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Self-Sensing Carbon Fiber Patent Snapshot 2026

Self-Sensing Carbon Fiber Patent Snapshot 2026
Evidence Snapshot
Self-Sensing Carbon Fiber Patent Snapshot in 2026

Self-sensing carbon fiber patent activity is concentrated among a small number of Japanese and American industrial filers, with Integral Technology and Hodogaya Chemical holding the largest positions. The field has reached a mature plateau, with annual volumes easing from a 2019 peak while remaining above early-decade baselines.

28
Patent families in scope
35%
Top visible applicants share
+13%
3-yr filing growth (lag-adj.)
United States
Leading jurisdiction
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Published byPatsnap Insights Team··7 min readVerified by Patsnap Eureka data
Overview

A compact, Japan- and US-led field with pronounced leader concentration

Integral Technology Inc leads the ranked applicant list, followed closely by Hodogaya Chemical Co Ltd and Tec One Co Ltd, with Teijin Ltd and Compagnie Plastic Omnium rounding out a tight top five.

The top five filers account for thirty-five percent of the combined total for the ranked applicants visible in this query, indicating a concentrated but not wholly monopolized visible assignee structure. A visible gap opens between the top tier and mid-ranked entrants, suggesting meaningful barriers to scale.

Leading applicants
#ApplicantPatent recordsShare
1Integral Technology Inc22
2Hodogaya Chemical Co Ltd21
3Tec One Co Ltd17
4Teijin Ltd11
5Compagnie Plastic Omnium SA7
6Toray Industries Inc7
7Shinshu University6
8The University of Tokyo6
9GSI Creos Corp5
10Yazaki Corp5
#ApplicantPatent recordsShare
11Shimizu Corp4
12Resonac Holdings Corp4
13CTS Corp4
14Yanagida Hiroaki4
15Beijing Mega Material Innovation Work M2IW Co Ltd3
16University of Nottingham Ningbo China3
17Tianjin Polytechnic University2
18University of Kentucky Research Foundation2
19SOK2
20Intematix Corp2
↗ Hover a row · click a company to ask Eureka

The leaders’ positions imply that core fiber functionalization and conductor-integration know-how are well defended; new entrants are more likely to find traction in adjacent processing or application sub-classes than in direct frontal competition on fiber chemistry.

Filings from approximately the past eighteen to twenty-four months are likely under-counted due to standard patent publication lag and should not be read as a reduction in activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent records; the corpus total is measured in patent families. These figures use different units and should not be compared directly. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A maturing filing curve with a broad, multi-class technology footprint

The annual filing trend and the IPC class distribution together reveal a field that has passed its growth peak but retains diverse technical engagement across fiber chemistry, electrical engineering, and polymer processing branches.

Annual filing trend

Filings climbed from three records in 2017 to a peak of five in 2019, then fell to a low of one in 2021 before recovering to four in 2022. Years 2024 onward should be treated as preliminary due to publication lag — apparent softness does not necessarily reflect a real decline.

Annual filing trendAnnual values from 2017 to 2026, peaking at 5 in 2019.32017420185201922020120214202222023320243202512026↗ Hover for values · click a bar to ask Eureka

Technology composition

D01F (chemical filament and fibre features) and H01B (cables, conductors and insulators) are the visible IPC classes, reflecting the dual identity of self-sensing fiber as both a structural and an electrical material. C08L, C08K, and B29C represent a secondary cluster focused on polymer formulation and shaping, signaling ongoing integration work at the composite level.

Technology compositionD01F · Chemical filament & fibre features leads with 95; H01B · Cables, conductors & insulators 86.D01F · Chemical filament…95H01B · Cables, conductor…86C08L · Polymer compositi…39C08K · Use of additives …38C01B · Non-metallic elem…31B29C · Shaping of plastics29B32B · Layered products …26H01M · Batteries, cells …25↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20220270780A1Published 2022-08-25

Thickness direction conductive laminated composite…

Beijing Mega Material Innovation Work (M2IW) CO., LTD.

A thickness direction conductive laminated composite material, comprising: laminated multiple layers of carbon fiber; a curable resin which is disposed among the laminated multiple layers of carbon fiber, coats the laminated multiple layers of carbon fiber and bonds the laminated multiple layers of carbon fiber together; and a conductive material, the… (excerpt from the patent abstract)

Thickness direction conductive laminated composite… — patent drawingThickness direction conductive laminated composite… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Low cost shielded cable manufactured from conducti…113
2Manufacturing methods of catalysts for carbon fibe…106
3Prepreg and carbon fiber reinforced composite mate…100
4一种高强度宏观石墨烯导电纤维的制备方法61
5Carbon fiber nonwoven fabric, carbon fiber, produc…49
6Ultrathin carbon fibers49
7Activated carbon, method for production thereof an…45
8Electromagnetic shielding composite45

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Integral Technology Inc

Integral Technology Inc

Integral Technology Inc holds the top position with twenty-two patent records. Its technology emphasis spans plastics shaping (B29C 45), antenna integration (H01Q 1), and cable and conductor applications (H01B 1), indicating a strategy oriented toward end-use electromagnetic and structural composite products rather than raw fiber chemistry. Applicant momentum data is not available in the current evidence set.

records: 22
Challenger · Hodogaya Chemical Co Ltd

Hodogaya Chemical Co Ltd

Hodogaya Chemical Co Ltd holds twenty-one patent records, placing it within one record of the leader. Its focus on D01F 9 (chemical filament and fibre features), C01B 31 (non-metallic elements and inorganic compounds), and C08J 5 (polymer processing) marks it as a fiber chemistry and materials specialist — a complementary but distinct route from Integral Technology’s application-layer emphasis. Applicant momentum data is not available in the current evidence set.

records: 21
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Tec One Co LtdTeijin Ltd+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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