Redistribution Layer Patents: Leaders, Trends & White Space 2026
- Filing peaked in 2024 at 18 families, then the trend flattens rather than continuing to climb — this is not a technology still accelerating into a growth curve.
- The most-cited record in the set is a 2023 RF packaging filing, cited 135 times, well ahead of the next-most-cited 2014 fan-out packaging patent at 82 citations.
- Only two co-assignee pairs appear across 94 families, meaning almost all of this claim space was built by single organisations filing alone, not through joint development.
What the RDL reliability record actually covers
Redistribution layer reliability filings sit at the intersection of packaging and interconnect engineering: the search pulls documents that claim crack resistance, delamination resistance or thermomechanical durability specifically for RDL structures, not RDL formation generally. That narrows the corpus to 94 patent families published between 2015 and mid-2026, concentrated almost entirely in the H01L semiconductor devices subclass, with secondary weight in memory device manufacture and general semiconductor device construction.
The filing office split is heavily skewed toward the United States, with the EPO, WIPO/PCT, South Korea, India and the UK each contributing a handful of records. That pattern points to a corpus where US prosecution strategy dominates, and where reliability-specific claims — as opposed to broader RDL formation claims — are still a niche filing category rather than a mainstream one.
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Filing trend and technology composition
Two views of the same 94 families: how filing volume moved year over year, and which IPC subclasses carry the claim weight.
A flat-to-declining trend after a 2024 peak
Filings ran at 3 in 2017 and climbed unevenly to a peak of 18 in 2024. The 2022 midpoint of 6 confirms the growth was not steady — it built late and has not sustained. The 2026 figure of 0 reflects the partial year and the roughly 18-month lag between filing and publication, not an actual stop in activity.
H01L dominates; H10W is the largest secondary cluster
Every one of the 94 families touches H01L (semiconductor devices), the parent classification for the search. H10W appears in 41 records, suggesting a substantial packaging-specific overlap, while H10B (memory device manufacture) and H10D (general semiconductor devices) each sit near a tenth of the corpus. Smaller counts in G06V, G06K and G01D indicate a minority of filings tie RDL reliability claims to sensing or recognition end-use, such as fingerprint sensor packaging.
Shares are the percentage of the 94 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Redistribution Layer Reliability and Durability with Eureka
This page is one run against one query. Ask Eureka your own question about redistribution layer reliability and durability and every answer comes back with the patent numbers behind it.
Try EurekaThe most-cited records and a representative early filing
Redistribution layer and method of forming a redistribution layer (Infineon Technologies AG, filed 2015-04-30)
A redistribution layer for a chip is provided, wherein the redistribution layer comprises at least one electrical conductor path connecting two connection points with each other, wherein the at least one electrical conductor path is arranged on a planar supporting layer and wherein the electrical conductor path comprises copper and at least one other further electrical conductive material in an amount of more than 0.04 mass percent.The claim ties durability to a specific compositional threshold — copper plus a minority alloying element above 0.04 mass percent — rather than to a structural or process feature, which is what makes it durable prior art against later claims phrased in structural terms only.
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20230130259A1 | Radio frequency device packages | 135 |
| 2 | US20140057394A1 | Method for making a double-sided fanout semiconductor package with embedded surface mount devices, and produc… | 82 |
| 3 | US20180358288A1 | Metal core solder ball interconnector fan-out wafer level package and manufacturing method therefor | 35 |
| 4 | US20190244905A1 | Semiconductor package and method of fabricating the same | 32 |
| 5 | GB2489100A | Wafer-level packaging for a fingerprint sensor | 24 |
| 6 | US20180366411A1 | Semiconductor package and method of fabricating the same | 23 |
| 7 | US20190051607A1 | Semiconductor package and method of fabricating the same | 22 |
| 8 | US9406580B2 | Packaging for fingerprint sensors and methods of manufacture | 19 |
| 9 | US20210134757A1 | Fanout integration for stacked silicon package assembly | 10 |
| 10 | US20160343634A1 | Packaging for fingerprint sensors and methods of manufacture | 10 |
Citation counts reflect influence within the searched corpus and favour older publications; a 2023 filing leading the table is notable precisely because it overtook older art so quickly.
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Browse MCP servers →What the numbers mean for a filing decision
Three patterns in this dataset matter more than the raw counts: where the claim density sits, how citation influence is distributed, and how thin the collaboration layer is.
Claim space is anchored in one subclass
Every record in this corpus classifies under H01L, and 41 of 94 also carry H10W — a packaging-specific overlap. That means reliability claims for RDL structures are being filed as extensions of core semiconductor device art rather than as a standalone category, which narrows where a genuinely novel claim can sit.
One 2023 filing already outweighs older art
A radio frequency device packaging filing published in 2023 leads the citation table at 135, well ahead of a 2014 fan-out packaging patent at 82. Given the usual lag before citations accumulate, a filing this recent building this much influence this fast signals a claim other applicants are actively designing around.
This is a single-applicant field, not a joint-development one
Only two co-assignee pairs appear in the entire corpus, one linking two French research organisations and one linking two Korean packaging entities. The overwhelming majority of families were filed by one organisation acting alone, which is unusual for a reliability topic that typically benefits from materials-plus-device collaboration.
