https://www.patsnap.com/resources/blog/rd-blog/selective-laser-sintering-polymer-printing-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape · Additive Manufacturing
Selective Laser Sintering Polymer Printing Patents: Who Holds the Ground
  • Filing peaked in 2017 at 57 records and has declined every year since, with the 2022 midpoint at just 19 — a claim space that opened early and has gone quiet rather than one still accelerating.
  • Thermal-feedback control during sintering is the single most-cited cluster in the dataset, led by a family of related filings on sintering with thermal image feedback that together draw well over 800 citations.
  • B29C and B33Y dominate the IPC mix at 280 and 277 records respectively, while polymer-chemistry classes like C08L, C08J and C08K sit far lower — the compositional side of the technology is comparatively under-filed against the process side.
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338
Published Records
30%
Top-5 Share of All Records
-90%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (41 records) with 2024 (4) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 338 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this patent set covers

This landscape tracks patent families at the intersection of selective laser sintering (SLS) process control and polymer powder materials — filings that combine laser sintering terminology with polyamide/PA12 SLS, powder recycling, or laser sintering process claims, classified under the core additive-manufacturing and plastics-shaping IPC groups. It spans 338 patent families published between 2015 and mid-2026.

The mix leans heavily toward process and equipment claims — powder bed formation, thermal monitoring, calibration — rather than novel polymer chemistries, which show up as a smaller but still meaningful share of the corpus.

Filing activity by year, 2017-2026
  1. 1BASF SE35
  2. 23D SYSTEMS INC25
  3. 3EVONIK OPERATIONS GMBH16
  4. 4LUBRIZOL ADVANCED MATERIALS INC13
  5. 5HEXCEL CORP11
  6. 6EOS GMBH ELECTRO OPTICAL SYST9
  7. 7VIKELA ARMOUR LTD9
  8. 8ORTHOPAEDIC INNOVATION CENT9
  9. 9TIGERWERK LACK & FARBENFAB9
  10. 10D SYST INC8
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Selective Laser Sintering Polymer Printing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trend and technology composition

Two views of the same 338 families: when they were filed, and which IPC subclasses they sit in. Because publication lags filing by roughly 18 months, the last one or two years in the trend chart will always look thinner than they eventually turn out to be.

A peak year that has not been matched since

Filings rose to 57 in 2017, the high point of the dataset, then fell through the 2022 midpoint of 19 and continued down toward the single-digit range shown for 2026 — a partial year. Read as a whole, the curve describes a technology that had an early land-grab phase rather than one still building momentum.

A peak year that has not been matched since0153045605720172018201920202021202220232024202512026Most recent year is partial — publication lag means later filings are not yet visible.

Process classes outweigh materials classes

B29C (shaping of plastics) and B33Y (additive manufacturing) each appear in the large majority of records, confirming this is primarily a process-and-machine literature. The polymer-chemistry classes — C08L, C08J, C08K, C08G — appear at roughly a third to a sixth of that frequency, and B22F (powder metallurgy) sits in between, reflecting shared powder-handling claims that cross over from metal AM.

Process classes outweigh materials classesB29C · Shaping of plastics28082.8%B33Y · Additive manufacturing (3D pri…27782.0%B22F · Powder metallurgy10129.9%C08L · Polymer compositions9427.8%B29K · Plastics moulding materials (i…5917.5%C08J · Polymer processing & solutions5115.1%C08K · Use of additives in polymers5014.8%C08G · Condensation polymers4613.6%Other26779.0%

Shares are the percentage of the 338 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Selective Laser Sintering Polymer Printing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited filings in this set

Representative filing
US20170282247A12017-10-05

Modeling of nanoparticle agglomeration and powder bed formation in microscale selective laser sintering systems (US20170282247A1)

BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM

Filed by the Board of Regents of the University of Texas System, this application models how nanoparticle powder beds form during microscale SLS, using discrete element modeling for particle-scale forces and heat-transfer analysis to predict sintering outcomes and the resulting mechanical and electrical properties of printed parts.Publication date 2017-10-05.

US20170282247A1 — patent drawing 1US20170282247A1 — patent drawing 2
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Highest-citation records
#Publication no.Patent titleCitations
1EP1466718A2Sintering using thermal image feedback313
2US6815636B2Sintering using thermal image feedback282
3US20040200816A1Sintering using thermal image feedback224
4US6930278B1Continuous calibration of a non-contact thermal sensor for laser sintering190
5US20040102539A1Laser sintering powder with improved recycling properties, process for its production, and use of the laser s…147
6US20050027050A1Laser sinter powder with a metal salt and a fatty acid derivative, process for its production, and moldings p…108
7EP1634694A2Continuous calibration of a non-contact thermal sensor for laser sintering46
8US20170008233A1Methods of using thermoplastic polyurethanes in selective laser sintering and systems and articles thereof44
9US20170008234A1Powder Distribution for Laser Sintering Systems37
10US20180141119A1Metal Flake Composites and Methods of Making and Using the Same for Additive Manufacturing33

Citation counts are measured within the searched corpus and skew toward older filings; treat them as a signal of influence on the field, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Selective Laser Sintering Polymer Printing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers say about where this field stands

Three patterns stand out once filing dates, IPC codes and citation counts are laid side by side.

