https://www.patsnap.com/resources/blog/rd-blog/silicon-carbide-abrasive-production-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Patent Landscape Brief
Silicon Carbide Abrasive Production Patents: Concentration at the Top, a Flat Filing Curve
  • Six leading assignees, not one dominant filer. the top 5 combined account for 63.6% of all 22 records in scope, but no single company holds a runaway lead — the leader sits at 6 filings.
  • Filing activity peaked in 2021 and has not grown since. the trend runs from 1 filing in 2017 to a peak of 6 in 2021, with the 2022 midpoint also at 6 — a flat-to-declining curve, not an expanding one.
  • China dominates the receiving offices. 14 of the tracked filings route through China, versus 2 each for Europe and the United States, showing where enforcement and freedom-to-operate checks matter most.
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22
Published Records
64%
Top-5 Share of All Records
-83%
3-Yr Growth (lag-adjusted)
CN
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Field Overview

What this dataset covers

Silicon carbide abrasive production spans the Acheson resistance-furnace route and adjacent solid-state carbothermal reduction processes, together with the downstream steps of crushing, grading and purity control that turn furnace output into graded green and black SiC grit. The scope here pulls records tagged against resistance furnace, green and black SiC, crushing and grading, purity and free carbon and energy consumption claim language, filtered to IPC classes covering non-metallic compound production, ceramics and bonded abrasives.

22 published records sit in scope across the 2015-01-01 to 2026-07-31 window, ranked into patent families held by 14 companies. Publication typically lags filing by around 18 months, so the most recent filing year is understated relative to where activity has actually settled.

Filing activity and technology composition, 2015-2026
  1. 1SICREATE GMBH6
  2. 2NINGBO UNIV2
  3. 3Lianyungang Woxin High-tech Materials Co., Ltd.2
  4. 4Beijing Lvqing Technology Co., Ltd.2
  5. 5Shihezi Fengtuo Silicon Materials Technology Co., Ltd.2
  6. 6Wuhu Pinlei New Materials Technology Co., Ltd.1
  7. 7Gansu Runze Semiconductor New Materials Technology Co., Ltd.1
  8. 8ZHENJIANG SUBAIXIN CONSTR MACHINERY CO LTD1
  9. 9SICREATE GMBH1
  10. 10Gansu Jintu New Energy Materials Technology Co., Ltd.1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Silicon Carbide Abrasive Production covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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The Numbers

Filing trend and technology composition

Two views of the same 22-record set: how filings have moved year over year, and which IPC subclasses carry the claim density.

A peak in 2021, then a plateau

Filings rose from a single record in 2017 to a peak of 6 in 2021. The 2022 midpoint holds at 6, meaning the second half of the window has not exceeded the first — a flat or declining trajectory rather than a growth curve, though the final year or two is always undercounted due to publication lag.

A peak in 2021, then a plateau0235612017201820192020620216202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Claim density concentrates in non-metallic compound production

C01B (non-metallic elements and inorganic compounds) appears in 86.4% of the 22 records in scope, confirming that most claims sit on the core carbothermal reduction chemistry rather than downstream processing. C30B (crystal growth) and F27D (furnace details) each reach 22.7%, with C04B (ceramics and refractories) at 13.6% and smaller shares in furnace design, mixing, catalysis and wastewater treatment — since records can carry multiple classes, these shares add up to more than 100%.

Claim density concentrates in non-metallic compound productionC01B · Non-metallic elements & inorga…1986.4%C30B · Crystal growth522.7%F27D · Furnace details & accessories522.7%C04B · Ceramics, cement & refractories313.6%F27B · Furnaces & kilns29.1%B01F · Mixing & stirring14.5%B01J · Chemical/physical processes & …14.5%C02F · Water & wastewater treatment14.5%Other14.5%

Shares are the percentage of the 22 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Silicon Carbide Abrasive Production covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited records in scope

Representative Filing
EP4151596A12023-03-22

Process and apparatus for silicon carbide production by means of a solid-state carbothermal reduction process (EP4151596A1)

SICREATE GMBH

The process combines carbon powder and silica powder — at least about 25% carbon by weight — in a crucible, creates a substantially inert atmosphere around it, and heats the crucible through a first time interval to a working temperature of at least 1,500°C before further staged heating. The claims tie the reaction conditions (atmosphere, temperature ramp, carbon ratio) together as a specific apparatus-plus-process combination rather than claiming the SiC chemistry in the abstract.Filed by SICREATE GMBH, published 2023-03-22.

