Book a demo

SLS Process Automation Patents: Leaders, Trends & White Space 2026

SLS Process Automation Patents: Leaders, Trends & White Space 2026
https://www.patsnap.com/resources/blog/rd-blog/selective-laser-sintering-process-automation-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Additive Manufacturing · Patent Landscape
Selective Laser Sintering Process Automation Patents
  • A small, tightly-scoped corpus. Only 11 published families match automated depowdering, build handling and process control claims within SLS — this is a narrow filing niche, not a crowded field.
  • Filing peaked in 2018 and has not recovered. Five families published that year against a flat-to-declining trend through the dataset's midpoint, suggesting the initial wave of automation claims has already been staked out.
  • Powder metallurgy overlaps plastics shaping. Five of eleven records also sit in B22F (powder metallurgy), showing that depowdering and process-control claims are being filed across both polymer and metal SLS routes.
Get a prior-art report on your approach
11
Published Records
100%
Top-5 Share of All Records
EP
Leading Jurisdiction
5
Active Filers Ranked
Published byPatsnap Research··6 min readSourced from Patsnap Eureka
Overview

What this patent set covers

This landscape isolates patents at the intersection of selective laser sintering and the automation layer around it: automated depowdering, build handling automation, powder management automation and process control. It excludes general SLS machine patents that make no automation claim, and excludes automation patents that are not tied to a laser sintering or powder-bed process step.

The corpus is small — 11 published families — which means individual filings carry disproportionate weight in any ranking. Read the assignee and citation tables as indicators of who staked early claims, not as a measure of a large competitive field.

Filing activity and technology composition
  1. 1Hexcel Corporation4
  2. 2RWTH Aachen University3
  3. 3MORPHICA SRL2
  4. 4Zimtronics Catalytic Systems Inc.1
  5. 5W MARK BIELAWSKI1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Selective Laser Sintering Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Let an AI agent run this analysis on your own technology

Pick a task. Every answer cites the patents behind it.

10,000 free credits to start
The Data

Filing trend and technology composition

Publication counts and IPC composition for the 11 families matching automated depowdering, build handling and process control claims in selective laser sintering.

Filing trend, 2017-2026

Filings rose to a peak of 5 in 2018, then flattened; the 2022 midpoint sits at 5 as well, and the curve does not show renewed growth toward the end of the window. As always, the most recent year or two is understated because publication lags filing by roughly 18 months.

Filing trend, 2017-20260134502017520182019202020215202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

IPC subclass distribution

Every record sits in B29C (shaping of plastics), and most also carry a B33Y additive-manufacturing tag; five records cross into B22F powder metallurgy, showing the automation claims are not confined to one material route. Smaller counts in B01F, B23K, B29K, B01J and C12N mark occasional overlap with mixing, joining and materials-index classifications rather than a distinct sub-field.

IPC subclass distributionB29C · Shaping of plastics11100.0%B33Y · Additive manufacturing (3D pri…763.6%B22F · Powder metallurgy545.5%B01F · Mixing & stirring218.2%B23K · Welding, soldering & brazing218.2%B29K · Plastics moulding materials (i…218.2%B01J · Chemical/physical processes & …19.1%C12N · Microorganisms & genetic engin…19.1%

Shares are the percentage of the 11 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Selective Laser Sintering Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

Go deeper on Selective Laser Sintering Process Automation with Eureka

This page is one run against one query. Ask Eureka your own question about selective laser sintering process automation and every answer comes back with the patent numbers behind it.

Try Eureka
Key Patents

The most-cited records in this set

Representative filing
US20200376750A12020-12-03

System For Selective Laser Sintering (US20200376750A1)

HEXCEL CORPORATION

A system for producing an object from a powder by selective laser sintering. The system includes a chamber and a support platform in the chamber. A spreader applies a layer of powder to a bed surface. An irradiation source irradiates select points in the powdered layer prepared on the support platform. A radiant heater heats at least a portion of the bed surface. A temperature sensor monitors the temperature of select points on the bed surface. A controller adjusts the radiant heater in response to temperature data provided by the temperature sensor.Filed by Hexcel Corporation; published 2020-12-03.

