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Run your analysis now →https://www.patsnap.com/resources/blog/rd-blog/rf-front-end-module-integration-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Wireless CommunicationsRF Front-End Module Integration Patents: Who Files, Who Leads, What's Open
- 61.5% of the field sits with five companies. 75 of 122 records in scope belong to the top five assignees, with a long tail of single- and few-filing entrants behind them.
- Filing grew 50% from 2021 to 2024. Annual filings rose from 4 to 6 over that span, with 2023 the peak year so far at 17 records — recent years understate activity because publication lags filing.
- H04B dominates, but power and amplifier classes trail closely. 63.1% of records touch general transmission (H04B), while power conversion, wireless networks and amplifier classes each sit near 18-19%, pointing to co-claimed subsystems rather than a single dominant technique.
122
Published Records
61%
Top-5 Share of All Records
+50%
Filing Growth 2021→2024
US
Leading Jurisdiction
Filing growth compares 2021 (4 records) with 2024 (6) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 122 records in scope (CR5), not by the ranked leaders only.
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview
What this landscape covers
RF front-end module integration sits at the junction of filter design, switch co-packaging, power amplification and thermal management inside a single package. The scope here pulls 122 published records filed between 2015 and mid-2026, indexed against claim text mentioning filters, switch co-packaging, harmonic distortion, die stacking, thermal dissipation, band count or insertion loss budget. That combination of search terms keeps the set tight to integration-level claims rather than the broader universe of discrete RF components.
Filing activity climbed through the late 2010s and peaked in 2023, with the most recent years still filling in as publications catch up to filings made 18 months or more ago. Concentration at the top of the assignee ranking is high, but the technology composition spreads across several IPC subclasses at once, which is expected when a single record claims a filter, an amplifier and a packaging technique together.
Filing volume by year, 2015-2026
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on RF Front-End Module Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data
Filing trends and technology composition
Two views of the same 122-record set: how filing volume has moved year over year, and which IPC subclasses the claims actually sit in.
A growth phase, not a plateau
Filings rose from 8 in 2017 to a peak of 17 in 2023, and the 2021-2024 window shows +50% growth (4 to 6 records). 2025 and 2026 figures are necessarily incomplete because of publication lag, so treat the tail of the chart as a floor, not a ceiling.
Transmission claims dominate, but rarely alone
H04B (general transmission) appears in 63.1% of the 122 records, far ahead of any other subclass. H02M (power conversion), H04W (wireless networks) and H03F (amplifiers) each sit near 18-19%, and H01F, G01S, H01P and H01L trail further behind — evidence that most filings bundle a transmission claim with at least one supporting subsystem claim rather than claiming a single circuit block in isolation.
Shares are the percentage of the 122 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on RF Front-End Module Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.
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Most-cited prior art in this set
Representative Filing
Electronically Tunable RF Front End Module
PARATEK MICROWAVE, INC.
The representative record describes a front-end module built from a first tunable bandpass filter capable of being tuned across multiple frequency bands, a lowpass filter, and a switch that toggles between the two paths to separate transmit and receive signal handling. A second tunable bandpass and lowpass filter pair extends the same tuning approach to a further band.Filed by Paratek Microwave, Inc.; published 2004-09-23.
Highest-citation records
| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20090289721A1 | Circuits, processes, devices and systems for full integration of RF front end module including RF power ampli… | 106 |
| 2 | US20140139366A1 | Radar-based detection and identification for miniature air vehicles | 99 |
| 3 | US20030107514A1 | Method and apparatus for saving power in a global postioning system receiver | 93 |
| 4 | US20140087673A1 | CMOS Based TX/RX Switch | 80 |
| 5 | US20140084700A1 | RF Power Amplifier Splitter | 66 |
| 6 | US20090028225A1 | Modular Satellite Transceiver | 63 |
| 7 | US20200235716A1 | RF front end module including hybrid filter and active circuits in a single package | 47 |
| 8 | US20040185795A1 | Electronically tunable RF Front End Module | 45 |
| 9 | US20140087671A1 | Radio Frequency Front End Module Circuit Incorporating An Efficient High Linearity Power Amplifier | 42 |
| 10 | US20140073268A1 | RF front end module and mobile wireless device | 42 |
Citation counts reward older filings that have had more time to accumulate citations inside this corpus; treat them as a signal of influence on the field, not of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on RF Front-End Module Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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What the numbers mean for a filing decision
Three readings of the dataset that matter more for strategy than the raw counts alone.
Concentration
61.5%
of 122 records held by top 5 assignees
The top of the field is crowded, the rest is open
Five assignees hold 75 of the 122 records in scope, a level of concentration that means core switching and filter-integration claims near the leaders are likely to run into dense prior art. The ranked list runs to 46 companies total, so beyond the leading group the filing pattern thins out quickly into single- and few-record entrants.
Based on the full 46-company assignee ranking.