Recent-year momentum has gone quiet across the leaders
Several of the most active historical filers, including large Korean and Chinese electronics and memory manufacturers, show zero filings in the latest tracked year with some recording a full year-over-year drop. Combined with the flat 2024-to-2026 trend, this points to a pause in reliability-specific filing rather than sustained retreat, likely reflecting publication lag as much as reduced activity.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to redistribution layer reliability and durability, with the prior art for and against each one.
Who is active, and where the claim space is still open
The assignee list is led by large device and memory manufacturers with mostly historical rather than current-year activity, alongside a long tail of single-filing entrants. That combination is itself informative: incumbents built the foundational art early, and the gaps that remain sit outside their core filing patterns.
Large device makers built the base, then paused
Korean and Chinese electronics, memory and packaging manufacturers account for a meaningful share of the historical filing volume in this corpus, but several show no filings in the most recent tracked year. That pattern is consistent with the overall flat 2024-2026 trend rather than a signal that these firms have exited the field.
Most entrants file once, and file alone
The near-absence of co-assignee filings, against a backdrop of many single-appearance assignees, suggests this is a field where smaller specialist filers stake out narrow claims rather than partnering with materials suppliers or foundries. That creates openings for a well-drafted structural or process claim that larger incumbents have not blocked.
Prosecution strategy is heavily US-centric
The United States accounts for the large majority of receiving-office activity, with the EPO, WIPO/PCT, South Korea, India and the UK each contributing single-digit counts. Applicants prioritising other jurisdictions for RDL reliability claims specifically are still a minority, which may leave regional freedom-to-operate less tested outside the US.
| Assignee | Recent year | YoY |
|---|---|---|
| Samsung Electronics Co., Ltd. (Korea) | 0 | -100% |
| Murata Manufacturing Co., Ltd. | 0 | — |
| Yangtze Memory Technologies Co., Ltd. | 0 | — |
| Amkor Technology, Inc. | 0 | — |
| NEPES Co., Ltd. | 0 | — |
| Advanced Semiconductor Engineering, Inc. (ASE) | 0 | -100% |
| Synaptics Incorporated | 0 | — |
| Centre National de la Recherche Scientifique (CNRS) | 0 | — |
Where to take this analysis
The filing trend and assignee pattern here raise questions that a static landscape report cannot answer on its own — they call for structured follow-up against your own claim set.
Map your own claims against the H01L/H10W cluster
With every family in this corpus classified under H01L and nearly half also under H10W, a freedom-to-operate check against that specific overlap is more targeted than a broad semiconductor-packaging search.
Run a claim comparison in EurekaTrack whether the 2024 peak was a one-off or a plateau
The flat trend from 2022 through 2024 could turn into renewed growth or a settled ceiling; monitoring new publications as they clear the 18-month lag will show which.
Set up filing alerts in EurekaInvestigate the under-claimed branches directly
Sensor-integrated RDL packaging and metal-core interconnect fatigue resistance show low filing density relative to the core cluster — worth a dedicated search before assuming the space is open.
Explore white space in EurekaCommon questions about RDL reliability patents
This dataset identifies 94 patent families published between 2015 and mid-2026 that specifically claim crack resistance, delamination resistance or thermomechanical durability for redistribution layer structures. That is a narrow subset of RDL patents overall, since it excludes filings that cover RDL formation or materials without a reliability-specific claim. Families are the right unit to cite here because they neutralise duplicate counting across continuations and multiple jurisdictions of the same invention.
No, not on the current evidence. Filing rose unevenly from 3 records in 2017 to a peak of 18 in 2024, but the 2022 midpoint of 6 shows the growth was not steady, and the trend has flattened rather than climbed further since the peak. The apparent drop to 0 in 2026 is partly an artefact of the roughly 18-month gap between filing and publication, so the most recent year should be read as understated rather than as a true stop.
The historical filing volume is led by large Korean and Chinese electronics, memory and semiconductor packaging manufacturers, alongside a long tail of entities that appear only once in the corpus. Several of the historically active assignees show zero filings in the most recent tracked year, which is consistent with the overall flat trend rather than necessarily indicating an exit from the field. Co-assignee filings are rare — only two pairs appear across all 94 families — so most organisations are filing independently rather than jointly.
That Infineon filing claims a redistribution layer conductor path built from copper combined with at least one other conductive material present at more than 0.04 mass percent by mass, arranged on a planar supporting layer. It blocks designs that rely on that specific compositional approach to durability rather than on a purely structural fix, so a design-around generally needs to either use a different alloying strategy, stay under the stated mass threshold, or achieve durability through geometry or process rather than composition. Anyone drafting a new RDL reliability claim around copper alloy composition should check this filing's priority date, 2015-04-30, against their own timeline.
The IPC composition points to several under-claimed branches relative to the dominant H01L and H10W cluster, including sensor-integrated RDL packaging, metal-core interconnect fatigue resistance, and RDL delamination claims specific to memory device manufacture. These branches show meaningfully lower filing density in this corpus than the core packaging cluster, which suggests room for a well-scoped claim, though a dedicated freedom-to-operate search is needed before relying on that gap. Low density in a landscape report is a starting signal, not a guarantee of clear space.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.