SiC Power System Integration Patent Snapshot 2026
The SiC power system integration patent corpus is small and highly concentrated, with Texas Instruments Inc holding the largest share among a short list of filers spanning the United States and China. Annual filing activity has eased from its 2021 peak, placing the field in a decline stage by volume, though the limited corpus size means a handful of new entrants could materially shift the evidence snapshot.
Texas Instruments leads a highly concentrated, early-stage corpus
Texas Instruments Inc ranks first with 2 patent records, followed by Huazhong University of Science and Technology, Guizhou Power Grid Co Ltd, and several individual inventors each holding 1 patent record. The top five filers account for 75% of the combined total across the ranked applicants visible in this query, signaling an unusually tight competitive concentration for a field with broad commercial relevance.
The tier gap between the leader and the rest of the ranked applicants is narrow in absolute terms but steep in relative share, reflecting a corpus that remains embryonic rather than mature. No second-tier cluster has yet emerged to challenge the leader’s position.
| # | Applicant | Patent records | Share |
|---|---|---|---|
| 1 | Texas Instruments Inc | 2 | |
| 2 | HUAZHONG UNIV OF SCI & TECH | 1 | |
| 3 | Guizhou Power Grid Co Ltd | 1 | |
| 4 | BARLOW MATTHEW W | 1 | |
| 5 | CHIOLINO NICHOLAS J | 1 | |
| 6 | Electric Power Research Institute of Guangdong Power Grid Co | 1 | |
| 7 | FRANCIS A MATTHEW | 1 |
Texas Instruments Inc’s focus on semiconductor device packaging and assembly — spanning H01L 23 and H01L 25 sub-classes — suggests its position is built on physical integration know-how rather than circuit-topology innovation. This leaves adjacent power-conversion and printed-circuit-assembly sub-classes relatively open.
The most recent filing years are subject to standard patent publication lag and may undercount activity; conclusions about recent momentum should be treated as provisional. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
A single 2021 spike and a 2025 uptick bracket a largely dormant filing record
The annual trend and technology composition charts together reveal a corpus that has seen only sporadic activity, dominated by semiconductor device classifications with limited coverage of power conversion or substrate-level integration.
Annual filing trend
Filing activity registered zero entries from 2017 through 2020, produced one record in 2021, returned to zero through 2024, then recorded two filings in 2025. The 2025 figure is subject to publication lag and likely understates true recent activity. The lifecycle evidence places the field in a decline stage, with annual volume easing from the 2021 peak.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (semiconductor devices) is the visible classification, appearing across 4 patent records, followed by H10W with 3 records. H02M (power conversion) and H05K (printed circuits and assemblies) each appear in only 1 record, indicating that packaging and device-level integration receive far more attention than power-conversion topology or board-level assembly in this corpus.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Packaging structure and packaging method for kiloa…
The present invention discloses a packaging structure for a kiloampere-level single-switch SiC power semiconductor module, primarily including components such as SiC chips, substrates, baseplate, power and signal terminals, integrated gate/Kelvin source resistors, and housing. The packaging structure proposed in this invention improves the electrothermal… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Baseboard for orthogonal chip mount | 96 |
| 2 | Baseboard for orthogonal chip mount | 72 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Texas Instruments Inc
Texas Instruments Inc holds 2 patent records, the largest share in this corpus, with technology emphasis concentrated in H01L 23 (semiconductor device housings and interconnects) and H01L 25 (assemblies of multiple semiconductor devices), plus secondary coverage of H10W 70. Its focus on physical integration and packaging architecture positions it at the board and module level of SiC system design. Applicant momentum data for this entity is not available in evidence.
patent records: 2Guizhou Power Grid Co Ltd
Guizhou Power Grid Co Ltd holds 1 patent record, with technology emphasis in H02M 1 and H02M 7 (AC/DC power conversion), differentiating its approach from the packaging-focused leader. Its presence signals utility-sector interest in SiC-based power conversion for grid applications. Applicant momentum data for this entity is not available in evidence.
patent records: 1Frequently asked questions
The corpus in scope contains 3 patent families. It is a small and highly concentrated set of filings, with activity recorded primarily in 2021 and 2025.
Texas Instruments Inc is the leading filer with 2 patent records, focused on semiconductor device packaging and multi-device assembly sub-classes (H01L 23 and H01L 25).
The United States is the primary jurisdiction with 4 patent records, and China has 1. No other jurisdictions appear in the current evidence.
The evidence classifies the field as in a decline stage, with annual filing volume easing from its 2021 peak. The corpus remains very small, so this classification should be interpreted with caution.
One co-applicant relationship is recorded: the Electric Power Research Institute of Guangdong Power Grid Co filed jointly with Huazhong University of Science and Technology, reflecting an applied-research linkage between a Chinese utility operator and an academic institution.
H02M (power conversion, AC/DC etc.) and H05K (printed circuits and assemblies) each appear in only 1 patent record, making them the least covered sub-classes relative to the visible H01L semiconductor device classifications. Whether these represent genuine filing gaps or a classification artifact requires further investigation.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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