Printed & Flexible Electronics Patents: Top Companies & Trends 2026
Printed and flexible electronics patents: who is filing, what they claim, and where the field is still open
39.0% concentration at the top. The five leading assignees account for 1,554 of the 3,982 records in scope — a field with a clear head but still room beneath it. Filings rose from 233 in 2017 to a peak of 346 in 2023. The 2021-to-2024 window is essentially flat at -1%, and the sharp-looking drop into 2025 and 2026 reflects publication lag rather than a real pullback in filing.
- 1INNOLUX CORP24.2%
- 2JIAXING SUPER LIGHTING ELECTRIC APPLIANCE CO LTD5.1%
- 3SAMSUNG ELECTRONICS CO LTD4.1%
- 4SAMSUNG DISPLAY CO LTD3.0%
- 5CORNING INC2.6%
See the full printed & flexible electronics patent landscape analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about this landscape
Who holds the most patents in printed and flexible electronics?
One assignee leads this landscape with 962 of the 3,982 records in scope, well ahead of the fifth-place holder at 103 records. The ranked list runs to 100 companies total, with a steep drop after the leader and a long tail of smaller filers below tenth place at 56 records. This pattern — one dominant filer plus a fragmented remainder — is typical of a field where a core manufacturing process was staked out early and then built on by many smaller players.
Is patent filing in flexible electronics growing or slowing down?
Filing volume was essentially flat from 2021 to 2024, moving from 294 to 290 records, a -1% change. The dataset’s peak year so far is 2023 at 346 records. The apparent drop in 2025 and 2026 is not a real decline — publication typically lags filing by about 18 months, so those years are still filling in and should not be read as a slowdown.
What patent classes cover flexible electronics manufacturing?
The densest classes are H01L (semiconductor devices, 32.0% of the 3,982 records) and H05K (printed circuits and assemblies, 18.1%), followed by H10K (organic semiconductors including OLED, 17.1%), G06F (digital data processing, 14.9%) and G02F (optical control and modulation, 10.4%). Because a single record can carry multiple IPC classes, these shares add up to more than 100% and should not be summed into a combined total. Thinner classes like B32B, H05B and H10W mark where claim density is lower relative to the rest of the field.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Printed & Flexible Electronics Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.