https://www.patsnap.com/resources/blog/rd-blog/temperature-and-thermal-sensors-patent-landscape-patent-landscape/ · Patsnap · data cut-off 2026-08-31 · downloaded from the live page
Patent Landscape · Temperature & Thermal Sensors
Temperature and thermal sensor patents: who holds the claims and where the field is still open
  • 6.1% concentration at the top. The five leading assignees hold just 2,586 of 42,188 records in scope — a genuinely long tail, not a two-player race.
  • Filing has cooled from its 2017 peak. 1,168 records published that year against 52 so far in the most recent (partial) year, with a measured -35% drop from 2021 to 2024.
  • Diagnosis and material-analysis classes dominate. A61B and G01N together anchor the technology mix, ahead of the core G01K temperature-measurement subclass itself.
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42.2K
Published Records
6%
Top-5 Share of All Records
-35%
Filing Growth 2021→2024
US
Leading Jurisdiction

Filing growth compares 2021 (1,019 records) with 2024 (662) — a three-year span. 2024 is the most recent year we treat as complete: publication lags filing by roughly 18 months, so 2025 onwards are still filling in and any growth rate that ends there would understate the field. Top-5 share is the combined record count of the five largest assignees divided by all 42,188 records in scope (CR5), not by the ranked leaders only.

Published byPatsnap Research··7 min readSourced from Patsnap Eureka
Overview

What the temperature and thermal sensor patent record shows

Temperature and thermal sensing sits at the intersection of medical diagnostics, industrial control and consumer electronics, and the patent record reflects that spread. Across 42,188 records published between 2015 and the 2026 cut-off, claims range from body-worn analyte sensors that compensate for temperature drift to heat-flux measurement in industrial control loops. No single assignee dominates: the leading filer holds 647 records, and even the ranked leaders together account for a modest share of the total field.

The technology composition points to a field defined more by application context than by a single sensing principle. Diagnosis and surgery (A61B) and material analysis and testing (G01N) each carry a larger share of records than the core temperature-measurement subclass (G01K) itself, which signals that most filing activity treats temperature sensing as a supporting element inside a larger system claim rather than as a standalone invention.

Filing activity and technology composition, 2015–2026
  1. 1META PLATFORMS TECHNOLOGIES LLC647
  2. 2DEKA PRODUCTS LP618
  3. 3QUALCOMM INC458
  4. 4DEXCOM INC454
  5. 5INTEL CORP409
  6. 6STRONG FORCE IOT PORTFOLIO 2016 LLC357
  7. 7HONEYWELL INTERNATIONAL INC352
  8. 8PANASONIC HOLDINGS CORP311
  9. 9HONDA MOTOR CO LTD294
  10. 10FORD GLOBAL TECH LLC291
Source: Patsnap Eureka. Assignee ranking and totals. Derived from a Patsnap search on Temperature & Thermal Sensors Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
The Data

Filing trends and technology composition

Publication counts by year and IPC subclass show where claim density sits today and how the field has moved since its 2017 peak.

Filing trend: a 2017 peak followed by a measured pullback

Filings peaked at 1,168 records in 2017. From 2021 (1,019) to 2024 (662) — the most recent year that can be treated as complete — the total fell 35%. Publication lags filing by roughly 18 months, so 2025 and 2026 figures are still filling in and should not be read as a continuing decline.

Filing trend: a 2017 peak followed by a measured pullback03006009001,2001,168201720182019202020212022202320242025522026Most recent year is partial — publication lag means later filings are not yet visible.

Technology composition: application context outweighs the core subclass

A61B (diagnosis and surgery) leads at 8.1% of the 42,188 records in scope, ahead of G01N (material analysis, 5.6%) and the core G01K temperature-measurement subclass itself (5.3%). Because a record can carry multiple IPC classes, these shares add up to more than 100% — they describe overlap, not a single ranked total.

