Reliability & Failure Engineering Patents: Who Is Filing, and Where the Claim Space Is Still Open
361 records in scope, spanning eight IPC subclasses from digital data processing to alloys, with no single class exceeding 35% of the set. Annual filings ran from 48 in 2017 to a peak of 137 in 2025, though the 2025 and 2026 figures are still filling in given the roughly 18-month lag between filing and publication. The more reliable read is 2021 to 2024, where filings rose from 12 to 16 — a 33% increase over three years, treated here as the last complete window.
- 1CORNING INC130
- 2SILVEBROOK KIA100
- 3ALPHA ASSEMBLY SOLUTIONS INC75
- 4GORE ENTERPRISE HOLDINGS INC33
- 5GEOTAB INC30
See the full reliability & failure engineering patent landscape analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on this landscape
Who are the leading patent filers in reliability and failure engineering?
This dataset ranks 100 companies by filing count, with the leader at 130 records, a steep drop to 30 at fifth place, and 10 at tenth place. That gap indicates one dominant filer surrounded by a long tail rather than several evenly matched competitors. Because the ranking counts records, not weighted patent value, it is best used to identify who to watch rather than who holds the strongest claims outright.
Is patent filing in reliability and failure engineering growing?
Yes, but modestly: filings rose from 12 in 2021 to 16 in 2024, a 33% increase over the three-year window the dataset treats as complete. The apparent peak of 137 in 2025 and drop to 30 in 2026 should not be read as acceleration or decline, since publication lags filing by roughly 18 months and both recent years are still filling in. The safest growth statement anyone can make from this data is the 2021-to-2024 figure.
Which patent classes dominate reliability and failure engineering filings?
Electric digital data processing (G06F) leads at 34.3% of the 361 records, followed closely by layered products and laminates (B32B) at 32.4% and semiconductor devices (H01L) at 31.0%. Glass compositions, welding and soldering, printed circuits, alloys and a further semiconductor-adjacent class each still cover more than a fifth of records. Because records can carry multiple IPC codes, these shares overlap substantially and should not be summed into a total.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Reliability & Failure Engineering Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.