Filing momentum
+50%
growth 2021 to 2024 (4 to 6 records)
Growth is real but recent, and the tail understates it
The three-year window from 2021 to 2024 is the cleanest read on momentum because 2024 is the most recent year publication lag has largely caught up with. 2023's peak of 17 records suggests the field was still adding filings faster than this three-year average implies before settling.
2025-2026 figures will rise as later publications appear.
Claim breadth
63.1%
of records touch H04B (transmission)
Claims bundle subsystems rather than isolate them
With H02M, H04W and H03F each present in roughly a fifth of records alongside H04B, most filings in this set claim a transmission element together with a power, network or amplifier element. A narrowly drafted single-block claim is less common here than a claim spanning the module boundary.
Class shares sum above 100% because records carry multiple IPC codes.
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Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to rf front-end module integration, with the prior art for and against each one.
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on RF Front-End Module Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Who's Filing
The assignee landscape
46 companies appear in the ranking behind this dataset. The leader holds 27 records; by the tenth position that figure has fallen to 2, which is the shape of a field with a small core of repeat filers and a long tail of occasional ones.
Leader
27
records held by the top assignee
One filer sets the pace
The leading assignee's 27 records are more than four times the fifth-place count of 6, establishing a clear first position that any new entrant working on similar integration claims will need to map against directly.
Counted in records within the 122-record scope.
Mid-field
6
records at fifth place
The drop-off after the leader is steep
Fifth place sits at 6 records, and tenth place falls to just 2 — the top 10 combined still account for 74.6% of all 122 records, so most of the remaining 36 ranked companies hold only a handful of filings each.
Top 10 combined: 91 of 122 records.
Collaboration
10
co-assignee pairs identified
Co-filing is limited and concentrated among a few inventors
Only 10 co-assignee pairs appear in the dataset, and the strongest three pairings all involve the same trio of inventor names appearing together repeatedly rather than a broad web of joint filers.
Strongest pairs recur at 4 shared records each.
Recent-year filing momentum by assignee
| Assignee | Recent year | YoY |
|---|---|---|
| DSP Group | 0 | — |
| Jio Platforms Ltd | 0 | — |
| NXP B.V. | 0 | — |
| Microchip Technology Inc | 0 | — |
| Intel Corp | 0 | — |
| Nokia Corporation (Finland) | 0 | — |
| Sony Mobile Communications Inc | 0 | — |
| Samsung Electronics Co., Ltd. (Korea) | 0 | — |
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on RF Front-End Module Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next
Where to take this from here
The dataset points to a concentrated core and a wide, thinly-claimed periphery. Two practical next steps follow from that.
Map claims against the leading assignees directly
With 61.5% of records held by five companies, any new filing near core switching or filter-integration claims should be checked against those portfolios first, not against the full 46-company ranking.
Explore assignee portfolios in EurekaTest the under-claimed branches for freedom to operate
Thermal dissipation, insertion-loss budgeting and multi-band switch co-packaging show lighter filing density than the transmission core, which is where a narrowly drafted new claim is more likely to clear.
Run a white-space search in EurekaSource: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on RF Front-End Module Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ
Common questions on RF front-end module patents
One assignee leads the ranked field with 27 of the 122 records in scope, well ahead of the fifth-place holder at 6. The top five assignees combined account for 61.5% of all records, so the field's core claim space is concentrated in a small group of companies rather than spread evenly across the 46 ranked assignees. Anyone assessing freedom to operate near switching or filter-integration claims should start by checking that leading group's portfolio directly.
Yes, based on the cleanest available window: filings rose from 4 in 2021 to 6 in 2024, a 50% increase, with 2023 marking the peak year so far at 17 records. Figures for 2025 and 2026 will look lower in the raw data, but that reflects publication lag of roughly 18 months rather than a real slowdown. Treat any apparent dip in the most recent one to two years as incomplete rather than declining.
General transmission claims under IPC class H04B appear in 63.1% of the 122 records, making it the most common single class by a wide margin. Power conversion (H02M), wireless networks (H04W) and amplifiers (H03F) each appear in roughly 18-19% of records, usually alongside a transmission claim rather than standing alone. This pattern indicates most filings bundle a transmission element with at least one supporting subsystem claim.
This filing from Paratek Microwave describes an electronically tunable RF front-end module built around a first tunable bandpass filter, a lowpass filter, and a switch that toggles between transmit and receive paths, with a second tunable filter pair extending the design to an additional band. It serves as a representative record for the tunable-filter-plus-switch architecture that recurs across this dataset. Anyone designing a multi-band front end with switched filter paths should read its claims closely before assuming a clear path around it.
Relative to the dense transmission and switching core, sub-areas like die-stacking thermal paths, insertion-loss budget optimisation, and multi-band switch co-packaging show lighter filing density in this dataset. That does not guarantee an easy filing, since 46 companies are already active across the field, but it does mean claim language in these branches is less crowded than in the core transmission classes. A targeted search against the specific IPC subclasses involved is the necessary next step before relying on this as a filing strategy.
Answers are grounded in the same dataset. Derived from a Patsnap search on RF Front-End Module Integration covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.