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Run your analysis now →Filing growth compares 2021 (182 records) with 2024 (173) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 3,688 records in scope (CR5), not by the ranked leaders only.
Supercritical and dry drying methods address a specific failure mode in wafer processing: as feature aspect ratios climb, the surface tension of a receding liquid meniscus during conventional drying pulls neighbouring structures together, a failure known as pattern collapse. The patent activity captured here spans routes built to avoid that liquid-vapour interface altogether — supercritical carbon dioxide drying, Marangoni-effect drying, and surface-tension-reduction chemistries — alongside the chamber-pressure control hardware and residue-management steps that make those routes usable in production.
The dataset covers 3,688 published records filed or published between 2015 and mid-2026, drawn from a search string anchored on pattern collapse, supercritical and Marangoni drying, and the mechanical and chemical levers used to fight capillary force at high aspect ratio.
Two views of the same 3,688-record corpus: the year-by-year filing curve, and the IPC subclasses those records fall under.
Annual filings rose to a peak of 276 in 2018 before settling into a stable band; 2021's 182 fell to 173 by 2024, a -5% move over three years. Filing counts for 2025 and 2026 are still incomplete because publication lags filing by roughly 18 months, so the most recent two years understate actual filing activity and should not be read as a fresh decline.
H01L (semiconductor devices) appears on 43.8% of records and G03F (photolithography) on 38.0%, reflecting how tightly drying claims are bound to the device and patterning steps they protect. Cleaning-specific classes such as B08B and C11D sit under 8% each, and polymer and inorganic-chemistry classes (C08G, C01B, C08J) are each below 6.5% — a signal that formulation-level claims are comparatively sparse relative to device- and process-level claims.
Shares are the percentage of the 3,688 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.
This page is one run against one query. Ask Eureka your own question about supercritical and dry drying of patterns and every answer comes back with the patent numbers behind it.
Try EurekaA method is provided for processing a wafer used in fabricating semiconductor devices. The method can comprise forming high-aspect ratio features on the wafer, which is followed by wet processing and drying. During drying, pattern collapse can occur. This pattern collapse can be repaired to allow for additional processing of the wafer. In some instance, pattern collapse can be repaired via etching where the etching breaks bonds that can have formed during pattern collapse.Filed by Lam Research Corporation, granted 2013 — notable for claiming repair of collapse after it occurs, rather than only prevention during the drying step.


| # | Publication no. | Patent title | Citations |
|---|---|---|---|
| 1 | US6565763B1 | Method for manufacturing porous structure and method for forming pattern | 840 |
| 2 | US9310684B2 | Organometallic solution based high resolution patterning compositions | 624 |
| 3 | US20170102612A1 | Organotin oxide hydroxide patterning compositions, precursors, and patterning | 619 |
| 4 | US20130095664A1 | Atomic layer deposition of antimony oxide films | 563 |
| 5 | US20120164846A1 | Method of Forming Metal Oxide Hardmask | 545 |
| 6 | US8901016B2 | Method of forming metal oxide hardmask | 543 |
| 7 | US20150243542A1 | Substrate processing apparatus and substrate processing method | 540 |
| 8 | US9171716B2 | Method of forming metal oxide hardmask | 534 |
| 9 | US6589707B2 | Partially crosslinked polymer for bilayer photoresist | 490 |
| 10 | US20170343896A1 | Sequential infiltration synthesis for enhancing multiple-patterning lithography | 483 |
Citation counts favour older, earlier-filed records inside a searched corpus and should be read as a signal of influence on later filings, not as a marker of current commercial relevance.
Each row carries its publication number; clicking a row searches Eureka by that number.
When you want the answer in the next five minutes.
The agent works the prompt against patents and technical literature, citing every source.
Run your analysis now →When it has to run inside your own pipeline.
Patent search, landscape analysis and assignee resolution as MCP tools. Drop them into any agent framework, or call REST directly.
Browse MCP servers →Three read-throughs from the concentration, trend and class data above.
Five assignees hold 966 records between them, but the gap to tenth place (72 records) is steep, and the ranking runs a full 100 companies deep. That shape favours challengers who target a specific sub-route rather than compete head-on across the whole drying process.
The 2021-2024 window shows filings holding roughly steady rather than accelerating or collapsing. Given the 2018 peak of 276, current levels suggest the core prevention mechanisms are largely staked out, with incremental filing continuing around them.
