SiC Module Environmental Durability Patent Snapshot
The SiC module environmental durability field is in a growth phase, with the top five filers holding a dominant share of activity among the largest filers and STMicroelectronics leading by a clear margin. Filing volume expanded sharply on a multi-year basis before easing from a 2023 peak, with the United States as the primary jurisdiction of record.
STMicroelectronics leads a tightly concentrated field
STMicroelectronics INT NV holds the top position in this space, followed by Infineon Technologies AG and Wolfspeed Inc. The field is narrow by absolute size, and the ranking shows a steep drop-off after the top three applicants.
The top five filers account for seventy percent of the combined total among the ranked applicants visible in this query, indicating a highly concentrated visible assignee structure with limited mid-tier presence. The gap between the leader and the rest of the field is substantial.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | STMicroelectronics INT NV | 8 | |
| 2 | Infineon Technologies AG | 5 | |
| 3 | Wolfspeed Inc | 4 | |
| 4 | International Business Machines Corporation | 2 | |
| 5 | PACIFIC AEROSPACE & ELECTRONICS INC | 2 | |
| 6 | The Government of the United States of America | 1 | |
| 7 | Zhuzhou CRRC Times Semiconductor Co Ltd | 1 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 8 | Intel Corporation | 1 | |
| 9 | Analog Power Conversion LLC | 1 | |
| 10 | K R Mangalam University | 1 | |
| 11 | Semicon Components Industries LLC | 1 | |
| 12 | NANO & ADVANCED MATERIALS INST | 1 | |
| 13 | NXP USA Inc | 1 | |
| 14 | Chongqing University | 1 |
STMicroelectronics’ lead, anchored in packaging and device-level durability work across H01L subclasses, suggests the company has staked out a broad foundational position. Challengers Infineon and Wolfspeed are narrowing in through device fabrication and assembly routes, but have not yet closed the gap.
The most recent filing years are further understated by publication lag and should be read as lower bounds rather than final counts. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A 2022–2023 surge dominates the trend; H01L is the structural anchor
The annual filing trend reveals a sharp multi-year acceleration followed by an easing from the 2023 peak, while the technology composition shows heavy concentration in semiconductor device classes with several adjacent branches remaining sparsely covered.
Annual filing trend
Activity was negligible through 2021, accelerated markedly in 2022 and peaked in 2023, then eased in 2024 and 2025. The 2024 and 2025 bars are understated due to publication lag and should not be read as a real decline — the multi-year growth window remains strongly positive.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (Semiconductor devices) is visible in the branch mix by a wide margin, reflecting the core packaging and device-integrity focus of the field. H10D, H05K (Printed circuits and assemblies), H10P, and H10W each hold much smaller shares, and measurement and amplifier branches are represented by single records each, pointing to under-served adjacent areas.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Silicon Carbide Device and Method for Forming a Si…
A silicon carbide device includes a silicon carbide substrate, a contact layer located on the silicon carbide substrate and including nickel and silicon, a barrier layer structure including titanium and tungsten, and a metallization layer comprising copper, wherein the contact layer is located between the silicon carbide substrate and at least a part of the… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Filled solder | 86 |
| 2 | Electronics packages having a composite structure … | 46 |
| 3 | Silicon Carbide Device and Method for Forming a Si… | 21 |
| 4 | Composite electronics packages and methods of manu… | 15 |
| 5 | Defects annealing and impurities activation in sem… | 11 |
| 6 | Silicon carbide power module | 9 |
| 7 | Cap attach surface modification for improved adhes… | 8 |
| 8 | Silicon carbide power module | 4 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
STMicroelectronics INT NV
STMicroelectronics holds the leading position with eight patent records, concentrating its filings across H01L 23 (semiconductor device packaging and interconnect), H01L 29 (discrete semiconductor devices), and H10D 62. Its momentum trend is marked as a new entrant in the recent window, consistent with the field’s sharp post-2021 emergence. The breadth of IPC coverage suggests a platform rather than point-solution approach to module durability.
patent records: 8Infineon Technologies AG
Infineon Technologies AG holds five patent records and shows new entrant momentum in the recent window. Its technology focus spans H01L 21 (fabrication processes), H01L 23 (packaging), and H01L 29 (device structures) — all three at equal weight — indicating a balanced attack across process, packaging, and device reliability rather than a single-route specialization. This positions Infineon as the broadest technical challenger to STMicroelectronics in this space.
patent records: 5Frequently asked questions
The corpus contains 24 patent families in scope for this topic, making it a compact but actively growing field.
STMicroelectronics INT NV leads with eight patent records, followed by Infineon Technologies AG with five and Wolfspeed Inc with four.
The field is classified as Growth. Recent three-year filing volume sits well above the prior three-year window, reflecting a 750% growth rate. Annual volume eased from a 2023 peak, but the most recent years are further understated by publication lag.
The United States leads with sixteen patent records, followed by Europe (EPO) with eight. WIPO (PCT) carries two records and China only one, suggesting limited Asian prosecution coverage to date.
No co-applicant or joint-filing relationships are present in the evidence. All identified applicants are filing independently.
G01N (material analysis and testing) and G01R (electric and magnetic measurement) each carry only one patent record, making them the sparsest adjacent branches. H05K (printed circuits and assemblies) holds three records. All sit well below the visible H01L class.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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