US20200376750A1 — patent drawing 1US20200376750A1 — patent drawing 2
View full record
Most-cited families
#Publication no.Patent titleCitations
1WO2018200628A1System for selective laser sintering9
2US20200376750A1System For Selective Laser Sintering1
3US11312069B2System for selective laser sintering1

Citation counts reflect influence within this searched corpus and favour older filings; a low count on a recent family does not mean it is weak.

Publication numbers are shown where the record carries one (3 of 3 rows); clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Selective Laser Sintering Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Run it yourself

Put your own technology through the same analysis

 
Where to run it
Fastest

Eureka on the web

When you want the answer in the next five minutes.

The agent works the prompt against patents and technical literature, citing every source.

Run your analysis now →
For builders

MCP server & REST API

When it has to run inside your own pipeline.

Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.

Browse MCP servers →
Insights

What the numbers say

Three readings of the dataset that matter for anyone deciding whether to file, license or design around work in this space.

Filing pace
5 in 2018, peak year
peak-year filings

The wave has crested

Filings peaked at 5 in 2018 and the trend is flat to declining through the 2022 midpoint. A niche this size with a single peak year suggests the core automation concepts — depowdering, bed heating control, powder recycling loops — were claimed early rather than being an active filing race today.

Based on 11 published families, 2015-2026.
Citation concentration
9 citations, top record
top citation count

One family anchors the citation graph

WO2018200628A1 draws 9 citations against 1 apiece for the next-ranked records. That gap means later filers are largely building on or around one early system claim rather than citing a broad base of prior art.

Citation counts favour older records within this corpus.
Cross-domain overlap
5 of 11 records in B22F
powder metallurgy overlap

Automation claims span polymer and metal SLS

Nearly half the set also classifies under powder metallurgy, meaning the automated depowdering and process-control claims are not written narrowly for plastics — the same mechanical and control concepts are being asserted across metal powder-bed processes too.

IPC composition across the 11-family set.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to selective laser sintering process automation, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Selective Laser Sintering Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who holds claims here

With only 11 families in the set, the assignee table is short and each entrant holds a small number of filings. None of the tracked assignees show filing activity in the latest year, consistent with the flat post-2018 trend.

Aerospace materials
Cited 9x
lead citation count

Hexcel Corporation

Hexcel's system claims — chamber, spreader, radiant heater and temperature-sensor feedback loop — anchor the most-cited family in this set and describe a closed-loop bed-temperature control approach to SLS.

US20200376750A1 and related family members.
Research institution
Single-digit filings
family count

RWTH Aachen University

Academic filings from Aachen sit in the same IPC space, reflecting research-stage process-control work rather than a commercial product line.

No activity recorded in the latest tracked year.
Independent inventor / small entity
Long tail
of the 11-family set

Morphica Srl and individual filers

Smaller entrants such as Morphica Srl and individually named inventors round out the tail. Each holds a narrow slice of claim space rather than a defensible portfolio position.

Recent-year momentum flat across all tracked assignees.
🔍
Under-claimed sub-areas
Branches with thin or no direct coverage in this 11-family set — starting points for a freedom-to-operate check rather than confirmed white space.
Closed-loop powder recycling sensorsAutomated build-plate unloading roboticsIn-situ powder degradation monitoringMulti-material powder-bed sequencing controlCross-batch powder blend traceability
Rank all filers by momentum →
Recent-year filing momentum
AssigneeRecent yearYoY
Hexcel Corporation0
RWTH Aachen University0
MORPHICA SRL0
Zimtronics Catalytic Systems Inc.0
W MARK BIELAWSKI0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Selective Laser Sintering Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this

The dataset points to a narrow, early-staked field rather than an active filing race. Two directions follow from that.

Run a freedom-to-operate check before filing

Because citation weight concentrates on one early Hexcel family, any new depowdering or bed-control claim should be checked against that system claim specifically, not just against the broader SLS art.

Check claim overlap in Eureka

Watch for a second filing wave

A flat trend since 2018 does not rule out renewed activity; the most recent one to two years are understated by publication lag, so re-run this search in six months to see if filings pick up.

Track this landscape in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Selective Laser Sintering Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on SLS process automation patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Selective Laser Sintering Process Automation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

Research Selective Laser Sintering Process Automation in depth with Eureka

Go past this page: query the whole selective laser sintering process automation corpus yourself, in your own scope.
Every answer comes back with patent numbers you can open.

Try Eureka

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

Help us improve this page

Found incorrect or outdated information? Let us know and we'll get it fixed.