interferometric profilometry and scanning-probe measurement methods that resolve surface topography and roughness at nanometer to sub-nanometer scale. The scope tracked here spans 3,419 patent records published between 2015 and mid-2026, drawn from title/abstract language around nanoscale surface metrology and claim language pairing surface measurement terms with interferometry, AFM or scanning-probe techniques. Because families are counted rather than raw filings wherever possible, the figures below are less distorted by continuation practice or multi-jurisdiction refiling than a simple document count would be.

The technology sits downstream of semiconductor lithography, optical component manufacture and precision machine tools, which is why IPC classes for measuring instruments (G01B), semiconductor devices (H01L) and scanning-probe instruments (G01Q) co-occur so heavily across the corpus. Receiving-office data shows the United States as the dominant filing venue, with PCT and EPO filings forming the next tier, consistent with a technology whose commercial stakes concentrate in advanced-node fabs and optics houses headquartered or listed in those jurisdictions.

Filing activity and technology composition, 2017-2026
  1. 1CORNING INC118
  2. 2ZYGO CORP101
  3. 33M INNOVATIVE PROPERTIES CO76
  4. 4RGT UNIV OF CALIFORNIA64
  5. 5INTERNATIONAL BUSINESS MACHINE CORPORATION51
  6. 6TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD47
  7. 7SORRENTO THERAPEUTICS INC45
  8. 8KLA CORP43
  9. 9MASSACHUSETTS INST OF TECH41
  10. 10TAYLOR-HOBSON39
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Precision & Ultraprecision Manufacturing: Nanoscale Surface Metrology Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trends and technology composition

Two views of the same 3,419-record dataset: how filing activity has moved year over year, and which IPC subclasses carry the claim volume today.

Filings rose through the late 2010s, peaked in 2021, then pulled back

Annual filings climbed from 138 in 2017 to a peak of 155 in 2021, then declined to 71 by 2024 — a 54% fall over that three-year window. Treat 2025 and 2026 counts as provisional: publication typically lags filing by around 18 months, so the most recent two years will keep filling in and should not yet be read as a continued decline.

Filings rose through the late 2010s, peaked in 2021, then pulled back05010015020013820172018201920201552021202220232024202552026Most recent year is partial — publication lag means later filings are not yet visible.

Publication lags filing by roughly 18 months, so 2025 onwards are still filling in. Growth rates on this page therefore end at 2024; running them to the last bar would understate the field.

Measurement and semiconductor classes carry the bulk of the claim volume

G01B (measuring length and dimensions) and H01L (semiconductor devices) each appear in a little over a fifth of all 3,419 records, with G01N material testing, G02B optical elements and G01Q scanning-probe instruments forming a second tier. Because a single record can carry several IPC classes, these shares sum to well over 100% of the record total — they describe overlap in claim scope, not a partition of the field.

Measurement and semiconductor classes carry the bulk of the claim volumeG01B · Measuring length & dimensions72321.1%H01L · Semiconductor devices71520.9%G01N · Material analysis & testing35910.5%G02B · Optical elements & systems34210.0%G01Q · Scanning-probe & nanometric me…2597.6%H10P1805.3%G03F · Photolithography & photomechan…1725.0%A61B · Diagnosis & surgery1544.5%Other3,656106.9%

Shares are the percentage of the 3,419 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Precision & Ultraprecision Manufacturing: Nanoscale Surface Metrology Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited foundational patents

Representative Record
US5196701A1993-03-23

US5196701A — High-resolution detection of material property variations

GLOBALFOUNDRIES INC.

The patent describes a method for detecting and profiling material property or structural changes both at a sample's surface and subsurface. A nondestructive periodic or modulated perturbation is applied to the sample, which is then scanned with a microprobe technique such as scanning tunneling microscopy or atomic force microscopy responsive to that perturbation; the modulated output is processed against the input perturbation signal to control and characterise the measurement.Filed under GlobalFoundries' predecessor entity in 1993, this record predates most of the corpus and sits close to the foundational method claims that later AFM- and STM-based surface metrology filings build on.

