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SHJ Low-Ag / Indium-Free Solar Cell Patent Snapshot

SHJ Low-Ag / Indium-Free Solar Cell Patent Snapshot
Evidence Snapshot
SHJ Low-Ag / Indium-Free Solar Cell Patent Snapshot in 2026

The SHJ low-silver and indium-free heterojunction solar cell field is a nascent but expanding space, with Delft University of Technology holding the largest share of an 8-family corpus and China accounting for the majority of filing jurisdictions. Activity has grown substantially on a multi-year basis, though annual volume eased from its 2022 peak and the most recent years remain understated by publication lag.

8
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
China
Leading jurisdiction
↗ Tap any metric to explore the underlying patents and uncover deeper insights in Patsnap Eureka
Published byPatsnap Insights Team··5 min readVerified by Patsnap Eureka data
Overview

A nascent field dominated by academic and specialist entrants

Delft University of Technology leads with 2 patent families, followed by seven applicants — Xidian University, the Institute of Physics at the Chinese Academy of Sciences, Nuovo Film Suzhou. China Inc., Anhui Qianjing Yuchen New Energy, Meyer Burger (Germany) GmbH, Amoco Enron Solar, and Jiashanxian Dengding Technology — each holding 1 patent family.

The top five filers account for 67% of the combined total among the ranked applicants visible in this query, indicating meaningful concentration for so small a corpus. The gap between the leader and the remaining applicants is narrow in absolute terms — one family — suggesting no single entity has established a commanding structural advantage.

Leading applicants
#ApplicantPatent familiesShare
1Delft University of Technology2
2Xidian University1
3Institute of Physics, Chinese Academy of Sciences1
4Nuovo Film Suzhou China Inc.1
5Anhui Qianjing Yuchen New Energy Co., Ltd.1
6Meyer Burger (Germany) GmbH1
7Amoco Enron Solar1
8Jiashanxian Dengding Technology Co., Ltd.1
↗ Hover a row · click a company to ask Eureka

The presence of academic institutions (Delft, Xidian, CAS Physics Institute) alongside industrial specialists (Meyer Burger, Nuovo Film) and smaller Chinese firms indicates the field sits at the research-to-commercialization interface, where foundational claims are still being staked.

The most recent two years of filings are likely understated due to typical patent publication lag of 18–24 months and should not be interpreted as reduced activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Multi-year growth from a low base, concentrated in semiconductor device claims

Filing activity emerged from zero in 2017–2019, began in 2020, and reached a peak of 3 families in 2022 before easing. The technology mix is heavily weighted toward semiconductor device patents, with a small cluster of coating and electroplating approaches.

Annual filing trend

The field recorded no filings from 2017 through 2019, then grew steadily to a 2022 peak of 3 families. The subsequent easing in 2023–2024 and apparent zero in 2025–2026 should be interpreted with caution given publication lag; the three-year recent window remains 200% above the prior equivalent window. The 2022 peak marks the field’s highest single-year activity on record.

Annual filing trendAnnual values from 2017 to 2026, peaking at 3 in 2022.02017020180201912020120213202222023120240202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

H01L (semiconductor devices) accounts for the large majority of patent records, reflecting that core cell architecture and junction engineering are visible in current filings. C23C (coating and surface deposition) and C25D (electroplating and electroforming) each appear with a single record, pointing to emerging interest in alternative transparent conductive contact deposition methods.

Technology compositionH01L · Semiconductor devices leads with 10; C23C · Coating & surface deposition 1.H01L · Semiconductor dev…10C23C · Coating & surface…1C25D · Electroplating & …1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20220149225A1Published 2022-05-12

Method of production of silicon heterojunction sol…

Meyer Burger (GERMANY) GMBH

The present invention relates to a method of production of silicon heterojunction solar cells having at least one stabilization step, wherein the stabilization step is performed after amorphous silicon layers, and preferably also transparent layers or even metallic contact materials, have already been applied beforehand to crystalline silicon solar wafers… (excerpt from the patent abstract)

Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1Copper oxide/N-silicon heterojunction photovoltaic…13
2Method for forming indium oxide/n-silicon heteroju…6
3一种HJT太阳能电池5
4Method of production of silicon heterojunction sol…2
5一种含有透明导电氧化物层结构的晶硅异质结太阳能电池及其制备方法1

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Delft University of Technology

Delft University of Technology

Holds 2 patent families, the largest share in the corpus, both concentrated in H01L 31 (semiconductor devices for photovoltaic applications). Momentum is classified as a new entrant, indicating recent initial filing activity rather than a sustained historical position. As a leading photovoltaic research institution, Delft’s focus on junction-level architecture suggests foundational claim-building in silicon heterojunction contact design.

families: 2
Challenger · Xidian University

Xidian University

Holds 1 patent family but is the only applicant in the corpus with claims spanning C23C 18 (coating and surface deposition), C23C 28 (multilayer coatings), and C25D 3 (electroplating), in addition to H01L 31. This multi-branch technical footprint distinguishes Xidian as the sole filer pursuing deposition and electroplating routes for low-Ag or indium-free contacts, representing a differentiated process-engineering approach. Momentum is classified as a new entrant.

families: 1
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Institute of Physics, Chinese Academy of SciencesMeyer Burger (Germany) GmbH+ more
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Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
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Frequently asked questions

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This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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