Thermal Design for Multi Die Packages Patents: Top Companies, Trends 2026
Thermal Design for Multi Die Packages: Patents, Leaders and Where Filing Concentrates
77.3% of all 119 records sit with just five assignees, and 97.5% with ten — this is a field with a narrow claim owner, not a crowded one. Filings peaked at 8 in 2018; the 2026 count is partial by definition since publication typically lags filing by around 18 months, so recent years understate actual filing activity rather than showing a real decline.
- 1INTEL CORP52
- 2NANOCONDUCTION14
- 3MOMENTIVE PERFORMANCE MATERIALS QUARTZ INC9
- 4DANGELO CARLOS9
- 5THE PROVOST FELLOWS FOUNDATION SCHOLARS AND THE OTHER MEMBERS OF BOARD OF THE COLLEGE OF THE HOLY AND UNDIVIDED TRINITY OF QUEEN ELIZABETH NEAR DUBLIN8
See the full thermal design for multi die packages analysis in Eureka
- The complete ranking, not just the top five
- Every IPC branch with its share of the corpus
- The most-cited records, and where claim space is still thin
Common questions on thermal design patents for multi-die packages
Who are the leading patent holders in multi-die package thermal design?
The dataset behind this page ranks 37 companies, and the field is highly concentrated: the leading assignee holds 52 of the 119 records in scope, and the top five combined account for 77.3% of all records. That means most of the active claim space traces to a small number of portfolios rather than being spread across many competitors. A freedom-to-operate review in this space should prioritise the leading few assignees’ specific claims before broader searching.
What technical areas are most heavily patented in this field?
Semiconductor device structure (IPC class H01L) appears in 83.2% of the 119 records, making it the dominant claim category, with narrower device-integration classes H10W and H10P appearing in 44.5% and 22.7% respectively. Materials and discrete thermal hardware classes — B32B laminates, F28F heat exchangers, H05K assemblies, B82Y nanotechnology and C09K materials — each appear in under 11% of records. That gap suggests device-and-package integration claims are dense while discrete hardware and materials claims remain comparatively open.
Is patent filing activity in multi-die package thermal design increasing or slowing down?
Filings peaked at 8 records in 2018 and the most recent years show lower counts, but this should not be read as a declining field. Publication typically lags filing by around 18 months, so the last one to two years in any trend chart are understated by construction, and a computable growth rate is not available for the most recent complete years in this dataset. The safer read is that current filing activity is not yet fully visible in the published record.
Disclaimer. This analysis is based on Patsnap Eureka data drawn from a limited snapshot of global patent records and is provided for general information and reference only. Patent data carries inherent limitations — recent filings are under-counted because of publication lag, counts may be on a record or family basis, classification and applicant-name data may contain errors or duplicates, and the underlying search query defines the scope shown — so the analysis may be incomplete or inaccurate and may not reflect the full technology landscape.
Nothing here is an exhaustive prior-art, novelty, freedom-to-operate or validity search, nor does it constitute legal, financial or professional advice, and it should not be relied upon as such. Verify independently and review with qualified patent and legal professionals before acting on it.
Method: Filing trend and technology composition. Derived from a Patsnap search on Thermal Design for Multi Die Packages covering 2015–2026, data cut-off 2026-07-31. Counts reflect published records only and shift as new filings publish. Every share divides by all records in scope. Data: Patsnap Eureka. See the full landscape report.