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Solid-State Transformer Technology 2026 — PatSnap Eureka

Solid-State Transformer Technology 2026 — PatSnap Eureka
Patent Landscape 2026

Solid-State Transformer Technology: 2026 Patent Intelligence Report

30+ SST patent records spanning 2016–2026 reveal a landscape dominated by Huawei Digital Power, with rapid expansion into data centers, EV charging, and grid-scale renewables. China accounts for approximately 70% of filings — here's what R&D and IP teams need to know.

Filing Activity by Era
SST Patent Clusters 2016–2026
SST Patent Filing Clusters 2016–2026: Foundational 3 filings, Early Commercial 4, Scale-up 8, Product Engineering 12, Hyperscale/WBG 7 Bar chart showing the growth of solid-state transformer patent filings across five eras from 2016 to 2026, based on PatSnap Eureka dataset analysis. Product engineering (2023–2024) represents the peak cluster with 12 filings. 12 9 6 3 0 3 2016–17 4 2018–20 8 2021–22 12 2023–24 7 2025–26
Source: PatSnap Eureka · 30+ SST patent records · 2016–2026
30+
SST patent records in dataset
~70%
CN jurisdiction share of filings
12+
Huawei Digital Power SST filings
2016–2026
Publication year span covered
Technology Overview

What Are Solid-State Transformers and Why Do They Matter?

Solid-state transformers (SSTs) are advanced power electronic conversion systems that replace conventional line-frequency transformers with high-frequency isolated DC/DC and AC/DC conversion stages. This enables bidirectional power flow, voltage regulation, reactive power compensation, and seamless integration of distributed energy resources — capabilities that legacy 50/60 Hz transformers fundamentally cannot deliver.

The core mechanism combines power electronic switching stages with high-frequency magnetic transformers to achieve galvanic isolation and voltage transformation at frequencies typically ranging from hundreds of Hz to several hundred kHz. This dramatically reduces transformer volume compared to line-frequency counterparts. SST architectures in this dataset commonly employ cascaded H-bridge (CHB) and modular multilevel converter (MMC) input stages for medium-voltage grid interfacing, followed by isolated DC/DC conversion stages using dual active bridge (DAB), LLC resonant, or phase-shifted full-bridge topologies.

According to the IEA, grid modernization and renewable integration are among the fastest-growing capital investment categories globally — and SSTs sit at the intersection of both. The high-frequency transformer is a central component, with designs incorporating nanocrystalline cores and Litz-wire windings for reduced core losses and improved power density.

The technology has moved from laboratory prototypes to active commercial deployment, driven by grid modernization, electric vehicle charging infrastructure, advanced materials innovation, data center power demands, and renewable energy expansion. This report covers patent records spanning 2016 to 2026 across CN, EP, US, and WO jurisdictions.

Key Sub-Domains in Dataset
  • Cascaded H-bridge & MMC input stages for MV grid interfacing
  • High-frequency isolated DC/DC conversion (DAB, LLC, dual active bridge)
  • Bus voltage equalization for cascaded module balancing
  • Fault tolerance and live-maintenance architectures
  • Multi-port SST systems with MVAC, MVDC, and LVDC outputs
4
Major technology clusters identified
12
Assignees active in dataset
4
Jurisdictions: CN, EP, US, WO
5
Emerging directions (2024–2026)
Key Technology Approaches

Four Innovation Clusters Shaping the SST Patent Landscape

Patent records from 2016–2026 group into four dominant technology clusters, each addressing a distinct engineering challenge in solid-state transformer deployment.

Cluster 1 · Dominant Topology

Cascaded Modular Input Stage with Bus Voltage Equalization

The dominant topology in the dataset. Multiple submodules with series-connected inputs handle medium-voltage AC, with parallel outputs combining to a common low-voltage DC bus. Bus voltage imbalance across modules — caused by component parameter spread — is addressed by dedicated equalization circuits. Huawei Digital Power holds a multi-jurisdiction portfolio covering passive energy-dissipating equalization modules, with filings in CN (2022), US (2023), and EP (2026).

Huawei Digital Power — CN/EP/US coverage
Cluster 2 · Core Architecture

Multi-Stage AC/DC + Isolated DC/DC (Two-Stage and Three-Stage SST)

A widely adopted architecture converts medium-voltage AC to a high-voltage DC bus via CHB or MMC, then applies isolated DC/DC (DAB, LLC, or dual active bridge) to produce low-voltage DC outputs. Three-stage variants add an output-side inverter for AC load supply. Delta Electronics (2025, CN) operates at modulation index greater than 1 on the AC input stage to optimize DC bus voltage and reduce medium-frequency transformer volume. ABB Switzerland filed a commercial-grade version integrating HV AC-to-HV DC and HV DC-to-LV DC submodule arrays with integrated LV switchgear (2024, CN).

