https://www.patsnap.com/resources/blog/rd-blog/printed-and-flexible-electronics-inkjet-printed-thin-film-transistors-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Printed & Flexible Electronics
Inkjet-Printed Thin-Film Transistor Patents: Who Holds the Claim Space
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112
Published Records
65%
Top-5 Share of All Records
US
Leading Jurisdiction
37
Active Filers Ranked

Top-5 share is the combined record count of the five largest assignees divided by all 112 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

Inkjet-printed thin-film transistors sit at the intersection of additive manufacturing and semiconductor device design: printing a transistor channel, source/drain or dielectric stack instead of depositing and etching it. The search scope combines inkjet-printed TFT and printed-transistor terminology with printed, flexible or stretchable electronics context, which keeps the corpus focused on printing as the fabrication route rather than on flexible electronics generally.

The 112 records in scope span filings from 2015 through the 2026 cut-off, drawn primarily from US, European and PCT filing routes. Because publication typically lags filing by around 18 months, activity in the most recent year is necessarily undercounted and should be read as a floor, not a ceiling.

Filing activity and IPC composition, 2015–2026
  1. 1THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS27
  2. 2X DISPLAY CO TECH LTD14
  3. 3RADICALID INC12
  4. 4SARALON GMBH10
  5. 5MERCK PATENT GMBH10
  6. 6ELCOFLEX9
  7. 7X CELEPRINT LIMITED8
  8. 8AGENCY FOR SCI TECH & RES8
  9. 9PST SENSORS (PTY) LTD7
  10. 10SEMPRIUS INC5
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Printed & Flexible Electronics — Inkjet-Printed Thin-Film Transistors Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Data

Filing trend and technology composition

Two views of the same 112 records: how filing activity moved year over year, and which IPC subclasses the claims actually sit in.

Filing trend, 2017–2026

Filings peaked at 20 records in 2017 and have not matched that level in any complete year since; the 2026 figure of 0 reflects the partial year and publication lag rather than a stop in activity.

Filing trend, 2017–2026051015202020172018201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass composition

H01L (semiconductor devices) covers 54.5% of records and H10D a further 27.7%, confirming that most claims are still framed as conventional semiconductor device structures rather than printing-process claims per se; G06K and H10K each sit at 17.9%, and B82Y (nanotechnology) and H01S/H04L trail near 10-12%. Because a record can carry several classes, these shares add to more than 100% of the 112 records.

IPC subclass compositionH01L · Semiconductor devices6154.5%H10D · Semiconductor devices (general)3127.7%G06K · Data recognition & presentation2017.9%H10K · Organic semiconductors (OLED e…2017.9%H10P1412.5%B82Y · Nanotechnology applications1311.6%H01S · Lasers & stimulated emission1210.7%H04L · Digital information transmissi…1210.7%Other119106.3%

Shares are the percentage of the 112 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Printed & Flexible Electronics — Inkjet-Printed Thin-Film Transistors Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Most-cited records in scope

Representative filing
US20150016048A12015-01-15

Printed circuit arrangement and method of forming the same

AGENCY FOR SCIENCE

The filing describes a printed circuit arrangement built from a printed main circuit arrangement and a printed reference circuit arrangement, each in electrical connection with a processor circuit, where the main arrangement generates a signal after a defined delay from an input. The reference arrangement supplies a comparison path for that same processor circuit.Filed 2015-01-15 by AGENCY FOR SCIENCE (US20150016048A1).

US20150016048A1 — patent drawing 1US20150016048A1 — patent drawing 2
View full filing
Highest-citation records
#Publication no.Patent titleCitations
1US7972875B2Optical systems fabricated by printing-based assembly623
2US8722458B2Optical systems fabricated by printing-based assembly411
3US20140373898A1Optical systems fabricated by printing-based assembly314
4WO2008143635A1Optical systems fabricated by printing-based assembly161
5US20100283069A1Optical systems fabricated by printing-based assembly160
6US20110266561A1Optical Systems Fabricated by Printing-Based Assembly88
7US9117940B2Optical systems fabricated by printing-based assembly53
8US20130320273A1Nanocomposites for neural prosthetics devices36
9US20090159891A1Modifying a surface in a printed transistor process35
10WO2009010142A2Functional material for printed electronic components34

Citation counts favour older filings that have had more time to accumulate citations within the searched corpus — read them as a signal of influence on later filers, not of current market relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Printed & Flexible Electronics — Inkjet-Printed Thin-Film Transistors Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for filing decisions

Concentration, timing and technology mix each point to a different constraint on new filings in this space.

Concentration
65.2% of 112 records
held by the top five assignees

Claim space is tightly held at the top

With the top five assignees accounting for 65.2% of all 112 records in scope and the top ten reaching 98.2%, there is very little room left for a new entrant to build a broad position by volume alone. Freedom-to-operate work in this field should start with the leading holders' claim sets, not with a general prior-art sweep.

Based on the 37-company ranking returned for this dataset.
Timing
Peak: 2017 at 20 records
no year since has matched it

Filing has not returned to its 2017 peak

The trend shows a single sharp peak in 2017 rather than a rising curve, and no complete year since has matched that level. Because publication lags filing by roughly 18 months, the apparent decline in the most recent years is partly an artefact of the data cut-off rather than a real drop in R&D activity.

Growth rate is not stated here; too few complete recent years to compute one reliably.
Technology mix
H01L: 54.5% · H10D: 27.7%
of the 112 records

Claims skew toward device structure, not process

Over half of records touch H01L semiconductor-device claims and more than a quarter touch H10D, while organic-semiconductor (H10K) and data-recognition (G06K) classes each cover under a fifth of records. That pattern suggests the printing process itself is more often claimed as a means to a known device structure than as an invention in its own right.

Shares sum to more than 100% because records can carry multiple IPC classes.
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to printed & flexible electronics — inkjet-printed thin-film transistors patent landscape, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Printed & Flexible Electronics — Inkjet-Printed Thin-Film Transistors Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to specific next steps depending on whether the goal is freedom-to-operate, sourcing partners, or finding open claim space.

Map the leader's full claim set

Before filing near this space, pull every record from the top-ranked assignee and the fifth- and tenth-place holders to see exactly where their claims sit inside H01L and H10D.

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Test white-space claims against prior art

The under-claimed sub-areas above are starting hypotheses, not clearances — each needs a targeted prior-art search before a first claim is drafted.

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Track the next complete filing year

Because publication lag understates the most recent year, revisit the trend once another full year of filings has published to see whether 2017's peak was cyclical.

Set a filing alert in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Printed & Flexible Electronics — Inkjet-Printed Thin-Film Transistors Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about inkjet-printed TFT patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Printed & Flexible Electronics — Inkjet-Printed Thin-Film Transistors Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.