US5196701A — patent drawing 1US5196701A — patent drawing 2
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Highest-citation records in scope
#Publication no.Patent titleCitations
1US20070010702A1Medical device with low magnetic susceptibility1,511
2US7091412B2Magnetically shielded assembly1,127
3US20050107870A1Medical device with multiple coating layers578
4US20160085003A1Materials, components, and methods for use with extreme ultraviolet radiation in lithography and other applic…434
5US5398113AMethod and apparatus for surface topography measurement by spatial-frequency analysis of interferograms410
6US6002471AHigh resolution scanning raman microscope360
7US20040254419A1Therapeutic assembly327
8US20050025797A1Medical device with low magnetic susceptibility314
9US5412980ATapping atomic force microscope307
10US20050079132A1Medical device with low magnetic susceptibility303

Citation counts inside a searched corpus favour older filings that have had more time to accumulate citations — read them as a measure of influence on later filers, not as a signal of current commercial importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Precision & Ultraprecision Manufacturing: Nanoscale Surface Metrology Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three readings of the same dataset, aimed at where to file, who to watch, and how open the field still is.

Concentration
12.0% held by top 5
of 3,419 records in scope

No single assignee controls the field

The leading assignee holds 118 records, but the top 5 combined account for only 12.0% of all 3,419 records, and the top 10 for 18.3%. That leaves a wide field of entrants with a handful of filings each rather than a small set of gatekeepers.

Ranked leaders, 100 companies tracked
Filing momentum
155 → 71
peak-year to 2024 filings

Activity has pulled back from its 2021 peak

Filings rose steadily from 138 in 2017 to a peak of 155 in 2021, then fell to 71 by 2024 — a 54% decline over three years. The pullback predates the most recent, still-incomplete filing years, so it reflects a real cooling rather than a reporting artefact.

2021 peak; 2024 last complete year
Claim overlap
21.1% G01B / 20.9% H01L
share of 3,419 records

Measurement claims and semiconductor claims heavily overlap

G01B and H01L each appear on roughly a fifth of all records, meaning a large share of surface-metrology claims are drafted with semiconductor fabrication context attached. Filers entering the space without that overlap risk narrower claim scope than incumbents drafting across both classes.

Classes overlap; shares do not sum to 100%
Venue
1,594 US filings
of leading receiving offices

The US remains the primary filing venue

United States filings (1,594) outnumber PCT (512) and EPO (498) filings by a wide margin, with Germany, Australia and Austria forming a smaller secondary tier. Enforcement and freedom-to-operate analysis for this technology should start with US prosecution history.

Receiving offices, leading jurisdictions
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to precision & ultraprecision manufacturing: nanoscale surface metrology patent landscape, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Precision & Ultraprecision Manufacturing: Nanoscale Surface Metrology Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to a field with room at the edges even as headline filing volume cools. These are the natural next steps for a team acting on it.

Map the white space behind the overlap classes

G01Q scanning-probe and G03F photolithography classes carry meaningfully lower record counts than G01B or H01L despite adjacent subject matter — worth checking whether that reflects genuine technical difficulty or simply under-claimed territory.

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Watch the long tail for consolidation signals

With the top 10 assignees holding only 18.3% of records, shifts in co-filing pairs or new entrants breaking into the ranked leaders are an early signal of where the field is consolidating.

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Revisit 2025-26 filings once they mature

The apparent post-2021 decline is real through 2024, but the final two years of the window are still filling in behind the typical 18-month publication lag and should be rechecked before drawing conclusions about current momentum.

Set a filing alert in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Precision & Ultraprecision Manufacturing: Nanoscale Surface Metrology Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Precision & Ultraprecision Manufacturing: Nanoscale Surface Metrology Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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