https://www.patsnap.com/resources/blog/rd-blog/pv-manufacturing-and-recycling-pv-module-disassembly-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Solar Energy
PV module disassembly patents: who is filing, and where the claim space is still open
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14
Published Records
IN
Leading Jurisdiction
22
Active Filers Ranked
2024
Peak Filing Year

Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this landscape covers

PV module disassembly sits at the intersection of manufacturing equipment and end-of-life recycling: patents here claim the mechanical stations, tooling and process sequences that separate a spent or defective photovoltaic module back into its frame, junction box, encapsulated cells and glass. The field is still small and young — 14 published records in scope, with the earliest dated to 2017 and filing activity concentrated in the last few years. Publication lags filing by roughly 18 months, so the 2026 count understates what has actually been filed.

Because volumes are low, individual filings carry disproportionate weight. A handful of receiving offices — India, China, Singapore, the United States and WIPO's PCT route — account for the bulk of activity, and one representative filing from Singapore Polytechnic lays out a full multi-station dismantling line rather than a single mechanism.

Filing activity and technology composition, 2017-2026
  1. 1SINGAPORE POLYTECHNIC6
  2. 2S DEVANEYAN2
  3. 3IND TECH RES INST2
  4. 4DR RAJU THAKUR1
  5. 5MR LIMBADRI CHINTA1
  6. 6DR KRISHNAMURTI L MOTGHARE1
  7. 7MR DIPAK S PATIL1
  8. 8RAJEEV KUMAR1
  9. 9DR YOGESH AGRAWAL1
  10. 10SUNDARI SIVAGAMA M S1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on PV Manufacturing & Recycling: PV Module Disassembly Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The data

Filing trend and technology composition

Two views of the same 14-record dataset: how filing activity has moved year over year, and how those records distribute across IPC subclasses. Because a single record can carry more than one IPC class, the composition shares add up to more than the record total.

A thin, recent filing history

The earliest record in scope dates to 2017; activity was sparse through the following years and peaked so far in 2024 at 4 records. With fewer than four complete years of data once the publication lag is accounted for, no reliable growth rate can be stated — treat any year-over-year reading as provisional, especially the partial 2026 count.

A thin, recent filing history012341201720182019202020212022202342024202522026Most recent year is partial — publication lag means later filings are not yet visible.

Disposal and generation classes dominate over semiconductor-specific claims

H02S (photovoltaic and solar power generation) covers 42.9% of the 14 records and B09B (solid waste disposal) covers 35.7%, together outweighing H01L (semiconductor devices) at 21.4%. Smaller classes — B03B wet separation, H10F photovoltaic devices, B08B cleaning, B23K welding/soldering and B23Q machine tool fittings — each sit at 14.3% or below, marking narrower mechanical sub-routes rather than core disassembly claims.

Disposal and generation classes dominate over semiconductor-specific claimsH02S · Photovoltaic / solar power gen…642.9%B09B · Solid waste disposal535.7%H01L · Semiconductor devices321.4%B03B · Wet separation of solids214.3%H10F · Photovoltaic & light-sensitive…214.3%B08B · Cleaning (general)17.1%B23K · Welding, soldering & brazing17.1%B23Q · Machine tool fittings17.1%Other964.3%

Shares are the percentage of the 14 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on PV Manufacturing & Recycling: PV Module Disassembly Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The representative filing and the most-cited record

Representative filing
WO2024237862A12024-11-21

WO2024237862A1 — Apparatuses and methods for dismantling photovoltaic modules

SINGAPORE POLYTECHNIC

Apparatuses, methods and vehicles for dismantling photovoltaic (PV) modules are provided. The apparatuses comprising: a frame removal station, a PV module dismantling station, a solar cell separation station; and one or more conveyor elements configured to convey the PV modules through the stations. A frame is separated from the PV module by the frame removal station to recover the frame and obtain a frameless PV module. A junction box and a back support are separated from the frameless PV module by the PV module dismantling station to obtain a partially disassembled PV module. Encapsulated solar cells are separated from the partially disassembled PV module by the solar cell separation station.Filed by Singapore Polytechnic, published 2024-11-21 — the filing claims a full multi-station line rather than a single mechanism, which is unusual for this field's typically narrower device claims.

WO2024237862A1 — patent drawing 1WO2024237862A1 — patent drawing 2
View full filing
Most-cited records in scope
#Publication no.Patent titleCitations
1US20220094299A1Dismantling device for frame of PV module11
2IN201741017584AAutomatic cleaning of solar PV modules using artificial intelligence1

Citation counts inside a searched corpus favour older records; read them as a signal of influence on later filers, not as a measure of current commercial importance.

Publication numbers are shown where the record carries one (2 of 2 rows); clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on PV Manufacturing & Recycling: PV Module Disassembly Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for filing strategy

With only 14 records in scope and a ranking of 22 assignees, this is a field defined more by individual filings than by aggregate trend lines. The signals below are read directly from the evidence, not extrapolated.

Leader concentration
6 of 14 families
held by the leading assignee

One assignee holds a visible lead, the rest file singly

The leading assignee in the 22-company ranking accounts for 6 of the 14 records; fifth and tenth place each hold just 1. That gap points to a long tail of single-filing entrants rather than a competitive cluster near the top.

Ranking is counted in records, not weighted by family size beyond what is stated.
Most-cited filing
11 citations
US20220094299A1

One dismantling-device patent is the field's reference point

US20220094299A1, covering a frame dismantling device, draws 11 citations — far ahead of the next most-cited record at 1. Anyone filing a frame-removal mechanism should expect this filing to surface in prior-art searches.

Citation counts favour older, earlier-published records inside this corpus.
Class overlap
42.9% vs 35.7%
H02S vs B09B

Generation and disposal classes carry more claim density than semiconductor classes

H02S (photovoltaic generation) and B09B (solid waste disposal) each cover more of the 14 records than H01L (semiconductor devices) at 21.4%. That split suggests examiners and filers are framing disassembly as a recycling-and-generation problem more than a device-fabrication one.

Shares are of the 14-record total; a record can carry multiple classes.
Filing geography
India 6 of 14
leading receiving office

Filing activity centres on India, with smaller counts split elsewhere

India accounts for 6 of the 14 records as receiving office, ahead of China, Singapore, the United States and WIPO's PCT route at 2 each. A filer targeting global protection should not assume a single dominant jurisdiction outside India.

Receiving office counts are as stated; no further breakdown is available.
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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on PV Manufacturing & Recycling: PV Module Disassembly Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next

Where to take this research

The dataset points to a young, low-volume field where individual filings matter more than trend curves. The next steps depend on whether the goal is freedom-to-operate, whitespace identification, or monitoring a specific competitor.

Run a freedom-to-operate check against the most-cited filing

Before committing to a frame-removal or multi-station dismantling design, check claim scope against US20220094299A1 and the WO2024237862A1 representative filing directly, since both sit closest to the field's core mechanical claims.

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Track the leading assignee's follow-on filings

With 6 of 14 records already held by one assignee, new publications from that same applicant are the most likely early signal of where the field moves next.

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Probe the smaller IPC branches for open claim space

Classes like B08B cleaning, B23K welding/soldering and B23Q machine tool fittings each cover only 1 of 14 records — thin enough that a well-drafted claim in these branches may face little direct prior art.

Explore adjacent classes in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on PV Manufacturing & Recycling: PV Module Disassembly Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about PV module disassembly patents

Answers are grounded in the same dataset. Derived from a Patsnap search on PV Manufacturing & Recycling: PV Module Disassembly Patent Landscape covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.