Silicon Carbide Power Device DC-DC Converter Patent Landscape
Silicon Carbide Power Device DC-DC Converter Patent Landscape in 2026
The dedicated patent corpus for silicon carbide power device DC-DC converters is extremely sparse, with only 2 patent families on record, both filed in China. The field is effectively nascent and wide open, presenting a low-encumbrance environment for new entrants with differentiated technical approaches.
Two applicants share an entirely concentrated but minimal corpus
The corpus contains just 2 patent families, split evenly between Xiao Li (an individual inventor) and Global Power Technology Co., Ltd., each holding 1 patent family. No single incumbent has established a dominant defensive position.
The top five filers account for 100% of the hundred largest filers’ combined total — a concentration figure that here reflects the extreme smallness of the corpus rather than strategic entrenchment by major players.
| # | Applicant | Patent families | Share |
|---|---|---|---|
| 1 | Xiao Li | 1 | |
| 2 | Global Power Technology Co., Ltd. | 1 |
The absence of large corporate portfolios from established power semiconductor manufacturers implies that SiC-specific DC-DC converter IP has not yet attracted sustained filing programs from tier-one players. Any organization that commences a structured filing strategy now would quickly become the de facto leader.
Patent publication typically lags filing by 18–24 months, so activity initiated in 2024–2025 may not yet be visible in this corpus. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.
Isolated filings in 2022 and 2025 with no sustained trend
The annual filing chart and technology composition together paint a picture of an early-stage niche: activity is sporadic rather than compound, and the technology classes are tightly clustered around core power conversion.
Annual filing trend
Filings show a single record in 2022 and another in 2025, with no activity in the intervening years. No trend can be inferred from two data points; the most recent filing (2025) falls within the publication-lag window and its full context may not yet be visible.
↗ Hover for values · click a bar to ask EurekaTechnology composition
Both families are classified under H02M (Power conversion), with one also touching H02J (Power supply and grid systems). The concentration in a single primary IPC class confirms the narrow, application-specific framing of current filings; adjacent power electronics branches remain unaddressed in this corpus.
↗ Hover for values · click a bar to ask EurekaHighly cited patent families surfaced by the query
Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.
基于碳化硅功率器件的全桥软开关逆变电路及其控制方法
本发明公开了一种基于碳化硅功率器件的全桥软开关逆变电路及其控制方法，属于电力电子技术领域，包括软开关逆变器模块，该模块包括全桥逆变电路、谐振电感、谐振电容和主变压器，全桥逆变电路由四个碳化硅功率开关管Q1~Q4构成，Q1、Q2串联为超前臂，Q3、Q4串联为滞后臂，超前臂Q1、Q2两端分别并联电容C2、C3，超前臂中点、滞后臂中点和谐振电感、谐振电容串联后与主变压器的原边回路相连；控制模块生成驱动信号，在经驱动电路隔离优化后，驱动碳化硅功率开关管的稳定高频通断，实现高频开关动作。本发明通过优化软开关和驱动电路的设计及引入共模电感，解决碳化硅功率器件在焊机电源应用中存在的驱动串扰、可靠性低的问题。 (excerpt from the patent abstract)
Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.
What the structure means for R&D investment in SiC DC-DC converters
A corpus this small offers more signal through its gaps than its content. The four structural dimensions below frame the strategic context for any team evaluating entry.
Pre-competitive: life-cycle stage not yet determinable
With only 2 patent families and isolated filing years, the evidence base is insufficient to assign a formal life-cycle stage. The field behaves as a pre-competitive niche — foundational patents have not yet accumulated, and claim scope has not been tested or shaped by market pressure. Early movers can define the technical vocabulary.
Pre-competitiveFull concentration among two micro-scale holders
The top five filers hold 100% of the hundred largest filers’ combined total, but this reflects a two-applicant corpus rather than entrenched dominance. Neither holder — Xiao Li nor Global Power Technology Co., Ltd. — has demonstrated a multi-family program. Concentration is arithmetically total but strategically shallow, leaving no meaningful blocking thicket.
No blocking thicketOne co-filing pair identified: Xiao Li and Tyco Tianrun
Evidence shows a single collaboration between Xiao Li and Tyco Tianrun Semiconductor Technology (Beijing) Co., Ltd., producing 1 co-filed patent family. This pairing of an individual inventor with a specialist SiC semiconductor firm is the only ecosystem link visible in the corpus. Broader co-development networks have not yet formed in this specific niche.