Delta Electronics · ABB · Huawei
Cluster 3 · Operational Continuity

Fault Tolerance, Live Maintenance, and Online Operations

A significant cluster in the 2022–2026 filings addresses operational continuity — enabling individual module bypass, hot-swap replacement, and fault-isolated continuation of service without full system shutdown. ZTE Corporation's 2025 CN filing uses an auxiliary pre-charge circuit for no-transient re-insertion of replaced SST submodules during live operation. Vertiv Technologies' 2026 CN filing uses a bypass switch and coupled auxiliary power architecture between adjacent power units to preserve continuous supply when individual modules fail.

ZTE · Vertiv · Huawei — 2022–2026
Cluster 4 · Physical Engineering

High-Frequency Modular Packaging and Mechanical Design

Several filings address the physical packaging of SST power units — separating high-voltage input, medium-frequency isolation, and low-voltage output into independently encapsulated modules to reduce installation difficulty and improve field replaceability. Xinjiang Goldwind's tripartite modular structure (HV input module, isolation module with high-frequency transformer, LV output module) targets wind power substation applications. Vertiv's 2024 CN filing introduces a shielding assembly between HV and LV windings that reduces required electrical clearance, enabling significant form-factor reduction.

Goldwind · Vertiv — Wind & Substation
Freedom-to-Operate Analysis

Map your SST architecture against the full patent landscape

Huawei Digital Power alone accounts for roughly one-third of directly relevant SST filings in this dataset.

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Patent Intelligence

SST Filing Patterns: Assignees, Geography, and Application Focus

Visualising the concentration of solid-state transformer IP across organisations and jurisdictions, based on 30+ records in the PatSnap Eureka dataset.

Top SST Assignees by Filing Volume

Huawei Digital Power leads with 12+ filings; Delta Electronics follows with 7+. All other assignees hold 1–2 filings each in this dataset.

Top SST Assignees by Patent Filing Volume: Huawei Digital Power 12+, Delta Electronics 7+, ABB 2, Vertiv 2, Hitachi Energy 2, Goldwind 2, Microsoft 2, Sungrow 2 Horizontal bar chart showing patent filing counts per assignee in the PatSnap Eureka solid-state transformer dataset. Huawei Digital Power is the dominant filer with 12+ records, approximately one-third of the total dataset. 3 6 9 12 Huawei Digital Power 12+ Delta Electronics 7+ ABB Switzerland 2 Vertiv Technologies 2 Hitachi Energy 2 Xinjiang Goldwind 2 Microsoft (MSFT) 2 Sungrow Power 2

SST Filing Geography: Jurisdiction Distribution

China (CN) accounts for approximately 70% of SST-specific records. EP and US represent a secondary tier; WO (PCT) used for key platform patents.

SST Patent Geographic Distribution: CN 70%, EP 15%, US 10%, WO 5% Donut chart showing the jurisdiction breakdown of solid-state transformer patent filings. China dominates with approximately 70% of records, reflecting domestic market size and government-driven grid modernization priorities, per PatSnap Eureka dataset analysis. ~70% CN filings China (CN) ~70% Europe (EP) ~15% US ~10% PCT/WO ~5%

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Assignee Landscape

Top SST Patent Assignees: Filing Volume and Jurisdictions

Filing concentration across organisations in the PatSnap Eureka dataset, spanning CN, EP, US, and WO jurisdictions.

Assignee Filing Count (approx.) Jurisdictions Primary Focus
Huawei Digital Power Technologies Co., Ltd. Top Filer 12+ CN EP US Bus equalization, fault handling, data center, packaging, auxiliary supply
Delta Electronics Industrial Co., Ltd. 7+ CN EV charging integration, power conversion module design, three-level topologies
Xinjiang Goldwind Science & Technology Co., Ltd. 2 CN Wind power substation, tripartite modular packaging
ABB Switzerland Ltd. 2 CN Railway/industrial HV network, commercial-grade SST integration
Vertiv Technologies Co., Ltd. 2 CN Fault handling, online maintenance, form-factor reduction
Hitachi Energy Ltd. / Hitachi Energy Switzerland AG 2 WO CN Multi-port SST, LVDC substation interconnection
🔒
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Application Domains

Where SSTs Are Being Deployed: Five Key Application Sectors

Patent filings from 2017 to 2026 map SST innovation across EV charging, data centers, renewable energy, grid substations, and railway traction.

