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Run your analysis now →https://www.patsnap.com/resources/blog/rd-blog/quartz-components-for-semiconductor-furnaces-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Ceramics & InorganicsQuartz Components for Semiconductor Furnaces: Patent Filing Trends and Leading Assignees
- Filing has cooled since 2019. the peak year at 673 filings, with the most recent full year down to 16 — publication lag explains part of the drop, but the midpoint-to-latest trend was already flat before that.
- No single filer dominates. the leader holds 1,010 records and the top 10 combined reach only 3.2% of the 193,881 records in scope, leaving a long tail of smaller filers.
- Cleaning and regeneration claims lead the technology mix. B08B cleaning-related classes sit ahead of dedicated tube and discharge-tube classes, pointing to where claim density is heaviest.
193.9K
Published Records
2%
Top-5 Share of All Records
-37%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview
What this landscape covers
This dataset tracks patent activity around quartz components used in semiconductor furnace environments — boats, tubes and fused quartz fixtures — together with the process concerns that drive most of the claim language: devitrification, OH content, thermal shock, metal impurity control, and cleaning or etching regeneration. The search string pulls in both dedicated quartz-fixture filings and a broader set of tube and cleaning-related art, which is why the technology composition below spans cleaning apparatus classes as heavily as tube-specific ones.
The scope runs from 2015 through the 2026-07-31 cut-off, with 193,881 records in the underlying corpus and a 100-company assignee ranking drawn from those records. Because publication typically lags filing by roughly 18 months, the most recent year understates real filing activity and should be read as a floor, not a ceiling.
Filing activity and technology composition, 2017–2026
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Quartz Components for Semiconductor Furnaces covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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The data
Filing trend and technology composition
Two views of the same 193,881-record corpus: how filing volume has moved year over year, and which IPC subclasses carry the claim density.
A peak in 2019, then a flat-to-declining run
Filings rose from 528 in 2017 to a peak of 673 in 2019, then settled near the 2022 midpoint of 511 before falling to 16 in the most recent, still-incomplete year. Read the tail years cautiously — publication lag means 2025 and 2026 figures will rise as more records post — but the multi-year plateau through the mid-2020s suggests the field was not accelerating even before that lag effect.
Cleaning and regeneration classes outweigh dedicated tube art
B08B (general cleaning) leads at 1.5% of the 193,881 records in scope, followed by F28G (cleaning heat-exchange surfaces) and A47L (cleaning and washing appliances) at 0.8% each. Dedicated tube and discharge-tube art (H01J) trails at 0.5%, and separation processes (B01D) and body-fluid devices (A61M) each sit at 0.7%. Because records can carry multiple IPC classes, these shares add up to more than the record total — they show where claim density concentrates, not a partition of the field.
Shares are the percentage of the 193,881 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Quartz Components for Semiconductor Furnaces covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.
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A representative filing and the most-cited prior art
Representative record
US9708209B2 — Glass tube cleaning and cutting system and method for same
NIPPON ELECTRIC GLASS CO., LTD.
A glass tube cleaning and cutting device includes a glass tube cutting device configured to cut an end portion of a glass tube while the glass tube cutting device rotates the glass tube having a predetermined length about a tube axis of the glass tube and conveys the glass tube in a direction orthogonal to the tube axis, at least one blower configured to blow air into an opening located on a first end portion side of the glass tube, and at least one cutting blade provided at a position opposite to the at least one blower interposing the glass tube therebetween, the at least one cutting blade being configured to impose thermal shock and scratches on an outer circumference surface of a second end portion.Filed by Nippon Electric Glass, published 2017-07-18. The mechanism claimed is a thermal-shock cutting method paired with an air-blower cleaning step — a combination that ties directly to the devitrification and thermal-shock concerns that recur across this dataset.
Most-cited records in this corpus
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6749560B1 | Endoscope shaft with slotted tube | 2,301 |
| 2 | US7645230B2 | Over-tube, method of manufacturing over-tube, method of disposing over-tube, and method of treatment in abdom… | 1,564 |
| 3 | US20080064921A1 | Guide tube control of minimally invasive surgical instruments | 1,368 |
| 4 | US8784304B2 | Over-tube, method of manufacturing over-tube, method of disposing over-tube, and method of treatment in abdom… | 1,103 |
| 5 | US20140207125A1 | Intelligent adapter assembly for use with an electromechanical surgical system | 981 |
| 6 | US5780807A | Method and apparatus for direct laser cutting of metal stents | 824 |
| 7 | US5308358A | Rigid-shaft surgical instruments that can be disassembled for improved cleaning | 763 |
| 8 | US6329297B1 | Dilute remote plasma clean | 740 |
| 9 | EP1593337A1 | Overtube, producing method and placing method of the same, and method of treating intra-abdominal cavity | 728 |
| 10 | US5740794A | Apparatus and methods for dispersing dry powder medicaments | 720 |
Citation counts favour older filings in any searched corpus — treat this table as a signal of influence within the dataset, not a ranking of current commercial importance.
Each row carries its publication number; clicking a row searches Eureka by that number.
Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Quartz Components for Semiconductor Furnaces covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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What the numbers say about where this field stands
Three read-throughs from the filing trend, the concentration figures and the technology mix.
Filing momentum
673 (2019) → 16 (latest)
peak year vs. most recent year
Activity has cooled from its 2019 peak
Filings rose steadily through 2019 and have since drifted down to the 2022 midpoint of 511 and further to 16 in the latest, still-partial year. Some of the recent drop is publication lag rather than a real stop in filing, but the multi-year plateau before the tail-off suggests the technology had already matured past its fastest growth phase.