EP4151596A1 — patent drawing 1EP4151596A1 — patent drawing 2
View full filing
Highest-cited documents
#Publication no.Patent titleCitations
1CN101928148A一种基于硅烷偶联剂低温高致密碳化硅陶瓷制造方法11
2US5180698AMethod of preparing refractory chromium-containing material7
3EP4151596A1Process and apparatus for silicon carbide production by means of a solid-state carbothermal reduction process3
4CN215626825U采用单炉多层流化熔融炉的碳化硅生产系统1
5CN214470080U一种碳化硅电阻炉炉头及其构成的碳化硅生产用电阻炉1

Citation counts are drawn from within this searched corpus and favour older filings; treat them as a signal of influence on later filers, not of current commercial weight.

Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Publication numbers are shown where the record carries one (5 of 5 rows); clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Silicon Carbide Abrasive Production covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Signal Check

What the citation and geography data indicate

Three findings that shape where to look next, drawn directly from the citation table and receiving-office split.

Citation Leader
11 citations
CN101928148A

Ceramic densification via silane coupling draws the most follow-on citation

The top-cited record in scope addresses low-temperature high-density silicon carbide ceramic manufacture using a silane coupling agent — a densification route distinct from the furnace-scale Acheson process, and the one later filers reference most.

Signal of influence within this corpus, not of current filing volume.
Legacy Reference
7 citations
US5180698A

An older refractory chromium-material patent still anchors citation counts

Older US filings on refractory material preparation continue to accumulate citations simply by virtue of tenure in the corpus — a reminder to weight citation counts by age when judging technical importance.

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Geographic Split
14 of 22
China receiving office

China carries most of the filing volume; Europe and the US are thin

14 of the 22 records in scope route through the China receiving office, versus 2 each for Europe and the United States and single filings in Australia, Malaysia and Russia — freedom-to-operate work should start with Chinese family coverage.

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Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to silicon carbide abrasive production, with the prior art for and against each one.

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Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Silicon Carbide Abrasive Production covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Assignee Landscape

Who holds the filings

14 companies make up the entire ranked list this dataset returns — not a top-50 or top-100 cut. Concentration sits at the top: the top 5 combined account for 63.6% of all 22 records, and the top 10 reach 86.4%, leaving a short tail of single-and-double-filing entrants.

Leader
6 records
Top-ranked assignee

One filer leads, but not by an overwhelming margin

The top-ranked assignee holds 6 of the 22 records in scope. That is a real lead, but well short of the kind of concentration that forecloses design-around work — four other assignees still combine for most of the remaining top-5 share.

Ranked by patent family count.
Mid-Field
2 records
Fifth-place assignee

The drop-off after the leader is gradual, not a cliff

Fifth place holds 2 records, and tenth place holds 1 — a gradual taper rather than a sharp cutoff, consistent with a field where furnace and grading process variants are still being filed by smaller regional players.

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Momentum
0 in latest year
Across tracked assignees

No tracked assignee shows fresh-year momentum

Every assignee checked for recent-year activity, including the current leader, shows zero filings in the latest tracked year. Given the roughly 18-month publication lag, this likely understates true recent activity rather than signalling an abandoned field.

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Under-claimed sub-areas worth checking before filing
Branches with thin IPC coverage relative to the core C01B chemistry — worth a freedom-to-operate check before assuming open space.
Furnace exhaust wastewater treatmentMixing and stirring pre-reaction stagesCatalytic pathway variantsFurnace-and-kiln thermal design (F27B)Crystal growth control (C30B) tied to grit grading
Rank all filers by momentum →
Recent-year filing activity by assignee
AssigneeRecent yearYoY
SICREATE Co., Ltd.0
Lianyungang Woxin High-tech Materials Co., Ltd.0
Shihezi Fengtuo Silicon Materials Technology Co., Ltd.0
Ningbo University0
Beijing Lvqing Technology Co., Ltd.0
Zhenjiang Subaixin Construction Machinery Co., Ltd.0
Wuhu Pinlei New Materials Technology Co., Ltd.0
Gansu Jintu New Energy Materials Technology Co., Ltd.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Silicon Carbide Abrasive Production covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Next Steps

Where to take this analysis

The dataset points to specific follow-up work rather than a single conclusion.

Check freedom-to-operate against the China-heavy filing base

With 14 of 22 records routed through China, any commercial launch touching furnace design or crushing and grading claims should start family-level FTO checks there before other jurisdictions.

Explore assignee families in Eureka

Map claim scope around EP4151596A1's process-apparatus combination

The most recently granted high-visibility filing ties atmosphere, temperature ramp and carbon ratio together as a combination claim — narrower alternatives on any one variable may still be open.

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Revisit the trend once 2025-2026 filings finish publishing

The flat 2021-2022 plateau may understate current activity given normal publication lag; a follow-up pull in 12-18 months will clarify whether the field is genuinely stalled.

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Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Silicon Carbide Abrasive Production covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions on silicon carbide abrasive patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Silicon Carbide Abrasive Production covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.