Application Domain 1

Electric Vehicle Charging Infrastructure

SST-based charging architectures appear prominently in the dataset, replacing bulky industrial-frequency transformers with compact, bidirectional, multi-output systems capable of serving multiple EV chargers simultaneously. Delta Electronics' 2021 CN filing describes an SST-enabled charging station where total converter capacity is intentionally undersized relative to aggregate charger demand, with intelligent power allocation managing peak loads — reducing station build cost. IEA data confirms EV charging infrastructure as one of the fastest-growing grid investment categories globally.

Delta Electronics · Saptech IP AG
Application Domain 2

Hyperscale Data Centers

SSTs are increasingly positioned as the preferred grid interface for hyperscale data center power delivery, replacing low-frequency step-down transformers and enabling direct MVAC or MVDC input with on-site LVDC distribution. Microsoft Technology Licensing's 2025 US and EP filings target a disaggregated solid-state DC power distribution system handling ≥1 MW AC input at ≥1000 V RMS to IT hardware below 1000 V — representing a novel entrant from the hyperscale cloud infrastructure sector. Huawei Digital Power also holds multiple CN and US filings targeting this vertical. PatSnap Analytics can map the full data center SST competitive landscape.

Microsoft · Huawei Digital Power
Application Domain 3

Renewable Energy Grid Integration

SSTs are applied as the grid interface for large-scale photovoltaic and wind power plants, enabling MPPT integration, reactive power compensation, and direct MVDC output for long-distance transmission. Huawei Digital Power's 2024 CN filing demonstrates SSTs being repositioned as the core conversion node for utility-scale solar, with MVDC collection buses replacing traditional AC aggregation — a structural shift in large PV plant architecture. Sungrow's filings address H-bridge-based MPPT control at the AC stage, decoupling PV voltage range variation from isolated DC/DC converter gain requirements. The IRENA has identified grid-forming inverter technologies — including SSTs — as critical for high-renewables grid operation.

Huawei · Sungrow · Wuhan University
Application Domain 4

Utility Grid, Substations & Railway Traction

Hitachi Energy Switzerland AG's 2024 CN filing targets complex substation load configurations with multiple independent LVDC buses and interbus DC/DC converters. Hitachi Energy Ltd.'s 2025 WO filing covers a multi-port SST with series-connected first ports for grid interface and parallel second ports for multiple loads, featuring a single shared magnetic core link with power rating undersizing flexibility. ABB Switzerland's 2024 CN filing addresses bidirectional HV AC ↔ HV DC ↔ LV DC architecture designed for railway and industrial HV network integration. LS Electric's 2024 CN filing targets reduced switch count and cost for grid-connected SST modules using a three-level half-bridge AFE rectifier combined with a DAB converter. Learn more about power electronics IP strategy at PatSnap.

Hitachi Energy · ABB · LS Electric
Emerging Directions

Five Frontiers Gaining Traction in 2024–2026 SST Filings

The most recent patent records signal where the technology is heading — and where IP strategy teams should be monitoring.

🏢

Hyperscale Data Center SST Deployment

Microsoft's 2025 US and EP filings for a Disaggregated Solid State Power Distribution System targeting ≥1 MW AC input signal the entry of cloud infrastructure operators as SST IP developers, seeking to bring MV-direct power delivery to server halls and eliminate conventional low-frequency transformer infrastructure entirely.

Multi-Scenario SST with SiC MOSFET Cascaded Structures

Shanxi Feisheng Energy Technology's 2025 CN filing explicitly employs SiC MOSFET submodule cascaded structures with nanocrystalline cores and Litz-wire windings, combined with hybrid PWM/NLM modulation and distributed voltage-temperature-lifetime balancing algorithms — representing the frontier of WBG semiconductor integration into SST platforms.

🔒
Unlock 3 more emerging SST directions
Explore live maintenance IP, PV-scale SST shifts, and automated design toolchain filings — all from 2024–2026 records.
Live maintenance IP PV-scale SST Design automation + more
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Strategic Implications

What the SST Patent Landscape Means for R&D and IP Teams

Huawei Digital Power's IP portfolio constitutes a significant blocking position across the core SST patent landscape — spanning bus voltage equalization, modular packaging, fault handling, data center power systems, and auxiliary supply architectures — in CN, EP, and US. New entrants and competitors must conduct freedom-to-operate analysis against this portfolio before commercialization.

The data center vertical is the fastest-emerging application, with Microsoft filing novel SST-based disaggregated DC power architectures in 2025. R&D teams targeting this sector should design for ≥1 MW AC input, intermediate DC buses ≥1000 V, and direct IT hardware interfacing — requirements not well-served by legacy SST product lines.