Technology composition: application context outweighs the core subclassA61B · Diagnosis & surgery3,4288.1%G01N · Material analysis & testing2,3475.6%G01K · Temperature measurement2,2315.3%G06F · Electric digital data processi…1,8584.4%A61M · Devices for body fluids1,2783.0%G05B · Control & regulating systems1,1592.7%G05D · Control of non-electric variab…1,0212.4%G01J · Radiation & light measurement9122.2%Other22,23352.7%

Shares are the percentage of the 42,188 records in scope. A patent can carry several IPC classes, so the shares add up to more than 100%.

Source: Patsnap Eureka. Filing trend and technology composition. Derived from a Patsnap search on Temperature & Thermal Sensors Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.

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Key Patents

A representative filing and the most-cited prior art

Representative Record
US12514471B22026-01-06

Systems, devices, and methods to compensate for temperature effects on sensors

DEXCOM, INC.

The filing describes generating an estimated analyte value from an in vivo analyte sensor by combining a first sensor signal with a temperature signal from an ex vivo temperature sensor, deriving a temperature-compensated sensitivity and using it to correct the analyte reading.Published 2026-01-06 · assigned to Dexcom, Inc.

US12514471B2 — patent drawing 1US12514471B2 — patent drawing 2
View full record
Most-cited records in the corpus
#Publication no.Patent titleCitations
1US20090090763A1Powered surgical stapling device3,624
2US20130214025A1Powered surgical stapling device2,228
3US6806808B1Wireless event-recording device with identification codes1,821
4US7344533B2Impedance controlled tissue ablation apparatus and method1,620
5US6735630B1Method for collecting data using compact internetworked wireless integrated network sensors (WINS)1,420
6US20050245839A1Non-invasive temperature monitoring device1,373
7US8663106B2Non-invasive temperature monitoring device1,307
8US7025774B2Tissue penetration device1,286
9US6514249B1Positioning system and method for orienting an ablation element within a pulmonary vein ostium1,278
10US20170173262A1Medical systems, devices and methods1,225

Citation counts favour older filings simply by virtue of having had more time to accumulate them — treat this table as a signal of influence within the searched corpus, not a ranking of current technical importance.

Each row carries its publication number; clicking a row searches Eureka by that number.

Source: Patsnap Eureka. Citation counts and representative records. Derived from a Patsnap search on Temperature & Thermal Sensors Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
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Insights

What the numbers mean for a filing decision

Three patterns matter more than the headline count: how concentrated ownership actually is, where the technology claims cluster, and which receiving offices carry the weight of filing activity.

Concentration
6.1%
top 5 share of 42,188 records

Ownership is genuinely dispersed

The top five assignees combine for 2,586 records, just 6.1% of the field, and the top ten add up to only 9.9%. That is a long tail of single- and few-filing entrants rather than a market gated by a handful of blocking portfolios.

Top 10 = 9.9% of 42,188 records
Technology mix
8.1%
A61B share of records

Diagnostic and surgical context leads the claim mix

A61B outranks the core G01K temperature-measurement subclass, meaning most temperature-sensing claims are filed as part of a larger diagnostic or surgical system rather than as a discrete sensor invention.

G01K core subclass sits at 5.3%
Filing momentum
-35%
2021 to 2024 change

Volume has eased from its 2017 peak

Filings fell from 1,019 in 2021 to 662 in 2024, a 35% decline over that span. The 2017 peak of 1,168 has not been approached since, though the most recent two years are still filling in under publication lag.

2017 peak: 1,168 records
Jurisdictions
11,303
US-office records

Filing activity is US-centred with a broad international spread

The United States receiving office carries the largest single share of records, with the EPO, WIPO/PCT, Canada, Australia and the UK all showing meaningful but smaller volumes.

EPO: 3,832 · WIPO/PCT: 2,234
Eureka AI Agent
Looking for what nobody has claimed yet?

Eureka can read the same corpus for gaps instead of for coverage: under-claimed branches adjacent to temperature & thermal sensors patent landscape, with the prior art for and against each one.

Find the white space →
Source: Patsnap Eureka. Co-assignee relationships and derived observations. Derived from a Patsnap search on Temperature & Thermal Sensors Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
Players

Who is filing, and where the momentum has gone quiet

The ranked leaders span medical devices, industrial IoT and consumer electronics — a reflection of how broadly temperature sensing gets embedded into other systems rather than filed as a standalone sensor category.

