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Smart High-Barrier Film Patent Snapshot 2026

Smart High-Barrier Film Patent Snapshot 2026
Evidence Snapshot
Smart High-Barrier Film Patent Snapshot in 2026

The Smart High-Barrier Film patent corpus is extremely narrow, with a single patent family on record, filed in 2019 and held by Lintec Corporation. Activity has been absent since that peak year, placing the field in a decline stage with substantial room for new entrants to establish IP positions.

1
Patent families in scope
N/A
Concentration not assessed
N/A
Growth trend not assessed
China
Leading jurisdiction
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Published byPatsnap Insights Team··4 min readVerified by Patsnap Eureka data
Overview

Lintec Corporation holds the sole position in a nascent, highly concentrated field

The Smart High-Barrier Film evidence snapshot contains 1 patent family in scope, assigned entirely to Lintec Corporation, which ranks first and alone among identified filers.

Concentration is absolute: the top five filers account for 100% of the combined total of the ranked applicants visible in this query, a figure that reflects the extreme sparsity of this defined topic rather than a contested oligopoly.

Leading applicants
#ApplicantPatent familiesShare
1Lintec Corporation1
↗ Hover a row · click a company to ask Eureka

Lintec’s sole position signals that the company identified a specific intersection of barrier laminate and flexible OLED substrate technology early, but has not followed up with additional filings, leaving the surrounding space effectively open.

The corpus reflects filings retrieved through the search date; the most recent 18–24 months are subject to publication lag and should be treated as provisional. Longer-window growth, applicant concentration, and technology-route coverage are therefore more reliable signals than the latest-year bar alone.

Source: Patsnap Eureka. Chart shows the top applicants ranked by patent families. Applicant counts can overlap where a patent family lists several applicants, so they need not sum to the total in scope. This same dataset is now available on Patsnap Open Platform via MCP.Connect via MCP →
Trends & Structure

A single 2019 filing defines the entire activity profile; no subsequent filings are recorded

The annual trend chart and technology composition together characterize this field as a single-event corpus anchored in layered product and adhesive chemistry with an OLED device application.

Annual filing trend

One family was filed in 2019; all other years from 2017 through 2026 show zero activity. The lifecycle stage is Decline, with annual volume having eased entirely from its 2019 peak. Years 2025–2026 are additionally subject to publication lag and cannot be interpreted as confirmed zero activity.

Annual filing trendAnnual values from 2017 to 2026, peaking at 1 in 2019.02017020181201902020020210202202023020240202502026↗ Hover for values · click a bar to ask Eureka

Technology composition

The single family spans three IPC branches: B32B (layered products and laminates), C09J (adhesives), and H10K (organic semiconductors including OLED devices). This tri-branch fingerprint indicates the patent covers a laminated barrier construction with adhesive layers designed for a flexible organic electronic application.

Technology compositionB32B · Layered products & laminates leads with 1; C09J · Adhesives 1.B32B · Layered products …1C09J · Adhesives1H10K · Organic semicondu…1↗ Hover for values · click a bar to ask Eureka
Source: Patsnap Eureka. Technology-branch counts are measured in patent records; a single patent family can carry several IPC classes, so class totals can exceed the family total in scope.Explore deeper in Eureka →
Key Patents

Highly cited patent families surfaced by the query

Citation-heavy patent families returned by the query. Use this section as citation context, not as a curated list of the most topic-specific patents.

Featured patent
CN111621234APublished 2020-09-04

粘着片、反复弯曲层叠构件及反复弯曲器件

琳得科株式会社

本发明提供一种反复弯曲性优异的粘着片、反复弯曲层叠构件及反复弯曲器件。所述粘着片(1)具有粘着剂层(11),该粘着剂层(11)用于贴合构成被反复弯曲的器件的一个可弯曲构件(21)与另一个可弯曲构件(22),粘着剂层(11)的厚度为2μm以上且小于100μm,构成粘着剂层(11)的粘着剂在‑20℃下的储能模量G’(‑20)为0.01MPa以上50MPa以下,以使粘着剂层(11)的两面分别与两片阻气膜的阻气层接触的方式层叠两片阻气膜与粘着剂层(11),作为以5mm/min的速度沿垂直方向从被固定的一个阻气膜上提拉另一个阻气膜时的最大应力的、面粘合力为35N/cm<sup>2</sup>以上。 (excerpt from the patent abstract)

粘着片、反复弯曲层叠构件及反复弯曲器件 — patent drawing粘着片、反复弯曲层叠构件及反复弯曲器件 — patent drawing
Representative drawings from the patent document.
Open this patent in Eureka →
Highly cited patent families surfaced by this query
#PatentCitations
1粘着片、反复弯曲层叠构件及反复弯曲器件4

Ranked by total forward citations. Citation counts favour older and broadly cited patent families, and broad or adjacent patents may appear when they match the search scope. Treat this section as citation context, not as a curated list of the most topic-specific patents. Some patent titles may be shown in their original, non-English language where an accurate translation could not be guaranteed.

Source: Patsnap Eureka. Citation-ranked patent families surfaced by this query.Open in Eureka →
Visible assignees

Assignee snapshot from the current evidence set

The applicants below are visible in this query result. Because the evidence set is relatively small, read this section as a directional snapshot rather than a full competitive ranking.

Leader · Lintec Corporation

Lintec Corporation

Lintec holds 1 patent family covering a laminated barrier adhesive sheet for repeatedly-bent flexible devices, spanning B32B layered products, C09J adhesives, and H10K organic semiconductors. Applicant momentum data is not available for this corpus given the single-event filing history. The company’s focus on flexible OLED substrate protection aligns with broader industry trends in foldable display materials.

families: 1
Challenger · Evidence pending

No challenger identified

No second-ranked applicant exists in this corpus. The challenger position is vacant, reflecting the extreme sparsity of the Smart High-Barrier Film patent landscape as currently defined. Any organization filing in this space would immediately occupy the second position.

families: 0
🔍
More assignee evidence is available in Eureka
Use Eureka to validate whether these visible assignees remain central after refining the query scope and adding related patent classes.
Lintec CorporationEvidence pending+ more
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Source: Patsnap Eureka. Assignee evidence is drawn from the current PatSnap Eureka query. In small evidence sets, applicant counts should be treated as directional signals, not a complete competitive ranking.Explore players →
Frequently asked questions

Frequently asked questions

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Built on Patsnap Open Platform

This report’s underlying patent dataset — filings, assignees, technology clusters — is open for developers via MCP and REST API. Free to start, 10,000 credits, no credit card required.

Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

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