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Silicon Photonics Wafer-Scale Manufacturing Patent Snapshot

Silicon Photonics Wafer-Scale Manufacturing Patent Snapshot
Evidence Snapshot
Silicon Photonics Wafer-Scale Manufacturing Patent Snapshot in 2026

A small group of fabless designers and foundries dominates a compact, maturing corpus of 35 patent families, with Marvell Asia, Samtec, and Advanced Micro Foundry holding the top three positions. The United States is the primary filing jurisdiction, and annual volume has plateaued near its 2020 peak, signalling a field consolidating around established optical-element and modulation approaches.

35
Patent families in scope
56%
Top visible applicants share
+8%
3-yr filing growth (lag-adj.)
United States
Leading jurisdiction
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Published byPatsnap Insights Team··6 min readVerified by Patsnap Eureka data
Overview

Marvell Asia leads a highly concentrated field

Marvell Asia leads the ranking with 7 patent families, followed by Samtec and Advanced Micro Foundry each at 5, and Intel and TSMC each at 3. The top five filers collectively account for 56% of the combined total of the ranked applicants visible in this query, confirming a highly concentrated visible assignee structure.

A clear tier gap separates the top three from the remainder of the ranking: every applicant outside the top five holds 2 or fewer patent families. This steep drop-off means the competitive moat is narrow but concentrated at the leader level.

Leading applicants
#ApplicantPatent familiesShare
1Marvell Asia Pte Ltd7
2Samtec Inc5
3Advanced Micro Foundry Pte Ltd5
4Intel Corporation3
5Taiwan Semiconductor Manufacturing Company Ltd3
6Mixx Technologies Inc2
7Ayar Labs Inc2
8Scantinel Photonics GmbH2
9Pandey Purnendu Shekhar2
#ApplicantPatent familiesShare
10RTX BBN Technologies Inc2
11GL BAJAJ INST OF TECH & MANAGEMENT2
12Avago Technologies International Sales Pte Ltd1
13Raytheon BBN Technologies Corp1
14Wells Fargo Bank NA1
15AGENCY FOR SCI TECH & RES1
16Ericsson1
17Nokia of America Corp1
↗ Hover a row · click a company to ask Eureka

Marvell Asia’s 7-family position, combined with recent momentum flagged as a new entrant, suggests rapid accumulation in a short window. Advanced Micro Foundry and TSMC together signal that wafer-scale manufacturing IP is increasingly held at the foundry layer, not only among system integrators.

Patent publication lag means filings from the most recent 18–24 months are under-counted in this corpus; the apparent quietness of 2024 and 2026 should not be read as a slowdown. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

Activity plateaued around 2020; optical elements dominate the technology mix

The annual filing trend reveals a field that peaked around 2020 and has since oscillated rather than sustained linear growth. The technology composition is heavily skewed toward optical elements and systems, with modulation and laser classes forming a secondary tier.

Annual filing trend

Filings rose sharply to a peak of 7 families in 2020, then settled into a band of 4–6 per year through 2022–2023. The 2024 and 2026 figures are depressed by publication lag and should not be treated as trend inflection points. On a multi-year basis the field remains active, though it has not exceeded its 2020 high.

Annual filing trendAnnual values from 2017 to 2026, peaking at 7 in 2020.02017520181201972020420216202262023120245202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

G02B (Optical elements and systems) is visible in the technology mix by a wide margin. G02F (Optical control and modulation) and H01S (Lasers and stimulated emission) form a secondary cluster, while H04B (Transmission), G01S (Radar and positioning), G01B (Measurement), and H01L (Semiconductor devices) each represent a small share—indicating that wafer-level semiconductor process claims remain sparse relative to photonic component claims.

Technology compositionG02B · Optical elements & systems leads with 39; G02F · Optical control & modulation 8.G02B · Optical elements …39G02F · Optical control &…8H01S · Lasers & stimulat…6H04B · Transmission (gen…6G01B · Measuring length …2G01S · Radar, sonar & po…2H01L · Semiconductor dev…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
US20180164520A1Published 2018-06-14

Optical module including silicon photonics chip an…

SAMTEC, INC.

An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light… (excerpt from the patent abstract)

Optical module including silicon photonics chip an… — patent drawingOptical module including silicon photonics chip an… — patent drawing
Representative drawings from the patent document.
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Highly cited patent families surfaced by this query
#PatentCitations
1Optical module including silicon photonics chip an…64
2Method for fabricating silicon photonics package, …30
3Optical module including silicon photonics chip an…21
4Method and Apparatus for Coupling to an Optical Wa…20
5Optical module including silicon photonics chip an…14
6Silicon-photonic tunable laser9
7Optical module including silicon photonics chip an…9
8Optical module including silicon photonics chip an…7

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Marvell Asia

Marvell Asia

Marvell Asia holds 7 patent families, the largest position in the corpus, concentrated in G02B (Optical elements and systems) and G02F (Optical control and modulation). Momentum is classified as a new entrant, indicating these families were accumulated rapidly rather than over a long baseline. This trajectory points to a deliberate IP-build strategy aligned with co-packaged optics and high-speed interconnect products.

families: 7
Challenger · Advanced Micro Foundry

Advanced Micro Foundry

Advanced Micro Foundry holds 5 patent families and is equally strong across G02B (Optical elements and systems) and G02F (Optical control and modulation) — the broadest dual-class coverage among all ranked applicants. Momentum is also classified as a new entrant, suggesting recent and rapid filing activity. As a dedicated silicon photonics foundry, its IP emphasises process-compatible modulation structures alongside waveguide elements.

families: 5
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Samtec IncTaiwan Semiconductor Manufacturing Co+ more
Unlock full assignee analysis →
Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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