Silane Coupling Agent Patents: Top Filers & Filing Trends 2026
- 15.5% concentration at the top. The five leading assignees hold 1,639 of 10,571 records in scope — a real lead, but not a lock on the field.
- Filing peaked in 2020 at 493 records and has cooled since, though 2025–2026 figures are still filling in as publications lag filing by roughly 18 months.
- Polymer and additive classes dominate, with C08L and C08K each covering roughly a third and a quarter of all records — adhesives and semiconductor uses are comparatively thin.
Filing growth compares 2021 (398 records) with 2024 (225) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 10,571 records in scope (CR5), not by the ranked leaders only.
What this landscape covers
Silane coupling agents sit at the interface between organic polymers and inorganic surfaces — glass fiber, mineral filler, metal, semiconductor substrates — and the patent activity around them tracks wherever that interface becomes a performance bottleneck. This landscape covers 10,571 published records filed or published between 2015 and mid-2026, searched against claims and descriptions referencing silane coupling agents, organosilane treatments and silane primers, cross-referenced against hydrolysis-condensation chemistry, glass fiber sizing, filler treatment and related interfacial-adhesion terms.
The dataset spans commodity applications like glass fiber sizing and filler treatment through to more specialised uses in semiconductor packaging and gas-barrier films, giving a view of both the mature core chemistry and the newer application claims layered on top of it.
Filing trends and technology composition
Two views of the same 10,571 records: how filing activity has moved year over year, and which technology classes carry the claim volume.
Filing trend: rise, peak, cooling
Filings climbed from 429 in 2017 to a peak of 493 in 2020, then declined to 225 by 2024 — a 43% drop across the 2021-to-2024 span. Treat 2025 and 2026 figures as incomplete rather than as evidence of a continued fall, since publication typically lags filing by around 18 months.
Where the claims concentrate
C08L (polymer compositions) and C08K (additives in polymers) lead at 32.4% and 26.8% of records respectively, with C08G (condensation polymers) and B32B (layered products) following. Adhesives (C09J, 11.2%) and semiconductor devices (H01L, 10.3%) carry meaningfully less claim density, which is where narrower, more defensible filings are still possible.
Shares are the percentage of the 10,571 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
Go deeper on Silane Coupling Agent Surface Treatment with Eureka
This page is one run against one query. Ask Eureka your own question about silane coupling agent surface treatment and every answer comes back with the patent numbers behind it.
Try EurekaA representative claim and the most-cited prior art
Glass fiber sizing composition, preparation method, glass fiber product and use thereof (US20240140862A1)
The application discloses a glass fiber sizing composition with 4.0%–6.0% solid content, combining a silane coupling agent with a film former, lubricant, surfactant, leveling agent, interfacial reinforcing agent, wetting agent, defoaming agent and pH regulator. The resulting glass fiber shows strand integrity, softness and high dispersibility under tension, with fast, complete permeation into epoxy resin and strong interfacial compatibility.Filed by Jushi Group, published 2024-05-02 — illustrates how current filings bundle the coupling agent into a multi-component sizing formulation rather than claiming the silane chemistry alone.
View full filing| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US20120003500A1 | Process for producing multilayered gas-barrier film | 542 |
| 2 | US20150005720A1 | Electrophoretic display | 484 |
| 3 | US20030148401A1 | High surface area substrates for microarrays and methods to make same | 376 |
| 4 | US5406124A | Insulating adhesive tape, and lead frame and semiconductor device employing the tape | 324 |
| 5 | US6335479B1 | Protective sheet for solar battery module, method of fabricating the same and solar battery module | 297 |
| 6 | US20070146887A1 | Antireflection film, polarizing plate, method for producing them, liquid cryatal display element, liquid crys… | 222 |
| 7 | US7195872B2 | High surface area substrates for microarrays and methods to make same | 201 |
| 8 | US5248715A | Self-adhering silicone rubber with low compression set | 194 |
| 9 | US20030055179A1 | Olefin block copolymers processes for producing the same and uses thereof | 189 |
| 10 | US20090243065A1 | Semiconductor Device and Method for Manufacturing Semiconductor Device | 185 |
Citation counts favor older records simply by virtue of longer exposure — read them as a signal of influence on the field, not of current relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
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Three patterns stand out once concentration, timing and technology composition are read together.
A lead, not a lock
The five leading assignees combine for 1,639 of 10,571 records — enough to shape the core chemistry but far short of a closed field. The remaining 84.5% is spread across a long tail, including the tenth-ranked assignee at just 147 records.
Cooling off a 2020 peak
Filings peaked at 493 in 2020 and fell to 225 by 2024, a documented 43% decline over that window. The drop reflects a maturing core chemistry rather than an emerging one, though 2025-2026 figures are still incomplete.