Nascent ecosystemChina is the sole jurisdiction; no international filings detected
All 2 patent families are filed exclusively in China. No PCT, US, EP, or other national-phase filings appear in the corpus. For any organization with global product ambitions, the international IP landscape for this specific application is currently uncontested — filing in major SiC markets (US, EU, Japan, South Korea) would encounter no prior art from this corpus.
China-only filingGo beyond the landscape: Eureka’s TRIZ Solution agent breaks down an R&D problem and returns patented concept solutions, each with a technical approach and cited patent & literature evidence.
| Applicant | Collaborator | Co-filings |
|---|---|---|
| Xiao Li | Tyco Tianrun Semiconductor Technology (Beijing) Co., Ltd. | 1 |
Co-filing pairs, ranked by the number of jointly-filed patent families.
Two new entrants share the corpus with identical family counts
Neither current holder has established a multi-year filing program. Both are classified as new entrants based on their recent-period activity, and their technology emphases overlap substantially.
Xiao Li
Xiao Li (individual inventor) holds 1 patent family, co-filed with Tyco Tianrun Semiconductor Technology (Beijing) Co., Ltd. The technology focus spans H02M3 (DC-DC power conversion), H02J50, and H02J7 (power supply and wireless/charging systems). Momentum is flagged as a new entrant with 1 recent filing and no prior-period baseline.
families: 1Global Power Technology Co., Ltd.
Global Power Technology Co., Ltd. holds 1 patent family with a technology focus concentrated entirely within H02M (power conversion subclasses H02M1, H02M3, H02M7), covering a broader slice of the converter topology space. No collaboration or prior-period filings are recorded; the company is a new entrant in this specific niche.
families: 1| Applicant | Recent (3 yrs) | Trend |
|---|---|---|
| Xiao Li | 1 | ▲ new entrant |
Under-served IPC branches adjacent to the current filing cluster
The current corpus is confined to H02M and H02J. Several technically adjacent IPC branches have no recorded filings in this corpus and represent areas where SiC-specific DC-DC converter IP does not yet exist.
H01L · Semiconductor devices (SiC device structure)
No filings in this corpus address the semiconductor device structure layer (H01L) of SiC power switches used in DC-DC topologies. Claims at the device-circuit co-design level — covering SiC MOSFET or SiC Schottky diode integration within converter modules — are absent. For teams developing proprietary SiC device architectures paired with converter circuits, this branch is currently unoccupied and technically adjacent to both H02M3 and SiC materials work.
Search this in Eureka →H05K · Printed circuits and electronic packaging
High-frequency SiC DC-DC converters impose stringent electromagnetic and thermal requirements that typically surface in packaging and PCB-level IP (H05K). No filings in this corpus address those integration challenges. Teams working on high-density SiC converter modules — particularly for EV onboard chargers or industrial power supplies — may find H05K an unoccupied but technically relevant branch for protecting layout and packaging innovations.
Search this in Eureka →How the two applicants differ by technology route
Strength of each leader across the main technology routes.
| Player | H02M 3 · Power conversion (AC/DC etc.) | H02J 50 · Power supply & grid systems | H02J 7 · Power supply & grid systems | H02M 1 · Power conversion (AC/DC etc.) | H02M 7 · Power conversion (AC/DC etc.) |
|---|---|---|---|---|---|
| Xiao Li | Strong · 1 | Strong · 1 | Strong · 1 | Absent | Absent |
Frequently asked questions
The corpus contains 2 patent families. This is an extremely small corpus, indicating the specific intersection of SiC power devices and DC-DC converter circuits has not yet attracted large-scale IP filing activity.
The two applicants on record are Xiao Li (an individual inventor, co-filing with Tyco Tianrun Semiconductor Technology (Beijing) Co., Ltd.) and Global Power Technology Co., Ltd., each holding 1 patent family. No large corporate incumbent dominates this specific niche.
All 2 patent families are filed exclusively in China. No PCT applications, US patents, European patents, or other national-phase filings appear in the corpus, leaving the international IP landscape essentially uncontested.
The filings are classified under H02M (Power conversion, AC/DC etc.) and H02J (Power supply and grid systems). H02M is the primary class for both families; H02J appears as a secondary classification for one family.
One collaboration is on record: Xiao Li and Tyco Tianrun Semiconductor Technology (Beijing) Co., Ltd. jointly filed 1 patent family. No other co-filing relationships are present in the corpus.
With only two recorded filing years (2022 and 2025) and no activity in between, no reliable trend can be established from this corpus. The field appears nascent rather than growing in a sustained compound manner. Any team beginning a structured filing program now would encounter a near-empty prior-art landscape.
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Disclaimer. This page is generated from PatSnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
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