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Stereolithography Feedstock Patents: Who Leads, Where Filing Cooled 2026

Stereolithography Feedstock Patents: Who Leads, Where Filing Cooled 2026
https://www.patsnap.com/resources/blog/rd-blog/stereolithography-feedstock-development-patent-landscape/ · Patsnap · data cut-off 2026-07-31 · downloaded from the live page
Additive Manufacturing · Patent Landscape
Stereolithography feedstock patents: mapping resin formulation claims after the 2019 filing peak
  • Filing has cooled, not grown. the field peaked at 23 families in 2019 and had fallen to a single family by the 2022 midpoint, with 2026 not yet showing new activity in this cut.
  • Claim density sits in two IPC subclasses. B33Y (77 of 81 records) and B29C (70 of 81) cover nearly every filing, while condensation polymer chemistry (C08G, 19 records) and photolithography-adjacent formulation (G03F, 10 records) are comparatively open.
  • Collaboration is rare and concentrated. only two co-assignee pairs appear across 81 families, each tied to a single joint filing relationship rather than a broader alliance pattern.
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81
Published Records
48%
Top-5 Share of All Records
-33%
3-Yr Growth (lag-adjusted)
US
Leading Jurisdiction
Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Field Overview

What this patent set covers

This landscape tracks 81 patent families filed against stereolithography and vat photopolymerization feedstock claims — photocurable formulations, functional resins and resin feedstock compositions indexed under B29C64/124, C08F2/48 and B33Y70. The scope is deliberately narrow: it is not general 3D printing hardware, but the resin chemistry and formulation work that determines what a vat photopolymerization process can actually produce.

Filing activity is concentrated in the United States (38 records at the receiving office level) with meaningful volume through the EPO and WIPO's PCT route, suggesting most applicants pursue multi-jurisdiction protection rather than filing domestically only. Publication naturally lags filing by around 18 months, so the apparent drop-off in the most recent years understates real filing activity that has not yet published.

Filing activity by year, 2017–2026
  1. 1BASF SE10
  2. 2FORMLABS INC9
  3. 3POLY MED INC9
  4. 4VIRGINIA TECH INTELLECTUAL PROPERTIES INC7
  5. 5XYZPRINTING4
  6. 6KINPO ELECTRONICS LTD4
  7. 7UEA ENTERPRISES LTD4
  8. 8AMO DEVELOPMENT LLC4
  9. 9COLTENE WHALEDENT AG3
  10. 103D SYSTEMS INC2
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Stereolithography Feedstock Development covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Filing & Classification Data

Trend and technology composition

Two views of the same 81-family dataset: how filing volume has moved year over year, and how those filings distribute across IPC subclasses.

A peak year followed by a flat tail

Filings rose to 23 in 2019, the highest point in the window, then declined through the 2022 midpoint of a single family before the trend flattens out toward 2026. This is a mature-then-quiet pattern rather than an emerging one: the foundational formulation claims were largely staked out in the 2017-2019 window, and subsequent years show applicants either consolidating around those positions or moving to adjacent chemistries not captured by this search string.

A peak year followed by a flat tail06131925132017201823201920202021202220232024202502026Most recent year is partial — publication lag means later filings are not yet visible.

Claim density concentrated in two subclasses

B33Y (77 records) and B29C (70 records) dominate, meaning almost every family in this set touches core additive-manufacturing process claims or plastics-shaping claims. Condensation polymer chemistry (C08G, 19), vinyl/addition polymer chemistry (C08F, 12), coatings and inks (C09D, 12), photolithography-adjacent formulation (G03F, 10) and implant-specific applications (A61F, 6) each appear in a minority of records, pointing to formulation chemistry as the less-crowded side of this landscape compared to process claims.

Claim density concentrated in two subclassesB33Y · Additive manufacturing (3D pri…7795.1%B29C · Shaping of plastics7086.4%C08G · Condensation polymers1923.5%B29K · Plastics moulding materials (i…1619.8%C08F · Addition polymers (vinyl etc.)1214.8%C09D · Coatings, paints & inks1214.8%G03F · Photolithography & photomechan…1012.3%A61F · Implants & prostheses67.4%Other4656.8%

Shares are the percentage of the 81 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Stereolithography Feedstock Development covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

Most-cited filings and the newest entrant

Newest Filing in the Dataset
US20260027770A12026-01-29

Tuning Crosslinking of Hybrid Preceramic Polymers in Vat Photopolymerization Toward Controlled Ceramic Yields

UT-BATTELLE, LLC

Filed by UT-Battelle, this January 2026 application addresses control of preceramic polymer crosslinking for UV-curable vat photopolymerization aimed at producing polymer-derived ceramics with controlled ceramic yield. It targets the relationship between crosslinking chemistry and volatile-element loss during conversion, an area the abstract itself describes as still open for systematic investigation.Abstract condensed from the original filing.