Polymer claims dominate, device claims are thin
C08L and C08K together touch well over half of all records, meaning coupling-agent claims are overwhelmingly framed around polymer composition and additive use. Semiconductor-device applications (H01L, 10.3%) and adhesives (C09J, 11.2%) are comparatively under-filed relative to the core chemistry.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to silane coupling agent surface treatment, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| Dow Global Technologies LLC | Rohm and Haas Company | 27 |
| Owens Corning Intellectual Capital, LLC | Paroc Group Oy | 16 |
| Mitsubishi Chemical Corporation | Mitsubishi Plastics, Inc. | 16 |
| Kaneka Corporation | Kaneka Corporation | 12 |
| Dow Global Technologies LLC | Rohm and Haas Electronic Materials LLC | 10 |
| Sumitomo Bakelite Co., Ltd. | Toyota Tsusho Corporation | 6 |
| Sumitomo Bakelite Co., Ltd. | Toyota Motor Corporation | 6 |
| Dow Global Technologies LLC | Dow Silicones Corporation | 6 |
Ten co-assignee pairs appear in the data; the strongest links joint filings between chemical majors and their materials or IP-holding affiliates, suggesting coordinated portfolio strategies rather than one-off collaborations.
Who is filing, and where activity is slowing
The ranked leaders span glass and specialty chemical majors, film and electronics materials suppliers, and glass fiber producers — a mix that reflects how many downstream industries depend on this interface chemistry.
A clear but not dominant leader
The top-ranked assignee holds 392 records against a fifth-place figure of 238 and a tenth-place figure of 147 — a real gap at the very top that narrows quickly further down the ranking.
Mixed recent-year activity
Some mid-tier assignees show flat year-over-year filing while others show sharp declines of -89% or -100% in the latest year, though single-digit annual counts make these swings easy to over-read.
Affiliate-linked filing patterns
The strongest co-assignee pair in the dataset shares 27 filings, consistent with a parent company and a materials or IP-holding affiliate filing jointly rather than two independent competitors collaborating.
| Assignee | Recent year | YoY |
|---|---|---|
| Kaneka Corporation | 3 | 0% |
| Shin-Etsu Chemical Co., Ltd. | 2 | 0% |
| Mitsubishi Chemical Corporation | 2 | — |
| Owens Corning Intellectual Capital, LLC | 1 | -89% |
| Sumitomo Bakelite Co., Ltd. | 0 | -100% |
| FUJIFILM Corporation | 0 | — |
| Toray Industries, Inc. | 0 | — |
| LG Chem, Ltd. | 0 | — |
Where to take this next
The landscape points to a mature core chemistry with pockets of open claim space in adjacent applications.
Map white space in device and adhesive claims
With H01L and C09J each under 12% of records against C08L's 32.4%, a focused search of semiconductor-packaging and adhesive-specific silane claims is likely to surface less crowded ground than the core polymer-composition chemistry.
Explore white space in EurekaTrack post-2024 filings as they publish
Because publication lags filing by roughly 18 months, the 2025-2026 dip in this dataset understates real activity; revisiting the trend in a year will give a truer read on whether the 2021-2024 decline has bottomed out.
Set up trend monitoring in EurekaWatch affiliate-linked co-filing patterns
The strongest co-assignee pairs in this dataset look like parent-affiliate filing rather than open collaboration; tracking these pairs over time can reveal how a leading assignee is restructuring its portfolio.
Trace assignee networks in EurekaCommon questions about this landscape
The ranking covers 100 companies drawn from 10,571 records, with the leading assignee holding 392 records and the fifth-ranked holding 238. The top five combined account for 15.5% of all records in scope, which is a meaningful lead but leaves the large majority of filings spread across a long tail of other companies. Names in this space span specialty chemical majors, glass and glass-fiber producers, and electronics materials suppliers, reflecting how many industries rely on this interface chemistry.
Filings rose from 429 in 2017 to a peak of 493 in 2020, then fell to 225 by 2024 — a documented 43% decline over that three-year span. Figures for 2025 and 2026 appear lower still, but that reflects publication lag rather than a real collapse in activity, since patent publication typically trails filing by about 18 months. The honest read is a chemistry that grew through the late 2010s and has since cooled from its 2020 peak, with the very latest data still incomplete.
Polymer composition claims (IPC class C08L) appear in 32.4% of the 10,571 records, and additive-use claims (C08K) appear in 26.8%, making these the two most heavily claimed areas. Condensation polymers (C08G) and layered products (B32B) follow at 19.0% and 16.4% respectively. Because a single record can carry multiple IPC classes, these shares add up to more than 100%, but the ranking is a reliable guide to where claim density is highest.
Adhesive-specific claims (C09J, 11.2% of records) and semiconductor-device applications (H01L, 10.3%) carry noticeably less filing density than the dominant polymer-composition and additive classes. Sub-areas such as monolayer coverage control, low-VOC hydrolysis-condensation chemistries, and silane primers formulated specifically for semiconductor packaging show up as comparatively under-claimed branches worth closer diligence. These are not guaranteed gaps, but they are areas where the core chemistry's dense prior art is less directly on point.
This filing, from Jushi Group and published in 2024, bundles a silane coupling agent with a specific combination of film former, lubricant, surfactant, leveling agent and other additives into a defined solid-content range, rather than claiming the silane chemistry alone. That framing means it primarily blocks close copies of the full multi-component formulation and its stated performance profile, not silane coupling agent use in glass fiber sizing generally. Developers working with different additive combinations, solid-content ranges, or performance targets have meaningful room to design around it.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.