Structural Adhesive Bonding Patents: Top Companies & Trends 2026
Structural Adhesive Bonding Patents: Who Files, What They Claim, and Where the Field Is Still Open
Filing has cooled, not collapsed. the complete 2021–2024 window shows a 22% decline (76 to 59 filings), but 2025–2026 figures are still filling in under the usual 18-month publication lag. Annual filings rose to a peak of 78 in 2020, then the most recent complete comparison — 2021 (76) versus 2024 (59) — shows a 22% decline. Treat 2025 and 2026 as undercounted rather than as evidence the decline continued.
- 13M INNOVATIVE PROPERTIES CO9.7%
- 2BOSTIK SA(FR)4.6%
- 3GREATBATCH LTD2.6%
- 4JAMES HARDIE INT FINANCE BV2.4%
- 5THE BOEING CO2.3%
See the full structural adhesive bonding analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions about structural adhesive bonding patents
Who holds the most patents in structural adhesive bonding?
The leading assignee in this dataset holds 226 of the 2,326 records in scope, which is the single largest position but still under 10% of the field. The top 5 assignees combined reach 501 records, or 21.5% of all records in scope, and the top 10 combined reach 29.3%. That leaves the majority of filings spread across a long tail of smaller and single-filing entrants, so no one company controls prosecution in this space.
Is patent filing in structural adhesive bonding growing or shrinking?
Filing peaked at 78 records in 2020, and the most recent complete year-over-year comparison, 2021 to 2024, shows a 22% decline from 76 to 59 filings. That is a real pullback in the settled data. The 2025 and 2026 figures shown in any trend chart are still incomplete because publication lags filing by roughly 18 months, so they should not yet be read as a continuation of that decline.
What technology areas dominate structural adhesive bonding patents?
Adhesive formulation chemistry, classified under IPC subclass C09J, appears in 41.8% of the 2,326 records in scope, making it the single largest technology area by a wide margin. Layered products and laminates (B32B) follow at 20.4%, with condensation and addition polymer classes also well represented. Mechanical joining processes like welding, soldering and brazing (B23K) appear in only 6.7% of records, indicating that claim density sits mainly in materials and layered structure rather than joining hardware.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Structural Adhesive Bonding covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.