H01L and G03F together anchor most of the corpus, while dedicated cleaning-composition classes (B08B, C11D) each sit under 8%. That gap is a filing signal: chemistry-level claims around residue and surface-tension-reduction may be less crowded than the device- and process-level claims around them.
Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to supercritical and dry drying of patterns, with the prior art for and against each one.
The ranked leaders span equipment makers, materials suppliers and device manufacturers rather than a single industry segment, which is typical for a process step that touches chemistry, hardware and the wafer itself.
The leading assignee's 351 records sit well above fifth place at 136, marking a clear scale advantage in this corpus. That gap likely reflects breadth across equipment, chemistry and process claims rather than depth in any one sub-route.
Filings fall from 136 at fifth place to 72 at tenth, and the ranking runs 100 companies deep with most holding far fewer records. That long tail is where newer chemistry and hardware entrants sit.
Several of the largest historical filers show sharp year-on-year drops in the most recent year, including moves to zero filings; a few smaller filers hold flat at a single filing. Given the ~18-month publication lag, this pattern is as likely to reflect incomplete recent-year data as any real pullback.
| Assignee | Recent year | YoY |
|---|---|---|
| Tokyo Electron Limited | 1 | -89% |
| Inpria Corporation | 1 | -50% |
| Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) | 1 | 0% |
| Kimberly-Clark Worldwide, Inc. | 1 | 0% |
| Shin-Etsu Chemical Co., Ltd. | 0 | -100% |
| Applied Materials, Inc. | 0 | -100% |
| BASF SE | 0 | — |
| Tokyo Ohka Kogyo Co., Ltd. | 0 | — |
The figures above answer what has already been filed. Two follow-up questions matter more for a live filing decision.
A 351-record position can be built from broad process claims, narrow formulation claims, or both. Reading the independent claims of the leader's most-cited records clarifies which parts of the drying process are actually locked up.
Explore assignee portfolios in Eureka →The under-claimed sub-areas identified here are a starting point, not a guarantee of freedom to operate. Running a candidate claim through a full prior-art search against the residue-management and surfactant-chemistry branches will confirm whether the gap holds.
Run a white space search in Eureka →Pattern collapse happens when the receding liquid meniscus during a conventional wet-drying step exerts capillary force on high-aspect-ratio features, pulling them together or breaking them before drying finishes. It becomes more severe as feature aspect ratios increase, which is why it has drawn sustained patent activity across chemistry, hardware and process routes. In this corpus, claims addressing it sit heavily inside semiconductor-device (H01L) and photolithography (G03F) classes, reflecting how tightly the problem is bound to specific device fabrication steps rather than being a generic cleaning issue.
Supercritical carbon dioxide drying removes the liquid-vapour interface that causes capillary force in the first place, because the fluid transitions directly between liquid-like and gas-like states without crossing a phase boundary inside the features being dried. Marangoni drying and surface-tension-reduction chemistries take a different route, lowering the force at the interface rather than removing it. Both approaches appear as distinct claim families in this dataset, and chamber pressure control hardware is a recurring companion claim to the supercritical route specifically.
The assignee ranking behind this landscape covers 100 companies, with the leading assignee holding 351 of the 3,688 records in scope and a steep drop to 136 records by fifth place. That shape, a dominant leader followed by a long tail of smaller filers, is typical of a process technology that sits at the intersection of equipment, chemistry and device manufacturing. Company-level detail, including the specific assignees behind these figures, is available in the ranking table on this page.
Filing activity peaked at 276 records in 2018 and has since settled into a plateau, with complete-year data showing 182 records in 2021 and 173 in 2024, a -5% shift over that span. That is a mature but still active field rather than one in decline. The apparent drop-off after 2024 in the raw trend line is largely an artefact of publication lag, since patent publications typically trail filing by around 18 months, so 2025 and 2026 figures are still incomplete.
IPC class shares point to formulation-level claims, such as Marangoni surfactant chemistry and residue-after-drying detection, sitting well behind device- and process-level claims like H01L and G03F, each under 8% of records against 43.8% and 38.0% respectively. Chamber pressure ramp-rate control and CO2 drying cycle-time optimisation are also comparatively thin relative to the core prevention mechanisms. None of this guarantees freedom to operate on its own; it flags branches worth a targeted prior-art search before drafting a claim there.
Go past this page: query the whole supercritical and dry drying of patterns corpus yourself, in your own scope.
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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.
Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.
Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.
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