Filing trend
57 → 1
peak (2017) to latest year

A claim space that opened early and cooled

The jump to 57 filings in 2017 followed by a steady decline through the 2022 midpoint of 19 suggests the core process claims — powder handling, thermal feedback, calibration — were staked out in the mid-2010s. New entrants today are filing into a landscape where the foundational moves are already made.

Filing trend, 2017-2026
Citation concentration
313 citations
top-cited record

Thermal feedback control anchors the field

The two highest-cited records, both titled around sintering with thermal image feedback, draw 313 and 282 citations respectively, with a related continuation adding 224 more. That cluster, plus a calibration patent at 190 citations, means real-time thermal monitoring during the sintering pass is the most heavily referenced technical approach in the corpus.

Most-cited records
IPC composition
280 vs 94
B29C records vs C08L records

Process claims outnumber materials claims by roughly 3:1

B29C (shaping of plastics) appears in 280 of 338 records; C08L (polymer compositions) appears in only 94. Powder-recycling and process-parameter claims are far more densely filed than new powder-chemistry claims, which is one reason the compositional side reads as comparatively open.

IPC subclass distribution
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Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to selective laser sintering polymer printing, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Selective Laser Sintering Polymer Printing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is active, and where the gate sits

Recent-year momentum across the named assignees in this dataset reads flat: several of the more established filers, across chemicals, 3D-printing equipment and materials suppliers, show zero filings in the latest year, consistent with the overall decline from the 2017 peak. That does not mean the space is abandoned — it means the current wave of activity is not concentrated among the historically largest filers.

Filing pattern
338 families
total in this landscape

Concentration at the top, a long tail beneath

The ranking (rendered separately) shows a small group of assignees with multi-filing histories against a much larger set of single or few-filing entrants — typical of a mature process niche rather than one still in a land grab.

Assignee ranking
Momentum
0 in latest year
for several named assignees

Established filers have gone quiet recently

Multiple assignees with substantial historical filing records show no activity in the most recent year captured. Given the roughly 18-month publication lag, some of this is an artifact of the data cut-off rather than a genuine stop in R&D.

Recent-year momentum
Collaboration
2 co-filings
strongest co-assignee pair

Co-assignment is rare in this corpus

The strongest co-assignee pairing in the dataset appears only twice, indicating that most work here is filed by a single assignee rather than through joint ventures or multi-party research collaborations.

Co-assignee pairs
🔍
Under-claimed branches worth a closer look
Sub-areas where filing density is comparatively thin relative to the core process claims.
PA12 powder recyclate blendingin-situ nanoparticle powder bed modelingcondensation-polymer (C08G) powder formulationsmulti-material sintering additives (C08K)microscale/nanoscale SLS process control
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Recent-year filing momentum by assignee
AssigneeRecent yearYoY
BASF SE0
3D Systems, Inc.0
Evonik Operations GmbH0
Lubrizol Advanced Materials, Inc.0
Xerox Corporation0
Hexcel Corporation0
Degussa AG0
Vitracoat Armor Ltd.0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Selective Laser Sintering Polymer Printing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The trend and IPC data point to specific next steps depending on what a reader needs to decide.

Check freedom to operate against the thermal-feedback cluster

Given how concentrated citations are around sintering-with-thermal-feedback claims, any process that monitors or adjusts laser input in real time during a sintering pass should be checked against that specific family before development proceeds.

Run a freedom-to-operate search in Eureka

Map the polymer-chemistry gap in detail

C08L, C08J and C08K filing counts are well below the process classes, which may reflect genuine white space in new powder formulations rather than lack of interest. A targeted search on those subclasses alone would clarify whether the gap is real or already covered by adjacent metal-AM filings.

Explore materials white space in Eureka

Track whether the 2026 dip is real or a lag artifact

Because publication lags filing by around 18 months, the drop shown for the most recent years needs revisiting in six to twelve months before concluding the field is genuinely shrinking.

Set a filing-trend alert in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Selective Laser Sintering Polymer Printing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about SLS polymer printing patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Selective Laser Sintering Polymer Printing covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.