Filing trend, 2017–2026
Concentration
1.9% / 3.2%
top 5 / top 10 share of all 193,881 records
No single filer controls the field
The leader holds 1,010 records, but the top 5 combined account for only 1.9% of the 193,881 records in scope and the top 10 combined reach 3.2%. That leaves the bulk of filings spread across a long tail of smaller and single-filing entrants — a structure more open to new entrants than a concentrated field would be.
Assignee ranking, 100 companies
Technology mix
1.5% B08B vs 0.5% H01J
share of the 193,881 records in scope
Cleaning apparatus classes outweigh tube-specific art
General and heat-exchange cleaning classes (B08B, F28G, A47L) collectively draw more filings than dedicated discharge-tube claims (H01J), signalling that regeneration and maintenance processes are more heavily claimed than the fixtures themselves.
IPC composition, 8 leading subclasses
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Looking for what nobody has claimed yet?
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to quartz components for semiconductor furnaces, with the prior art for and against each one.
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Quartz Components for Semiconductor Furnaces covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Who's filing
A fragmented field with a thin leadership tier
The 100-company ranking this dataset returns shows a leader well ahead of the pack, but the concentration figures make clear that no small group controls the space.
Leader
1,010 records
top-ranked assignee
A clear leader, but not a dominant one
The top-ranked assignee holds 1,010 records against a fifth-place figure of 597 and a tenth-place figure of 418 — a steep drop-off after first place but no runaway monopoly on claim space.
Leader vs. fifth and tenth place
Top 10
3.2% of 193,881
combined share of all records
The ranked leaders hold a small slice of the whole
Even combined, the top 10 ranked assignees account for just 3.2% of the 193,881 records in scope. Most filing activity sits outside this group, in the long tail the ranking does not name individually.
Top 10 combined, 6,149 records
Momentum
-100% YoY
several named assignees, latest year
Multiple established filers dropped to zero in the latest year
Several assignees that were active earlier in the window show zero filings in the latest year, a pattern consistent with the overall decline in recent filing counts rather than isolated withdrawal by any one firm.
Recent-year momentum by assignee
Recent-year filing momentum by assignee
| Assignee | Recent year | YoY |
|---|---|---|
| General Electric Co. | 0 | -100% |
| Stone Age AG | 0 | -100% |
| Westinghouse Electric Corporation | 0 | -100% |
| Nippon Electric Glass Co., Ltd. | 0 | -100% |
| Babcock & Wilcox Company | 0 | — |
| LG Electronics Inc. | 0 | -100% |
| Acclarent, Inc. | 0 | — |
| Koninklijke Philips N.V. (Royal Philips) | 0 | -100% |
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Quartz Components for Semiconductor Furnaces covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's next
Where to take this analysis
The dataset points to a fragmented field with cooling filing activity and claim density concentrated in cleaning and regeneration processes rather than fixture design itself.
Map the white space before drafting
The gap between heavily claimed cleaning classes and thinner coverage in large-diameter fabrication and OH-content control suggests specific claim territory that is not yet crowded.
Explore white space in EurekaWatch the long tail, not just the leader
With the top 10 holding only 3.2% of records, competitive monitoring needs to track the broader field rather than a small set of named leaders.
Set up assignee tracking in EurekaSource: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Quartz Components for Semiconductor Furnaces covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ
Common questions about this landscape
The assignee ranking in this dataset covers 100 companies, with the leader holding 1,010 records, fifth place at 597, and tenth place at 418. However, the top 10 combined account for only 3.2% of the 193,881 records in scope, so no single company or small group controls the field. Most filing activity sits in a long tail of smaller and single-filing entrants outside the named leaders, which matters for competitive monitoring since watching only the top names would miss most of the activity.
Filing peaked in 2019 at 673 records, dipped toward a midpoint of 511 in 2022, and fell to just 16 in the most recent year tracked. Part of that final drop is publication lag, since filings typically take about 18 months to appear in the record, so the true recent-year count is understated. Even accounting for lag, the plateau through the early 2020s suggests filing activity had already flattened before the visible decline, rather than the field still being in an early growth phase.
US9708209B2, assigned to Nippon Electric Glass and published in 2017, claims a glass tube cutting and cleaning system that combines rotational thermal-shock cutting with an air-blower cleaning step. The claim ties a specific mechanical cutting motion to a specific airflow cleaning method, rather than covering thermal-shock cutting or tube cleaning broadly. Anyone designing a furnace-tube processing line should check whether their cutting and cleaning steps are performed in this same sequence and configuration before assuming freedom to operate.
The technology composition shows heavy claim density in general cleaning apparatus (B08B), heat-exchange surface cleaning (F28G), and cleaning appliances (A47L), while dedicated discharge-tube art (H01J) trails at a lower share of records. This gap points to areas like large-diameter fused quartz fabrication, OH-content control, and metal impurity screening as comparatively less claimed relative to cleaning and regeneration processes. That does not mean these areas are empty, but the filing density suggests more open claim space than in the cleaning-process classes.
The most-cited records in this corpus date back further in the window, which is typical of citation analysis within any searched patent set: older filings have simply had more time to accumulate citations from later applicants. A high citation count signals influence on the field's prior art landscape, not necessarily current commercial relevance or validity strength. Readers should treat the most-cited table as a map of foundational claim language to design around, not a ranking of what matters most today.
Answers are grounded in the same dataset. Derived from a Patsnap search on Quartz Components for Semiconductor Furnaces covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.