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The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →Top-5 share is the combined record count of the five largest assignees divided by all 112 records in scope (CR5), not by the ranked leaders only.
Inkjet-printed thin-film transistors sit at the intersection of additive manufacturing and semiconductor device design: printing a transistor channel, source/drain or dielectric stack instead of depositing and etching it. The search scope combines inkjet-printed TFT and printed-transistor terminology with printed, flexible or stretchable electronics context, which keeps the corpus focused on printing as the fabrication route rather than on flexible electronics generally.
The 112 records in scope span filings from 2015 through the 2026 cut-off, drawn primarily from US, European and PCT filing routes. Because publication typically lags filing by around 18 months, activity in the most recent year is necessarily undercounted and should be read as a floor, not a ceiling.
Pick a task. Every answer cites the patents behind it.
Two views of the same 112 records: how filing activity moved year over year, and which IPC subclasses the claims actually sit in.
Filings peaked at 20 records in 2017 and have not matched that level in any complete year since; the 2026 figure of 0 reflects the partial year and publication lag rather than a stop in activity.
H01L (semiconductor devices) covers 54.5% of records and H10D a further 27.7%, confirming that most claims are still framed as conventional semiconductor device structures rather than printing-process claims per se; G06K and H10K each sit at 17.9%, and B82Y (nanotechnology) and H01S/H04L trail near 10-12%. Because a record can carry several classes, these shares add to more than 100% of the 112 records.
Shares are the percentage of the 112 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about printed & flexible electronics — inkjet-printed thin-film transistors patent landscape and every answer comes back with the patent numbers behind it.
Try EurekaThe filing describes a printed circuit arrangement built from a printed main circuit arrangement and a printed reference circuit arrangement, each in electrical connection with a processor circuit, where the main arrangement generates a signal after a defined delay from an input. The reference arrangement supplies a comparison path for that same processor circuit.Filed 2015-01-15 by AGENCY FOR SCIENCE (US20150016048A1).


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US7972875B2 | Optical systems fabricated by printing-based assembly | 623 |
| 2 | US8722458B2 | Optical systems fabricated by printing-based assembly | 411 |
| 3 | US20140373898A1 | Optical systems fabricated by printing-based assembly | 314 |
| 4 | WO2008143635A1 | Optical systems fabricated by printing-based assembly | 161 |
| 5 | US20100283069A1 | Optical systems fabricated by printing-based assembly | 160 |
| 6 | US20110266561A1 | Optical Systems Fabricated by Printing-Based Assembly | 88 |
| 7 | US9117940B2 | Optical systems fabricated by printing-based assembly | 53 |
| 8 | US20130320273A1 | Nanocomposites for neural prosthetics devices | 36 |
| 9 | US20090159891A1 | Modifying a surface in a printed transistor process | 35 |
| 10 | WO2009010142A2 | Functional material for printed electronic components | 34 |
Citation counts favour older filings that have had more time to accumulate citations within the searched corpus — read them as a signal of influence on later filers, not of current market relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Concentration, timing and technology mix each point to a different constraint on new filings in this space.
With the top five assignees accounting for 65.2% of all 112 records in scope and the top ten reaching 98.2%, there is very little room left for a new entrant to build a broad position by volume alone. Freedom-to-operate work in this field should start with the leading holders' claim sets, not with a general prior-art sweep.
The trend shows a single sharp peak in 2017 rather than a rising curve, and no complete year since has matched that level. Because publication lags filing by roughly 18 months, the apparent decline in the most recent years is partly an artefact of the data cut-off rather than a real drop in R&D activity.
Over half of records touch H01L semiconductor-device claims and more than a quarter touch H10D, while organic-semiconductor (H10K) and data-recognition (G06K) classes each cover under a fifth of records. That pattern suggests the printing process itself is more often claimed as a means to a known device structure than as an invention in its own right.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to printed & flexible electronics — inkjet-printed thin-film transistors patent landscape, with the prior art for and against each one.
The dataset points to specific next steps depending on whether the goal is freedom-to-operate, sourcing partners, or finding open claim space.
Before filing near this space, pull every record from the top-ranked assignee and the fifth- and tenth-place holders to see exactly where their claims sit inside H01L and H10D.
Explore assignee claims in EurekaThe under-claimed sub-areas above are starting hypotheses, not clearances — each needs a targeted prior-art search before a first claim is drafted.
Run a white-space search in EurekaBecause publication lag understates the most recent year, revisit the trend once another full year of filings has published to see whether 2017's peak was cyclical.
Set a filing alert in EurekaThe ranking in this dataset covers 37 companies, and the leading assignee holds 27 of the 112 records in scope, well ahead of the fifth-place holder at 10 records. The top five assignees together account for 65.2% of all records, and the top ten reach 98.2%, so the field is concentrated among a small group rather than spread evenly. Any competitive read of this space should start with that leading group's claim sets rather than a broad market scan.
Filing activity peaked in 2017 at 20 records and has not returned to that level in any complete year since. A reliable growth rate cannot be stated from this data because too few complete recent years remain once publication lag is accounted for. Publication typically lags actual filing by around 18 months, so the apparent drop in the most recent years likely overstates any real slowdown.
Over half of the 112 records touch H01L (semiconductor devices), and more than a quarter touch H10D, the general semiconductor-device subclass. Organic-semiconductor structures (H10K) and data-recognition integration (G06K) each appear in under a fifth of records, with nanotechnology (B82Y), laser processing (H01S) and digital transmission (H04L) trailing further behind. Because a single record can carry multiple IPC classes, these figures describe overlapping coverage rather than a clean split of the field.
The IPC composition shows thinner coverage in laser-assisted processing of printed contacts, nanoparticle ink formulations for channel layers, and printed dielectric stacks for organic TFT backplanes relative to the dominant H01L and H10D device-structure claims. These are hypotheses drawn from relative class density, not clearances, so any filing plan in those branches still needs a targeted prior-art search. The narrow co-assignee network in this dataset also suggests few partnerships have been formed to jointly pursue these adjacent branches.
US20150016048A1, filed by an Agency for Science entity in January 2015, describes a printed circuit arrangement with a printed main circuit and a printed reference circuit both feeding a processor circuit, with the main path generating a signal after a defined delay. Its claims are specific to that delay-based dual-path architecture rather than to inkjet-printed TFT fabrication broadly, so it constrains designs using a comparable delay-and-reference structure more than it blocks printed-transistor work generally. Anyone designing near this architecture should review its claim scope directly rather than relying on the abstract summary.
Go past this page: query the whole printed & flexible electronics — inkjet-printed thin-film transistors patent landscape corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.