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Solid-State Transformer Patents: Who Leads, Where the Gaps Are 2026

Solid-State Transformer Patents: Who Leads, Where the Gaps Are 2026
https://www.patsnap.com/resources/blog/rd-blog/solid-state-transformer-modularity-and-standardization-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Power Electronics · Patent Landscape
Solid-State Transformer Modularity and Standardization Patents
  • 21 families total, a small, still-forming field where a single 2025 filing year (7 records) accounts for a third of everything published.
  • China files 12 of 21 records, against 5 from the United States and 3 from India — the receiving-office split shows where enforcement actually matters.
  • No assignee holds more than a handful of families, and recent-year momentum is flat or negative even for the most active filers, leaving standardization claims genuinely open.
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21
Published Records
57%
Top-5 Share of All Records
CN
Leading Jurisdiction
21
Active Filers Ranked
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What this landscape covers

This dataset tracks patent families combining solid-state transformer, power electronic transformer and modular multilevel converter architectures with claims directed at standardized or scalable power-cell design. The search spans 2015 through the 2026-07-31 cut-off, isolating documents that sit at the intersection of power conversion hardware (H02M) and grid-facing control (H02J), rather than solid-state transformers generally.

The filtered set is small — 21 families — which is itself informative: this is a niche still being staked out rather than a mature, crowded art. Publication lags filing by roughly 18 months, so the 2025 peak and the thin 2026 count understate real recent activity.

Filing activity, 2017–2026
  1. 1NANJING NORMAL UNIVERSITY5
  2. 2SHANGHAI JIAOTONG UNIV2
  3. 3DELTA ELECTRONICS INC(CN)2
  4. 4NAT INST OF TECH PATNA2
  5. 5SICHUAN AEROSPACE FENGHUO SERVO CONTROL TECH CO LTD1
  6. 6青岛鼎信通讯电力工程有限公司1
  7. 7QINGDAO TOPSCOMM COMM1
  8. 8西安西电电力电子有限公司1
  9. 9XI AN JIAOTONG UNIV1
  10. 10青岛智电新能科技有限公司1
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Solid-State Transformer Modularity and Standardization covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trends and technology composition

Twenty-one families, six IPC subclasses and a filing curve that peaks late rather than climbing steadily — the shape of the data argues for a technology area that is still defining its standard, not consolidating around one.

A late, uneven peak

Filings sit at zero in 2017, reach a midpoint of 3 in 2022, and jump to 7 in 2025 before the partial 2026 count. That is not a smooth growth curve; it reads as a cluster of activity concentrated in the most recent complete year, with the earlier years serving as isolated proof-of-concept filings.

A late, uneven peak024680201720182019202020212022202320247202512026Most recent year is partial — publication lag means later filings are not yet visible.

Power conversion dominates, control is secondary

All 21 records sit in H02M (power conversion), with 10 also touching H02J (power supply and grid systems) — confirming that modularity claims are being written primarily as circuit-topology hardware, with grid-integration claims layered on top. Control-systems classes (G05B, G05F, H02P) appear only once or twice each, suggesting the control-and-standardization layer is comparatively under-claimed relative to the hardware itself.

Power conversion dominates, control is secondaryH02M · Power conversion (AC/DC etc.)21100.0%H02J · Power supply & grid systems1047.6%G05B · Control & regulating systems29.5%G05F · Electric/magnetic variable con…29.5%H01F · Magnets, inductors & transform…14.8%H02P · Control of motors & generators14.8%

Shares are the percentage of the 21 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Solid-State Transformer Modularity and Standardization covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

The most-cited records

Representative filing
US9960666B22018-05-01

Four-port power electronic transformer based on hybrid modular multilevel converter

SOUTHEAST UNIVERSITY

A four-port power electronic transformer built on a hybrid modular multilevel converter (MMC), paired with DC/DC converters and an inverter. Each DC/DC converter carries a front stage, a high-frequency transformation stage and a back stage. The claimed split of duties — the MMC module and the DC/DC front stage jointly handling DC fault ride-through, with the MMC module regulating DC voltage — is presented as reducing device count relative to prior power electronic transformer designs.US9960666B2 · Southeast University · filed 2018-05-01

US9960666B2 — patent drawing 1US9960666B2 — patent drawing 2
View full record
Highest-cited families in this corpus
#Publication no.Patent titleCitations
1US20220166343A1Solid-state transformer having uninterrupted operation ability under ac/DC fault and control method thereof29
2CN108923618A电力电子变压器10
3US20250279730A1Solid-state transformer8
4CN111600501A一种应用于电力电子变压器的PWM载波同步方法5
5CN118971634A一种矿用直驱一体机的隔离非隔离混合拓扑4
6US11431263B2Solid-state transformer having uninterrupted operation ability under AC/DC fault and control method thereof3
7CN119482763A基于MMC轻量化子模块的固态变压器拓扑及其混频调制方法1
8US9960666B2Four-port power electronic transformer based on hybrid modular multilevel converter1

Citation counts favour older records by construction — treat them as a measure of influence within this searched set, not as a ranking of current technical importance.

Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Publication numbers are shown where the record carries one (8 of 8 rows); clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Solid-State Transformer Modularity and Standardization covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three patterns matter more than any single ranking: where the filings are concentrated by geography, how thin the control-layer claims are, and how little repeat filing there is even among the more active assignees.

Geography
12 of 21 in China
receiving office share

China is the primary battleground

China accounts for more than half of all receiving-office filings, with the United States a distant second at 5 and India at 3. Freedom-to-operate work that ignores Chinese filings in this space is checking the wrong jurisdiction first.

Receiving office data
Composition
H02J appears in 10 of 21
grid-integration overlap

Grid-side claims are the differentiator, not the core

Every record touches power conversion (H02M), but only half also claim grid supply integration (H02J), and control classes barely register. Claims that tie modular cell design to specific grid-fault or protection behaviour are rarer than the base topology claims.

IPC subclass distribution
Momentum
7 filings in 2025, then near-zero YoY for named filers
recent-year activity

Peak year does not mean an active leader

The single busiest year, 2025, does not correspond to sustained activity from any one assignee — most named filers show 0 in the latest tracked year, several down 100% year-on-year. The peak looks like several parties filing once, not one party scaling up.

Recent-year momentum by assignee
Concentration
Only 2 co-assignee pairs across 21 families
collaboration signal

Collaboration is rare, not the norm

With just two co-filing pairs identified across the whole set, most families are filed by a single entity working alone. That limits how much can be inferred about consortium-style standardization efforts from the filing record itself.

Co-assignee pairs
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to solid-state transformer modularity and standardization, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Solid-State Transformer Modularity and Standardization covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and how thin the lead is

No assignee in this dataset holds a commanding position. The most visible names — universities and a handful of power-equipment manufacturers — show single-digit family counts and flat or negative momentum in the most recent tracked year, which is unusual for a field this narrowly defined.

Academic filer
1 filing in latest year
Nanjing Normal University

Universities are active but not scaling

Nanjing Normal University shows continued filing into the most recent year, while other academic filers such as Shanghai Jiao Tong University show no latest-year activity. Chinese universities collectively account for a meaningful share of the filer base, consistent with the China-heavy receiving-office split.

Recent-year momentum
Industry filer
-100% YoY
Delta Electronics

Established manufacturers have gone quiet recently

Delta Electronics appears in the assignee set but drops to zero filings in the latest tracked year, a 100% year-on-year decline. That does not necessarily mean disengagement — publication lag means 2025–2026 filings may not yet be visible — but it does mean no manufacturer is currently pulling ahead.

Recent-year momentum
Cross-border signal
NAT INST OF TECH PATNA, -100% YoY
India entrant

India's filers are early-stage, not sustained

An Indian technical institute appears in the assignee list with a recent drop to zero, matching India's overall modest 3-filing receiving-office count. This looks like early exploratory filing rather than an established program.

Recent-year momentum
🔍
Under-claimed sub-areas worth watching
Branches where filing density is low relative to the core topology claims
DC fault ride-through control logicstandardized power-cell interconnect protocolsPWM carrier synchronization across cascaded cellshybrid isolated/non-isolated topology switchingfour-port multi-terminal port allocation
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Nanjing Normal University1
Delta Electronics, Inc.0-100%
Shanghai Jiao Tong University0
NAT INST OF TECH PATNA0-100%
Qingdao Topscomm Communication Co., Ltd.0
Xi'an XD Power System Co., Ltd.0
Xi'an Jiaotong University0
Yanshan University0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Solid-State Transformer Modularity and Standardization covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this

The filing pattern here rewards a targeted read rather than a broad one — the field is small enough that individual claims matter more than aggregate share.

Map the DC fault ride-through claim space

This sub-area shows the highest-cited record (US20220166343A1) and the representative filing (US9960666B2) both centring on fault handling — a closer claim-by-claim comparison would clarify how much room remains.

Explore in Eureka

Track China's receiving-office filings directly

With 12 of 21 records filed in China, monitoring new Chinese publications is the single highest-value ongoing signal for this technology.

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Reassess after the next publication cycle

Given the 18-month publication lag, the thin 2026 count is not yet a reliable signal — revisiting this landscape in early 2027 will surface the true 2025–2026 filing level.

Revisit this landscape in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Solid-State Transformer Modularity and Standardization covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Solid-State Transformer Modularity and Standardization covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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