Repowering & Module Reliability Patents: Who Leads, Gaps 2026
Repowering and Module Reliability Assessment Patents
77.4% concentration. The top five assignees combined account for 24 of the 31 records in scope, and the ranked ten cover all 31 — this is a field with almost no unclaimed filer base left outside a small group. Filings were at 0 in 2017, rose to a peak of 6 in 2022, and the last complete comparison window shows a drop from 2 filings in 2021 to 1 in 2024 (-50%). 2025 and 2026 are shown but understated, since publication typically lags filing by around 18 months.
- 1KLA CORP7
- 2THE BOEING CO7
- 3DELL PROD LP4
- 4INTERNATIONAL BUSINESS MACHINE CORPORATION4
- 5KIANPOUR PAYMAN2
See the full repowering and module reliability assessment analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on repowering and module reliability patents
How concentrated is patent ownership in module reliability assessment?
Very concentrated. Of the 31 records in scope, the top five assignees combined hold 24 of them, or 77.4%, and the ranked ten assignees together account for all 31 records. Practically, that means a new filer is almost certainly filing adjacent to, or on top of, claim territory already held by one of a small number of organisations. It also means the assignee ranking here is a complete picture of active filers, not a top slice of a much larger field.
Is filing activity in this space growing or shrinking?
The comparable complete-year data shows a decline: filings dropped from 2 in 2021 to 1 in 2024, a -50% change, after peaking at 6 records in 2022. That said, publication typically lags filing by around 18 months, so 2025 and 2026 figures are understated and should not yet be read as confirming a continued fall. The safest reading is that activity has cooled from its 2022 high, not that the field is closed.
What patent classes matter most for module degradation and repowering claims?
H01L (semiconductor devices) is the largest single class, covering 35.5% of the 31 records, reflecting claims tied to the physical module and cell structure. Close behind, G01R (measurement), G06F and G06Q (data and business-process processing) each cover 22.6% of records, showing that a large share of this field is claimed through testing and analytics methods rather than hardware alone. B23K, H01R and H05K, tied to joining, connectors and circuit assembly, each sit at 12.9%.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Repowering and Module Reliability Assessment covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.