SiC MOSFET integration is transitioning from research to product in the most recent filings. IP strategists should monitor SiC device vendors' downstream SST application filings; teams developing SST platforms without WBG semiconductor roadmaps risk efficiency and power-density disadvantages within 2–3 years. The IEEE has published extensively on WBG semiconductor adoption curves in power electronics.

Geographic concentration of SST IP in China (approximately 70% of dataset filings) reflects both domestic market size and government-driven grid modernization priorities. Non-Chinese players — particularly in Europe and North America — face a patent density challenge in CN jurisdiction and should evaluate both licensing strategies and design-around opportunities. The EPO and PatSnap customer case studies document how leading energy companies navigate cross-border IP strategy in complex technology fields.

Live-maintenance capability is becoming a commercial differentiator, particularly for grid operators and data center operators who cannot tolerate service interruption. Filing activity in this area (ZTE, Vertiv, Huawei) suggests it will be a contested claim space. Teams developing SST platforms should assess their own freedom-to-operate in this sub-domain. The PatSnap Open API enables automated monitoring of new filings in targeted technology clusters.

Key Strategic Signals
FTO Risk: High
Huawei Digital Power holds ~⅓ of dataset filings across CN, EP, and US. Bus equalization and fault handling are contested sub-domains.
Fastest Growth: Data Centers
Microsoft entered SST IP space in 2025 targeting ≥1 MW AC input hyperscale deployments — a new competitive dimension.
WBG Urgency: 2–3 Year Window
SiC MOSFET SST platforms are entering product engineering phase. Teams without WBG roadmaps face efficiency and density disadvantages.
Geographic Risk: CN Density
~70% of SST filings are CN jurisdiction. European and North American players need CN-specific IP strategies before market entry.
Frequently asked questions

Solid-State Transformer Technology — key questions answered

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References

  1. Solid-State Transformer — Delta Electronics Industrial Co., Ltd., 2025, CN
  2. Power Supply Architecture Applied to SST and Corresponding Charging System — Delta Electronics Industrial Co., Ltd., 2022, CN
  3. SST Online Maintenance Circuit and Method — ZTE Corporation, 2025, CN
  4. Solid-State Transformer and Bus Voltage Equalization Method — Huawei Digital Power Technologies Co., Ltd., 2022, CN
  5. Power Conversion System — ABB Switzerland Ltd., 2024, CN
  6. Solid State Transformer and Converter System — Hitachi Energy Ltd., 2025, WO
  7. Power Supply Device Applied to SST Architecture and Three-Phase Power System — Delta Electronics Industrial Co., Ltd., 2021, CN
  8. Power Supply System for Data Centers — Huawei Digital Power Technologies Co., Ltd., 2024, CN
  9. Solid-State Transformer Power Unit and Substation — Xinjiang Goldwind Science & Technology Co., Ltd., 2022, CN
  10. SFCL and SMES Joint Optimization Configuration System for SST Low-Voltage Ride-Through — Wuhan University, 2022, CN
  11. Solid State Transformer and Busbar Voltage Equalization Method — Huawei Digital Power Technologies Co., Ltd., 2026, EP
  12. A Solid-State Transformer — TBEA Xi'an Flexible Power Transmission and Distribution Co., 2017, CN
  13. A Photovoltaic Solid-State Transformer — Sungrow Power Supply Co., 2018, CN
  14. SST System with Multiple LVDC Outputs — Hitachi Energy Switzerland AG, 2024, CN
  15. An MMC-Based Solid-State Transformer and Control Method — China Electric Power Research Institute, 2016, CN
  16. Solid-State Transformer, Power Supply Device, and Data Center — Huawei Digital Power Technologies Co., Ltd., 2023, US
  17. Solid-State Transformer System and Fault Handling Method — Vertiv Technologies Co., Ltd., 2026, CN
  18. Power Unit and Solid-State Transformer — Huawei Digital Power Technologies Co., Ltd., 2024, EP
  19. Power Conversion System for Connecting PV Plants to the Grid — Huawei Digital Power Technologies Co., Ltd., 2024, CN
  20. International Energy Agency (IEA) — Grid Modernization and EV Infrastructure Reports
  21. International Renewable Energy Agency (IRENA) — Grid-Forming Inverter Technology
  22. IEEE — Wide Bandgap Semiconductor Adoption in Power Electronics
  23. European Patent Office (EPO) — Cross-Border IP Strategy Resources

All data and statistics on this page are sourced from the references above and from PatSnap's proprietary innovation intelligence platform. This landscape is derived from a limited set of patent and literature records retrieved across targeted searches and represents a snapshot of innovation signals within this dataset only.

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