Leader
647
records

A single leader, no runaway gap to the field

The top-ranked assignee holds 647 records against a fifth-place figure of 409 and a tenth-place figure of 291 — a gradual taper, not a cliff.

Fifth place: 409 records
Momentum
-100%
YoY, several leaders

Recent-year activity has gone quiet across several top filers

Multiple assignees among the ranked leaders show zero filings in the latest year, down from prior activity, while others that still filed show sharp year-on-year declines of 67-86%.

Publication lag affects the newest year most
Collaboration
12
strongest co-assignee pair

Co-filing is limited to a handful of tight pairings

Only ten co-assignee pairs appear in the data, with the strongest linking a corporate assignee to a named individual inventor twelve times — evidence of inventor-led filing programmes rather than broad joint ventures.

10 co-assignee pairs total
🔍
Under-claimed branches worth a closer look
These sub-areas show thinner filing density relative to the core sensing claims, based on the IPC composition and citation patterns in this dataset.
Ex vivo temperature compensation for wearable analyte sensorsHeat-flux sensing in closed-loop industrial controlRadiation/light-based temperature measurement (G01J overlap)Non-electric variable control tied to thermal feedback (G05D)Calibration-reference drift correction in multi-sensor arrays
Rank all filers by momentum →
Recent-year filing momentum by assignee
AssigneeRecent yearYoY
Strong Force IoT Portfolio 2016 LLC1-67%
Dexcom, Inc.1-86%
Intel Corp1-75%
Deka Products LP0-100%
Qualcomm Inc0-100%
Honeywell International Inc0
International Business Machines Corporation (IBM)0
Johnson Controls Technology Company0-100%
Source: Patsnap Eureka. Assignee-level momentum. Derived from a Patsnap search on Temperature & Thermal Sensors Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
What's Next

Where to take this analysis

The dataset points to next steps for teams deciding whether to file, license or design around existing claims.

Map claim scope against the top-ranked portfolios

With concentration this low, freedom-to-operate work should focus on specific claim language in the leading few hundred records rather than assuming one or two companies control the field.

Explore assignee portfolios in Eureka

Track the under-claimed branches before they fill in

Thermal feedback in non-electric control systems and radiation-based temperature measurement show thinner density than core diagnostic claims, which narrows the window for a defensible first-mover filing.

Run a white space search in Eureka

Watch the 2025-2026 filings as they publish

Because publication lags filing by roughly 18 months, the apparent slowdown in the newest years should be revisited once those cohorts finish publishing.

Set a filing alert in Eureka
Source: Patsnap Eureka. Forward-looking reading of the same dataset. Derived from a Patsnap search on Temperature & Thermal Sensors Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP
FAQ

Common questions about temperature and thermal sensor patents

Answers are grounded in the same dataset. Derived from a Patsnap search on Temperature & Thermal Sensors Patent Landscape covering 2015–2026, data cut-off 2026-08-31. Counts reflect published records only and shift as new filings publish.Run this in Eureka MCP

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Disclaimer. This page is generated from Patsnap Eureka data drawn from a limited snapshot of global patent and scientific-literature records, and is provided for general information and reference only.

Patent data carries inherent limitations: recent filings (typically the most recent 18–24 months) are under-counted due to standard publication lag; counts may be reported at either a patent-family or a patent-record basis and are not always directly comparable; classification, applicant-name, and citation data may contain errors, duplicates, or omissions; and the underlying search query defines and constrains the scope shown. As a result, the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.

Nothing on this page constitutes an exhaustive prior-art, novelty, freedom-to-operate, or validity search, nor does it constitute legal, financial, investment, or professional advice, and it should not be relied upon as such. Any patent, commercial, or strategic decision should be verified independently and reviewed with qualified patent, legal, and domain professionals. Patsnap makes no warranties, express or implied, as to the accuracy, completeness, or fitness for any particular purpose of the information presented.

Machine translation. Assignee and organisation names originally recorded in Chinese, Japanese or Korean have been rendered into English by an AI translation step so that the tables stay readable. These renderings are best-effort and may not match a company's registered English name; the original name is what the underlying patent record carries, and it is what any Eureka query launched from this page uses.