US20260027770A1 — patent drawing 1US20260027770A1 — patent drawing 2
View filing details
Highest-cited records in this dataset
#Publication no.Patent titleCitations
1US20180162052A1Additive manufacturing using foaming radiation-curable resin21
2US20210229364A1Stereolithography with micron scale control of properties20
3WO2018080397A1A resin formulation and uses thereof20
4WO2018106977A1Additive manufacturing using foaming radiation-curable resin18
5US20210155722A1Methods and compositions for photopolymerizable additive manufacturing14
6WO2020064522A1Photocurable composition for use in 3D printing10
7WO2021222086A1Methods of making a three-dimensional object8
8US20220033678A1Photocurable composition for use in 3D printing7
9WO2020064523A1UV curable composition for use in 3D printing7
10US20210395558A1UV curable composition for use in 3D printing5

Citation counts favour older records simply because they have had more time to accumulate citations within the searched corpus; treat this as a signal of influence on the field, not of current commercial relevance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Stereolithography Feedstock Development covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Landscape Insights

What the numbers mean for a filing decision

Three patterns worth weighing before drafting new claims in this space.

Filing Momentum
23 → 1
peak (2019) vs. 2022 midpoint

The formulation land grab already happened

The steep decline from the 2019 peak to a single family at the 2022 midpoint indicates that the core photocurable resin and functional resin claim space was staked out early. New entrants filing broad formulation claims now are filing into already-dense prior art rather than open ground.

Based on year-over-year family counts, 2017-2026.
Classification Spread
77 / 81
records touching B33Y

Process claims dominate; chemistry claims trail

Nearly every record in this set carries a B33Y additive-manufacturing classification, but only a minority reach into C08G condensation polymer or G03F photolithography-adjacent chemistry. That gap is where formulation-specific claims — as opposed to process claims — have more room.

IPC subclass counts across 81 families.
Collaboration Pattern
2
co-assignee pairs identified

This field files solo, not in alliances

Only two joint-assignee relationships appear across the entire dataset, each capped at four shared filings. That is a field of independent filers rather than one organized around joint ventures or shared R&D consortia, which changes how a competitor's freedom-to-operate map should be read.

Co-assignee pair counts from the 81-family set.
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to stereolithography feedstock development, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Stereolithography Feedstock Development covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players & White Space

Who holds ground, and what remains open

Recent-year momentum across the named assignees is flat: every organisation tracked shows zero filings in the latest year, including one with a reported -100% year-over-year drop. That flatness is consistent with the broader trend data, not an anomaly of a single company pulling back.

Momentum Signal
0
latest-year filings across tracked assignees

No assignee is actively expanding right now

Every named assignee in the momentum data — from established materials companies to smaller filers — shows zero filings in the most recent year. Given the 18-month publication lag, this likely understates true activity, but it does not point to any single organisation currently pulling ahead.

Recent-year momentum by assignee, dataset cut-off 2026-07-31.
Joint Filing
4 filings
strongest co-assignee pair

Two firm pairings account for all observed collaboration

The strongest co-assignee relationships in the dataset each involve four shared filings — one pairing a university-affiliated IP entity with a specialty polymer manufacturer, the other pairing two device manufacturers. Beyond these two pairs, filing in this field is solitary.

Co-assignee pair strength, 81-family dataset.
Citation Leaders
21 citations
highest count in the set

Foaming radiation-curable resin claims anchor the field

The most-cited record in this dataset concerns foaming radiation-curable resin for additive manufacturing, cited 21 times, with a closely related family from the same technical direction also ranking near the top. These anchor claims are the ones a new formulation patent is most likely to run into during examination.

Citation counts within the searched corpus.
🔍
Under-claimed sub-areas worth checking before filing
Branches where IPC volume is comparatively low relative to the core B33Y/B29C claim density
Preceramic polymer crosslinking controlPhotolithography-adjacent resin formulations (G03F overlap)Implant-specific resin biocompatibility (A61F overlap)Condensation-polymer-based photocurable chemistriesCoating/ink-derived resin feedstocks (C09D overlap)
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
BASF SE0
Formlabs Inc.0-100%
Virginia Tech Intellectual Properties, Inc.0
Poly-Med, Inc.0
Kinpo Electronics, Inc.0
Solvay Specialty Polymers USA, LLC0
XYZprinting, Inc.0
UEA Enterprises Ltd.0
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Stereolithography Feedstock Development covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Next Steps

Where to take this analysis

This page summarises the shape of the dataset. Answering a specific filing or freedom-to-operate question requires going record by record.

Check freedom-to-operate against the cited leaders

The highest-cited records concentrate around foaming radiation-curable resin claims. Any new formulation filing should be checked against these specifically, not just against the broader IPC classes.

Run a claim comparison in Eureka

Track the under-claimed branches

Condensation-polymer photocurable chemistry and photolithography-adjacent formulations show materially lower filing volume than the core process classes. That gap may close quickly once publication catches up to the 18-month lag.

Monitor these subclasses in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Stereolithography Feedstock Development covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about this landscape

Answers are grounded in the same dataset. Derived from a Patsnap search on Stereolithography Feedstock Development covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company’s registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.

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