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Run your analysis now →Space thermal control covers how spacecraft and satellites move heat away from electronics and instruments that cannot be cooled by convection in vacuum. The patent record here spans loop heat pipes, deployable and variable-geometry radiators, multilayer insulation, and thermal coating degradation under deep-space extremes. At 17 total families, this is a small, specialised corpus compared to broader spacecraft or thermal-management categories, which means individual filings carry disproportionate weight in any freedom-to-operate review.
Filing activity is concentrated in two IPC subclasses — B64G for cosmonautics and spacecraft, and F28D/F28F for heat-exchange apparatus and their components — with smaller spillover into refrigeration, ceramics and engine cooling classifications. The trend line peaked in 2017 and has not recovered, though publication lag of roughly 18 months means the most recent years understate true filing activity.
The numbers behind this landscape come from 17 published patent families filed between 2015 and 2026, classified across spacecraft, heat-exchange and coatings IPC codes.
Filings hit 5 in 2017, the high point of the period, then declined toward a flat or falling trend by the 2022 midpoint, which reads zero. Because publication typically lags filing by about 18 months, the last one to two years in any chart understate real activity — but even accounting for that lag, this field has not seen a renewed filing wave since its mid-2010s peak.
B64G (cosmonautics and spacecraft) appears in 13 of 17 records, with F28D (heat-exchange apparatus) in 9 and F28F (heat-exchanger details) in 7 — confirming that most claims are anchored in spacecraft-specific hardware rather than generic thermal engineering. Smaller counts in F25B, C01B, C04B and F01P point to occasional crossover from refrigeration, materials and engine-cooling disciplines, but none of these represent a sustained secondary cluster.
Shares are the percentage of the 17 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about space thermal control systems and every answer comes back with the patent numbers behind it.
Try EurekaThe filing discloses a satellite thermal management method using an evaporator to convert liquid to vapor, which then circulates passively to two radiators — one shielded from the sun and one sun-illuminated — condensing back to liquid in the unilluminated radiator before returning to the evaporator. The dual-condenser, sun-normal orientation lets the system reject heat regardless of the satellite's attitude relative to the sun.Filed by The Boeing Company, published 2018-08-09.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US4815525A | Deployable space radiator with condenser | 24 |
| 2 | US20170160021A1 | Variable Heat Rejection Device | 20 |
| 3 | CN105383714A | 一种星载主动控温系统 | 17 |
| 4 | CN105523198A | 基于环路热管的空间热管辐射器 | 15 |
| 5 | US20190308753A1 | Variable heat rejection device | 9 |
| 6 | US10228197B2 | Variable heat rejection device | 9 |
| 7 | CN112484541A | 一种旋转空间辐射换热器 | 6 |
| 8 | US11814195B1 | Silicon oxide coated aluminized Kapton radiator coating for nano-satellite thermal management | 3 |
| 9 | US20180222605A1 | Dual condenser loop heat pipe for satellites with sun-normal radiators | 3 |
| 10 | EP3357815A1 | Dual condenser loop heat pipe for satellites with sun-normal radiators | 2 |
Citation counts favour older records simply because they have had more time to accumulate references within the searched corpus — treat them as a signal of influence, not of current relevance.
Patent titles are shown in the language they were filed in, not translated, so that each record stays verifiable against the original filing — a translated title will not match in Eureka or in any national register. Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three patterns stand out once the filing and citation data are read together: a small but old prior-art base, a two-jurisdiction filing footprint, and coordinated filing among a small group of named inventors.
The most-cited record, a deployable space radiator with condenser, dates from the late 1980s and still carries the highest citation count in the set. Newer filings on variable heat rejection devices are catching up but have not displaced it, which suggests the core mechanical approach to deployable radiators remains largely unchallenged.
United States and China together account for 14 of the 17 records in this landscape, with Europe and other offices contributing only isolated filings. Anyone assessing freedom-to-operate outside these two jurisdictions is working with a much thinner prior-art base.
The strongest co-assignee links all involve the same lead inventor paired with different collaborators across separate filings, pointing to one active engineering team rather than a broad industry consortium filing jointly.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to space thermal control systems, with the prior art for and against each one.
| Assignee | Co-assignee | Shared families |
|---|---|---|
| SHETH RUBIK | HARTI DARREN | 2 |
| SHETH RUBIK | DINSMORE CRAIG E | 2 |
| SHETH RUBIK | COGNATA THOMAS J | 2 |
| HARTI DARREN | DINSMORE CRAIG E | 2 |
| HARTI DARREN | COGNATA THOMAS J | 2 |
| DINSMORE CRAIG E | COGNATA THOMAS J | 2 |
Co-filing activity clusters around a single named inventor pairing with several distinct collaborators, rather than spreading across competing organisations — a pattern more typical of one internal team's output than an open collaborative field.
