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Robotic DED Automation Patent Snapshot 2026

Robotic DED Automation Patent Snapshot 2026
Evidence Snapshot
Robotic DED Automation Patent Snapshot in 2026

The robotic directed energy deposition (DED) automation patent corpus is nascent and highly fragmented, with all 4 patent families concentrated in India and filed almost entirely in 2025–2026. No dominant commercial incumbent has yet emerged, leaving the competitive structure defined by individual academic and research contributors rather than by established industrial players.

4
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
India
Leading jurisdiction
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Published byPatsnap Insights Team··5 min readVerified by Patsnap Eureka data
Overview

A nascent, fragmented field led by Indian academic filers

The corpus contains 4 patent families in scope, all filed in India. The top-ranked applicant — Dr Biplab Hazra — holds 1 patent record, a position shared by every other applicant in the ranking, indicating no meaningful concentration advantage for any single filer at this stage.

The top five filers collectively account for 50% of the ranked applicants visible in this query’ combined total, but given the extreme smallness of the corpus this reflects an equally distributed field rather than a genuine tier gap between leaders and challengers. No applicant has yet established a portfolio depth that would confer a defensive moat.

Leading applicants
#ApplicantPatent recordsShare
1Dr Biplab Hazra1
2Dr Jagadish Parida1
3Dr Bishub Choudhury1
4Sathish Kumar Parimi1
5Nitte Deemed to be University1
6Dr Arka Ghosh1
7Dr Hari Narayan Singh Yadav1
8Madan Mohan Malaviya University of Technology1
9Dr Shakti Kumar1
10Dr Bappa Das1
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The dominance of individual researcher names and academic institutions (Nitte Deemed to be University, Madan Mohan Malaviya University of Technology) signals that robotic DED automation remains largely a research-stage topic with limited industrial appropriation to date. This implies a wide-open opportunity for commercial entities to establish early first-mover positions.

The most recent filings (20252026) are subject to standard patent-publication lag and the true volume of recent activity is likely under-represented in this dataset. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Activity concentrated in 2025–2026; welding and additive manufacturing dominate the technology mix

The filing trend and technology composition charts together reveal a field that emerged from a standing start in 2025, anchored in welding-process and 3D-printing classification codes with sparse coverage of adjacent application domains.

Annual filing trend

Zero filings are recorded from 2017 through 2024; 3 patent records appear in 2025 and 1 in 2026. Because filings from the most recent 18–24 months are subject to publication lag, the 2026 figure almost certainly understates actual activity. The inflection in 2025 marks the apparent start of formal IP activity in this space.

Annual filing trendAnnual values from 2017 to 2026, peaking at 3 in 2025.02017020180201902020020210202202023020243202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

B23K (welding, soldering and brazing) is the visible IPC class, covering all 4 patent records, followed by B33Y (additive manufacturing / 3D printing) with 3 records. Five additional classes — B23P (metal working), C23C (coating and surface deposition), G06N (AI-based computing), H01M (batteries and fuel cells), and H02J (power supply and grid systems) — each appear once, signalling early-stage breadth without depth in any single branch.

Technology compositionB23K · Welding, soldering & brazing leads with 4; B33Y · Additive manufacturing (3D printing) 3.B23K · Welding, solderin…4B33Y · Additive manufact…3B23P · Metal working (ge…1C23C · Coating & surface…1G06N · Computing based o…1H01M · Batteries, cells …1H02J · Power supply & gr…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
IN202511064159APublished 2025-08-22

Fabrication of wear-resistant monel-inconel 625 bi…

Madan Mohan Malaviya University Of Technology

This study developed a multi-layer wall of Monel-IN625 bi-metallic components using wire arc additive manufacturing (WAAM) with a robotic gas metal arc welding (GMAW) process. Detailed research was conducted on the morphology, microstructure, and wear behavior of bimetallic specimens produced by WAAM. The microstructure analysis revealed equiaxed and… (excerpt from the patent abstract)

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Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · DR BIPLAB HAZRA

Dr Biplab Hazra

Dr Biplab Hazra is the top-ranked filer with 1 patent record, focused on B23K welding/soldering and B23P metal-working subclasses. No prior-period filings are recorded, so no momentum trend is computable. As an individual researcher, portfolio depth is currently limited to a single filing.

families: 1
Challenger · NITTE(DEEMED TO BE UNIV)

Nitte Deemed to be University

Nitte Deemed to be University holds 1 patent record with IPC emphasis on B23K welding and B33Y additive manufacturing subclasses (B33Y10, B33Y30), distinguishing it from the purely welding-focused individual filers. It is one of only two institutional (non-individual) applicants in the ranking, alongside Madan Mohan Malaviya University of Technology.

families: 1
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Madan Mohan Malaviya University of TechnologyDr Jagadish Parida+ more
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Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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