Solder Paste and Void Control Patents: Leaders & Trends 2026
Solder Paste and Void Control in Reflow: Patents, Filers and Filing Trends
Filing has cooled sharply from its peak. Filings ran 22 in 2021 down to 2 in 2024, a 91% drop over that three-year span, after which 2025-2026 remain too recent to read as trend. Filings rose to a peak of 22 in 2021, then fell to 2 by 2024 — a 91% decline over that three-year span. Earlier years, including 2017 at 5, show the ramp that preceded the peak. The final years in the window are undercounted because of publication lag, not necessarily reduced activity.
- 1SUMITOMO BAKELITE CO LTD17
- 2IO TECH GRP LTD16
- 3SENJU METAL IND CO LTD14
- 4TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD12
- 5ILLINOIS TOOL WORKS INC11
See the full solder paste and void control in reflow analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on this landscape
Who holds the most patents on solder paste printing and reflow void control?
The ranked list covers 76 companies, with the leading assignee holding 17 of the 213 records in scope, a fifth-place holder at 11, and tenth place at 10. That taper means no single company controls the field outright, though the top 10 combined account for 58.2% of all records. A freedom-to-operate review should look beyond the top few names given how gradually the ranking declines.
Is patent filing in solder paste and reflow technology growing or shrinking?
Filings peaked at 22 in 2021 and fell to 2 by 2024, a 91% drop over that span, which is a genuine signal since 2024 is old enough to be largely complete in the data. Figures for 2025 and 2026 are still filling in because publication typically lags filing by about 18 months, so it is premature to call the trend still falling. The honest read is that the field cooled sharply after 2021 and the more recent trajectory is not yet visible.
What patent classes cover solder paste and reflow void patents?
The dominant classes are H05K (printed circuits and assemblies) at 53.1% of the 213 records and H01L (semiconductor devices) at 31.9%, with B23K (welding, soldering and brazing) close behind at 31.5%. Printing-specific classes such as B41F (printing machines, 13.1%) and B41M (printing processes, 6.1%) are thinner, and alloy-focused C22C claims sit at 8.5%. Because records can carry multiple classes, these shares add up to more than 100% and should not be read as mutually exclusive categories.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Solder Paste and Void Control in Reflow covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.