SiC Standardized Power Module Patent Snapshot 2026
The SiC standardized power module patent space is a small, university-led field in a Growth stage, with 28 patent families spread across academic institutions and a handful of commercial players. China dominates filing activity, and the top five filers account for 42% of the hundred largest filers’ combined total, signaling moderate concentration at the top of a still-forming competitive hierarchy.
Xi’an Jiaotong University leads a fragmented, academically driven field
Xi’an Jiaotong University holds the top position with 4 patent families, followed by Hiper Semiconductor with 3, and four organizations tied at 2 — including Zhejiang University, the University of Colorado, North. China Electric Power University, and Wolfspeed. The overall corpus of 28 patent families reflects a niche that has not yet attracted large-scale industrial filers.
The top five filers collectively represent 42% of the ranked applicants visible in this query’ combined total, a moderate concentration level for a field of this size. No single incumbent holds a commanding share, and the gap between the leader (4 families) and the mid-tier (2 families) is narrow, indicating that the competitive hierarchy remains unsettled.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Xi’an Jiaotong University | 4 | |
| 2 | Hiper Semiconductor Inc. | 3 | |
| 3 | United States Government as Represented by the Secretary of Defense | 2 | |
| 4 | Zhejiang University | 2 | |
| 5 | The Regents of the University of Colorado | 2 | |
| 6 | North China Electric Power University | 2 | |
| 7 | Wolfspeed Inc. | 2 | |
| 8 | Zhuhai Power Supply Bureau, Guangdong Power Grid Co. | 1 | |
| 9 | China Resources Microelectronics (Chongqing) Co., Ltd. | 1 | |
| 10 | Beijing Jingyi Chunshu Rectifier Co., Ltd. | 1 |
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 11 | Torqon Cruise Motors Pte. Ltd. | 1 | |
| 12 | Calnetix Technologies LLC | 1 | |
| 13 | General Electric Company | 1 | |
| 14 | Institute of Energy, Hefei Comprehensive National Science Center | 1 | |
| 15 | Fudan University | 1 | |
| 16 | State Grid Shanghai Municipal Electric Power Co. | 1 | |
| 17 | HUAZHONG UNIV OF SCI & TECH | 1 | |
| 18 | Aktsionernoe Obshchestvo Nauchno Issledovatelskij Institut | 1 | |
| 19 | Guizhou Power Grid Co., Ltd. | 1 | |
| 20 | Board of Regents, The University of Texas System | 1 |
The prominence of universities — Xi’an Jiaotong, Zhejiang, North. China Electric Power, University of Colorado, and University of Texas — suggests that fundamental packaging, topology, and integration concepts are still being defined in academic labs rather than locked down by industrial players. This creates realistic entry opportunities for commercial organizations willing to translate academic work into application-specific IP.
Filing data for the most recent 18–24 months is subject to publication lag and likely understates current activity; the 2025 and 2026 counts should be treated as provisional. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Filing activity is rising on a multi-year basis, anchored in semiconductor device and power-conversion classes
The annual trend and technology composition charts together show a field that has grown 50% in a recent window, with activity concentrated in two co-visible IPC classes and a set of adjacent branches that remain lightly covered.
Annual filing trend
Annual filings have grown 50% on a multi-year basis. The 2024 data point is the highest observed year in the series so far. Figures for 2025 and 2026 are provisional due to publication lag and should not be read as a slowdown.
↗ Hover for values · click a bar to ask EurekaTechnology composition
H01L (Semiconductor devices) and H02M (Power conversion) are co-visible branches, each appearing 17 times at the patent-record level, reflecting the dual focus on device packaging and converter topology. H10W appears 7 times as a secondary branch. Packaging and assembly (H05K), vehicle integration (B60R, B60L), and grid systems (H02J) are all sparsely represented, pointing to areas where coverage is thin relative to the primary classes.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
Silicon carbide power inverter/rectifier for elect…
The present disclosure involves a two stage inverter, a system for electrical power conversation, and a method of converting electrical power using silicon carbide (SiC) metal-oxide-semiconductor field-effect transistors (MOSFETs). One example implementation includes using two or more SiC MOSFETs in series with each MOSFET having a gate terminal for… (excerpt from the patent abstract)
| # | Patent | Citations |
|---|---|---|
| 1 | Power conversion system with galvanically isolated… | 95 |
| 2 | 一种碳化硅维也纳整流器半桥模块的封装结构 | 17 |
| 3 | 一种半桥模块和封装方法 | 15 |
| 4 | 一种基于SiC MOSFET的多芯片并联半桥模块 | 12 |
| 5 | Silicon carbide power module | 9 |
| 6 | 一种基于3D封装的片内并联半桥模块 | 9 |
| 7 | High Power Direct Current/Alternating Current Inve… | 7 |
| 8 | 基于SiC模块并联应用的三电平单相桥臂叠层母排结构布局 | 6 |
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
Assignee snapshot from the current evidence set
The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.
Xi’an Jiaotong University
Xi’an Jiaotong University holds 4 patent families, the largest position in the corpus. Its technology focus spans H02M 1 (power conversion, 3 records), H01L 23, and H01L 25 (semiconductor packaging, 2 records each), indicating a broad interest in both the converter-level and package-level aspects of standardized modules. Its momentum is classified as a new entrant, meaning its filings are concentrated in the recent window, and it has co-filed with both TBEA Xinjiang New Energy and State Grid Shanghai, connecting its academic work to industrial deployment contexts.
families: 4Hiper Semiconductor
Hiper Semiconductor holds 3 patent families and is also a new entrant by momentum classification. Its focus is tightly concentrated on device-level packaging — H01L 23 (3 records) and H01L 25 (2 records) — with a secondary entry in H10W 40. This packaging-first orientation differentiates it from the topology-oriented academic leaders and positions it as the leading commercially focused filer in a field otherwise dominated by research institutions.
families: 3Frequently asked questions
The corpus covers 28 patent families in scope. This is a niche field relative to the broader SiC power device space, reflecting that standardization of module form factors is a relatively recent focus of IP activity.
Xi’an Jiaotong University holds the largest position with 4 patent families. It is followed by Hiper Semiconductor with 3 families, and a group of organizations — including Zhejiang University, the University of Colorado, North China Electric Power University, and Wolfspeed — each holding 2 families.
The field is in a Growth stage. Annual filings have grown 50% on a multi-year basis, and the most recent data points are understated due to publication lag. The foundational IP positions are still being established.
China is the lead filing jurisdiction with 17 patent records, followed by the United States with 9. India, Russia, and WIPO (PCT) each contribute 1 record. European and Asia-Pacific jurisdictions outside China are currently not well represented in this specific corpus.
H01L (Semiconductor devices) and H02M (Power conversion) are co-visible, each appearing 17 times at the patent-record level. H10W is a secondary branch with 7 records. Packaging assembly (H05K), vehicle integration (B60R, B60L), grid systems (H02J), and variable control (G05F) are all sparsely represented.
Yes. Xi’an Jiaotong University has co-filed with two industrial partners: TBEA Xinjiang New Energy and State Grid Shanghai Municipal Electric Power, each collaboration yielding one jointly filed family. These are the only recorded co-filing relationships in the corpus, making Xi’an Jiaotong University the central node of ecosystem collaboration in this field.
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Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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