SiC Wafer Slicing Patents: Who Leads, Where the Gaps Are 2026
SiC Wafer Slicing and Surface Preparation Patents
One assignee holds 80 of 97 records in scope concentration that leaves the remaining five ranked companies filing in the single digits. Annual filings moved from 0 in 2017 to a peak of 31 in 2019, then continued at a lower but rising pace — 2021 to 2024 alone grew 50%, from 6 to 9 filings. 2026 shows only 3 filings so far, but that reflects the roughly 18-month gap between filing and publication rather than a real slowdown.
- 1沃孚半导体有限公司82.5%
- 2帕里杜斯有限公司9.3%
- 3阿斯卡顿公司3.1%
- 4弗吉尼亚大学专利基金会2.1%
- 5II VI先进材料有限责任公司2.1%
See the full sic wafer slicing and surface preparation analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on SiC wafer slicing patents
Who holds the most patents in SiC wafer slicing and surface preparation?
One assignee holds 80 of the 97 records in this landscape, making it by far the dominant filer in the field. The next four ranked assignees combined bring the top five to 96 records, or 99.0% of all records in scope, leaving only a single record outside that group among the six companies tracked. This concentration means most freedom-to-operate work in this space starts with reviewing that one company’s claim estate.
Is patent filing in SiC wafer slicing growing or slowing down?
Filing grew 50% between 2021 and 2024, the last span the dataset treats as complete, rising from 6 to 9 filings. The peak year on record so far is 2019 with 31 filings. Figures for 2025 and 2026 look lower, but that reflects the roughly 18-month lag between filing and publication rather than an actual decline, so those years should not yet be read as a slowdown.
What patent classes cover SiC wafer slicing methods?
The two most common IPC subclasses are H01L (semiconductor devices), appearing in 55.7% of the 97 records, and B23K (welding, soldering and brazing, which covers laser and bonding-based parting methods) at 51.5%. B28D, covering mechanical grinding and working stone, appears in 30.9% of records. Crystal growth (C30B) and ceramics/refractories (C04B) are much thinner, at 21.6% and 4.1% respectively, marking the parts of the process chain with lighter claim coverage.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on SiC Wafer Slicing and Surface Preparation covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.