With only 17 families in the corpus, no single assignee shows sustained recent momentum — every named organisation and inventor in the recent-year tracking shows zero filings in the latest year, consistent with the overall decline from the 2017 peak.
The Boeing Company holds the representative dual-condenser loop heat pipe filing in this set and appears among the tracked assignees, but shows no recent-year filing momentum, consistent with the corpus-wide slowdown after 2017.
This academic assignee registers a -100% year-over-year change in the latest tracked period, moving from prior activity to zero, which mirrors the broader flat-to-declining trend across the dataset rather than an isolated retreat.
Named inventors including Sheth Rubik, Harti Darren, Dinsmore Craig E and Cognata Thomas J appear in the strongest co-assignee pairings in this landscape, each sharing two joint filings, suggesting one working group is responsible for a meaningful share of recent activity.
| Assignee | Recent year | YoY |
|---|---|---|
| The Boeing Company | 0 | — |
| University of Science and Technology of China | 0 | -100% |
| SHETH RUBIK | 0 | — |
| HARTI DARREN | 0 | — |
| EVENING STAR TECH DEV LTD | 0 | — |
| DINSMORE CRAIG E | 0 | — |
| COGNATA THOMAS J | 0 | — |
| Xi'an Institute of Space Radio Technology | 0 | — |
The filing data narrows the field to a handful of technical routes and two dominant jurisdictions — the next step is testing specific claim language against this corpus.
With citation weight concentrated on a small number of foundational deployable-radiator and loop-heat-pipe filings, a claim chart against those specific records will show more precisely what is blocked versus open.
Explore claim mapping in EurekaSince 14 of 17 filings sit in just two receiving offices, a targeted search of European and other regional filings can confirm whether the thin coverage there is a real gap or a search-scope artefact.
Run a jurisdiction-specific search in EurekaThe repeat co-filing pattern among a small inventor group is worth monitoring directly, since their joint filings account for a disproportionate share of recent activity in this corpus.
Set up assignee tracking in EurekaThis landscape identifies 17 patent families published between 2015 and 2026 that match spacecraft thermal control, loop heat pipe, multilayer insulation and related classifications. That is a small corpus compared to broader spacecraft or general thermal-management categories, reflecting how specialised deep-space thermal hardware remains. Filing peaked at 5 records in 2017 and has not returned to that level since, though the most recent one to two years are understated due to normal publication lag.
The Boeing Company appears prominently, including holding the representative dual-condenser loop heat pipe filing analysed in this landscape, alongside academic filers such as the University of Science and Technology of China. However, no assignee shows sustained recent-year filing momentum in the tracked period — every named organisation registers zero filings in the latest tracked year, consistent with the corpus-wide decline since 2017. This is a field with a concentrated but currently quiet filer base rather than one dominated by an active leader.
A loop heat pipe is a passive thermal transport device that moves heat from a hot evaporator to a cooler condenser or radiator using a working fluid's phase change, without needing a mechanical pump. In spacecraft, this matters because active cooling systems add mass, power draw and failure points that are hard to service in orbit. The most-cited patents in this landscape, including a deployable space radiator with condenser and variable heat rejection devices, are built around this passive-circulation principle.
Based on the IPC composition, thermal coating degradation under deep-space extremes and variable-emissivity radiator surfaces show thinner direct claim coverage than the dominant loop-heat-pipe and deployable-radiator clusters. Refrigeration-cycle approaches to spacecraft cooling and the newer H10W thermal-electronic integration classification also appear only a handful of times across the 17 families. These are not proven gaps in the physics, only in the claimed intellectual property within this specific search scope, so a deeper prior-art search before filing is still warranted.
The data shows filings peaked at 5 in 2017 and trended toward flat or declining by the 2022 midpoint, with the most recent tracked assignees all showing zero filings in the latest year. Part of this apparent decline is a publication-lag artefact, since patent filings typically take about 18 months to appear in public records, so the very latest years always look thinner than they eventually will. Even accounting for that lag, the absence of a renewed filing wave in this corpus suggests the field has not seen a fresh wave of patenting activity comparable to its mid-2010s peak.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.