SiC Monolithic Compact Integration Patent Snapshot 2026
II-VI Advanced Materials holds a commanding lead in SiC monolithic and compact integration patents, with the United States as the dominant filing jurisdiction. The field is still expanding on a multi-year basis, though annual volume has eased from its 2020 peak and remains subject to publication lag in the most recent years.
II-VI Advanced Materials leads a concentrated, early-stage field
II-VI Advanced Materials LLC sits atop the applicant ranking with 7 patent records, roughly three times the nearest challengers. Panasonic Holdings follows with 4 patent records, while ETH Zurich, General Electric, Ben Gurion University of the Negev, and Paul Scherrer Institut each hold 2 patent records.
The top five filers account for 57% of the combined total among the ranked applicants visible in this query, indicating a notably concentrated visible assignee structure for a field of this size. The gap between the leader and the second tier is significant, though the presence of research institutes and universities among the top ranked applicants signals that foundational IP is still being established.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | II-VI Advanced Materials LLC | 7 | |
| 2 | Panasonic Holdings Corp | 4 | |
| 3 | ETH Zurich (ETH Transfer) | 2 | |
| 4 | General Electric Co | 2 | |
| 5 | Ben Gurion University of the Negev | 2 | |
| 6 | Paul Scherrer Institut | 2 | |
| 7 | Zhuzhou CRRC Times Semiconductor Co., Ltd. | 1 | |
| 8 | Taiyuan Yongming Hengyongyuan Electronics Co., Ltd. | 1 | |
| 9 | Xi’an Yingran Semiconductor Technology Co., Ltd. | 1 |
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 10 | Amir Ben-Tal (individual inventor) | 1 | |
| 11 | Amit Ben-Kish (individual inventor) | 1 | |
| 12 | NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP … | 1 | |
| 13 | Baixun Information Technology Co., Ltd. | 1 | |
| 14 | Osaka City University (Public University Corporation) | 1 | |
| 15 | Matthew H. Kim (individual inventor) | 1 | |
| 16 | Air Water Inc. | 1 | |
| 17 | HRL Laboratories LLC | 1 |
II-VI Advanced Materials’ position, reinforced by momentum data showing it as a new entrant with a sharply rising trajectory, suggests that a single industrial player has moved quickly to are visible in what remains a largely open evidence snapshot. The diversity of academic co-filers indicates that much of the fundamental science remains in translation from research to commercial application.
Filing counts for the most recent 18 to 24 months are likely understated due to standard patent publication lag and should not be interpreted as a slowdown in activity. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Multi-year growth with a technology mix anchored in core semiconductor device classes
The annual filing trend and technology composition together reveal a field that is expanding on a multi-year basis while remaining heavily concentrated in foundational semiconductor device classifications, with power conversion and packaging branches attracting only sparse coverage.
Annual filing trend
Filings were negligible in 2017, picked up from 2018, and reached a local peak in 2020 with 4 patent records. Activity continued in subsequent years but annual volume has eased from that 2020 peak. The most recent years (2024–2026) show reduced counts that are partly attributable to publication lag and should not be read as a sustained decline.
↗ Hover for values · click a bar to ask EurekaTechnology composition
The visible branch is H01L (Semiconductor devices) with 28 patent records, followed by H10P with 8 and H10D (Semiconductor devices, general) with 7. Power conversion (H02M) and printed circuits and assemblies (H05K) account for only 2 and 1 patent records respectively, marking them as sparsely covered adjacent branches relative to the core device classes.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Methods of manufacturing semiconductor devices
A method forms a part of a power semiconductor device. The method includes homoepitaxially forming two silicon carbide layers on a first side of a silicon carbide substrate and forming a pattern of pits on a second side of the silicon carbide substrate. The two layers include a buffer layer, on the first side of the silicon carbide substrate, and have a… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Semiconductor device and its manufacturing method | 59 |
| 2 | Semiconductor device with a plurality of semicondu… | 30 |
| 3 | Novel material and process for integrated ion chip | 23 |
| 4 | Thermal management for heterogeneously integrated … | 18 |
| 5 | A concept for silicon carbide power devices | 8 |
| 6 | Novel material and process for integrated ion chip | 8 |
| 7 | Methods of manufacturing semiconductor devices | 7 |
| 8 | Semiconductor device and its manufacturing method | 7 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
II-VI Advanced Materials LLC
II-VI Advanced Materials LLC holds 7 patent records, the largest position in this corpus, and is flagged as a new entrant with a sharply rising trajectory — indicating that its dominance has been established rapidly rather than accumulated over a long period. Its technology emphasis spans H01L 21, H01L 27, and H01L 29, covering semiconductor device fabrication, integrated circuit structures, and discrete semiconductor devices — the full core of SiC monolithic integration.
patent records: 7Panasonic Holdings Corp
Panasonic Holdings Corp holds 4 patent records and focuses its coverage on H01L 23 (semiconductor device packaging and thermal management), H01L 25 (assemblies of semiconductor devices), and H10D 30 (general semiconductor device structures). This package-and-assembly emphasis is complementary to, rather than directly overlapping with, II-VI Advanced Materials’ fabrication-centric portfolio, suggesting Panasonic is addressing the integration and thermal management layer of the SiC compact integration stack.
patent records: 4Frequently asked questions
II-VI Advanced Materials LLC leads with 7 patent records, followed by Panasonic Holdings Corp with 4. ETH Zurich, General Electric, Ben Gurion University of the Negev, and Paul Scherrer Institut each hold 2 patent records.
The United States is the visible jurisdiction with 15 patent records. Europe (EPO) and WIPO (PCT) each account for 4 patent records, China for 3, and South Korea for 2.
The field is classified as Growth. Recent three-year filings are 80% above the prior three-year window on a multi-year basis, though annual volume has eased from its 2020 peak and the most recent years are further understated by publication lag.
H01L (Semiconductor devices) is the visible class with 28 patent records. H10P follows with 8, and H10D (Semiconductor devices, general) with 7. Power conversion (H02M) and printed circuits and assemblies (H05K) are sparsely covered with 2 and 1 patent records respectively.
ETH Zurich (ETH Transfer HG E43 49) and Paul Scherrer Institut are the most active co-filers with 4 joint patent records. A separate collaboration between Baixun Information Technology and Taiyuan Yongming Hengyongyuan Electronics accounts for 1 joint record.
H02M (Power conversion, AC/DC) with 2 patent records and H05K (Printed circuits and assemblies) with only 1 patent record are the sparsest adjacent branches in the current corpus. Their low coverage relative to the visible H01L class marks them as under-served areas worth monitoring, though entry feasibility should be confirmed through broader freedom-to-operate analysis.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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